Preparation method of recombined wood
A technology for recombining wood and wood veneer, which is applied in wood treatment, impregnating wood, manufacturing tools, etc. It can solve the problems of poor waterproof performance and low bond strength, and achieve the effect of improving bond strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0029] The invention provides a method for preparing recombined wood, comprising the following steps:
[0030] a) The methyl silicate modified phenolic resin glue is impregnated in the wood veneer, and dried to obtain a sizing veneer;
[0031] B) impregnating the unmodified phenolic resin glue into the described primary sizing veneer, drying to obtain the secondary sizing veneer;
[0032] c) Molding the secondary sized veneer to obtain recombined wood.
[0033] In the present invention, the methyl silicate modified phenolic resin glue is first impregnated into the wood veneer. Wherein, the thickness of the wood veneer is preferably 0.5-2mm, specifically 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm. In the present invention, before impregnating, the wood veneer is preferably first subjected to alkali treatment, and the specific treatment steps include:
[0034] The wood veneer is alkali-cooked in an alkaline co...
Embodiment 1
[0051] The preparation technology of silicon-modified phenolic resin glue is: 100 parts of phenol, 140 parts of 36.7wt% formaldehyde aqueous solution, 6 parts of 32wt% sodium hydroxide aqueous solution, 30 parts of water, in the 500ml four parts that spherical condenser, thermometer and stirring device are housed Add metered phenol and sodium hydroxide aqueous solution into the flask, stir at 40°C for 40 minutes, then add formaldehyde solution dropwise, raise the temperature to 50°C and stir for 100 minutes, continue to raise the temperature to 70°C and stir for 100 minutes, and finally raise the temperature to 80°C Stir at constant temperature for 60 minutes, add water and 2 parts of sodium methyl silicate, and cool to room temperature to obtain silicon-modified phenolic resin glue; the viscosity of silicon-modified phenolic resin glue is 1cps (25°C), and the content of free formaldehyde is 0.25wt%. The content of phenol is 2.5wt%.
[0052] The preparation process of phenolic...
Embodiment 2
[0055] The preparation technology of silicon-modified phenolic resin glue is: 100 parts of phenol, 150 parts of 36.7wt% formaldehyde aqueous solution, 18 parts of 32wt% sodium hydroxide aqueous solution, 30 parts of water, in the 500ml four parts that spherical condenser, thermometer and stirring device are housed Add metered phenol and sodium hydroxide aqueous solution to the flask, stir at 40°C for 60 minutes, then add formaldehyde solution dropwise, raise the temperature to 50°C and stir for 140 minutes, continue to heat up to 70°C and stir for 150 minutes, and finally raise the temperature to 80°C Stir at constant temperature for 120 minutes, add water, 5 parts of sodium methyl silicate, and 5 parts of potassium methyl silicate, and cool to room temperature to obtain silicon-modified phenolic resin glue; the viscosity of silicon-modified phenolic resin glue is 12cps (25°C), free The content of formaldehyde is 0.12wt%, and the content of free phenol is 1.2wt%.
[0056] The ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
water absorption | aaaaa | aaaaa |
water absorption | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com