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Current-assisted photon demodulation type pixel unit, back-illuminated image sensor chip, imaging system, forming method and measuring and calculating method

A pixel unit, current technology, applied in the field of image processing, can solve the problems of low measurement accuracy, low demodulation bandwidth, low responsivity, etc.

Pending Publication Date: 2019-05-28
光微信息科技(合肥)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides a current-assisted photon demodulation type pixel unit, a back-illuminated image sensor chip, an imaging system, a method for forming a current-assisted photon demodulation type pixel unit, and a method for measuring and calculating depth information, which can be used to solve the current time-of-flight principle. The 3D imaging system has the problems of low responsivity, low demodulation bandwidth and low measurement accuracy, which cannot meet the requirements of specific occasions

Method used

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  • Current-assisted photon demodulation type pixel unit, back-illuminated image sensor chip, imaging system, forming method and measuring and calculating method

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Experimental program
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Embodiment 1

[0038] see figure 1 with figure 2 A current-assisted photon demodulation pixel unit includes: a substrate 10 and a photodetector 20 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201 and a second voltage signal output module 202 .

[0039] The photodiode PD is disposed in the substrate 10 for accumulating charges in response to reflected light incident on the photodiode PD. The first voltage signal output module 201 is used to convert the charge accumulated in the photodiode PD into a voltage signal, which includes a first switch, the control terminal of the first switch receives the control signal, and the input terminal of the first switch is connected to the photodiode PD , the output terminal of the first switch outputs the first voltage signal when the control terminal of the first switch receives the control signal. The second voltage signal output module 202 is used to convert the charge accumulated in the photodiode PD into a...

Embodiment 2

[0053] see Figure 2 to Figure 5 , the current-assisted photon demodulation type pixel unit includes: a substrate 10 , a photodetector 20 , a light shielding layer 30 and a microlens 40 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201, a second voltage signal output module 202, a first reset transistor RST1, a first capacitor C1, a first source follower transistor SF1, and a second reset transistor RST2 , the second capacitor C2 and the second source follower transistor SF2.

[0054] read on figure 2 and image 3 , the substrate 10 includes: a first region 101 , a second region 102 and a deep trench isolation structure 103 . Wherein, the back side of the substrate 10 is set in the first region 101 , and the front side of the substrate 10 is set in the second region 102 .

[0055] In this embodiment, the current-assisted photon demodulation type pixel unit adopts a back-illuminated CMOS process, and the light-receiving surface of t...

Embodiment 3

[0086] see Figure 1 to Figure 6 , the back-illuminated image sensor chip includes: a pixel array 601 , a pixel driving unit 602 , a readout unit 603 and a control unit 604 .

[0087] Pixel array 601, which is used to output voltage signals; pixel driving unit 602, which is used to output control signals to control the operation of pixel units in pixel array 601, which is connected to pixel array 601; readout unit 603, which is used to read and output The voltage signal output by the pixel units in the pixel array 601 is connected to the pixel array 601 ; the control unit 604 is connected to and controls the pixel array 601 , the pixel driving unit 602 and the readout unit 603 .

[0088] The current-assisted photon demodulation pixel unit includes: a substrate 10 , a photodetector 20 , a light shielding layer 30 and a microlens 40 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201, a second voltage signal output module 202, a first rese...

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Abstract

The invention provides a current-assisted photon demodulation type pixel unit, a back-illuminated image sensor chip, an imaging system, a forming method and a depth information measuring and calculating method, wherein the pixel unit comprises a substrate, a photoelectric detector, a first voltage signal output module and a second voltage signal output module; the first voltage signal output module comprises a first switch; the first switch outputs a voltage signal when receiving a control signal; the second voltage signal output module comprises a second switch; the second switch outputs a voltage signal when receiving a control signal; wherein the control signal sent to the first switch is set to be the same as the phase of modulated light; the control signal sent to the second switch isset to be complementary with the phase sent to the modulated light; and voltage signals output by the first voltage signal output module and second voltage signal output module under different phasesare obtained after receiving reflected light; and calculating is carried out to obtain the flying time of the modulated light. According to the invention, the problems of low response degree, low demodulation bandwidth and low measurement precision of the pixel unit so can be solved as to meet the requirements of specific occasions.

Description

technical field [0001] The present application relates to the field of image processing, and in particular to a current-assisted photon demodulation pixel unit, a back-illuminated image sensor chip, an imaging system, a method for forming a current-assisted photon demodulation pixel unit, and a depth information measurement method. Background technique [0002] Artificial three-dimensional (3D) vision has always been regarded as a bridge between intelligent systems and the outside world, which enables machines to see the world we see in three-dimensional space, and many 3D acquisition systems have been developed over the years, including stereo vision , structured light projection and laser scanners, unfortunately, none of these can reliably collect real-time 3D data. The ranging system based on the time-of-flight (TOF) principle provides an elegant solution, which immediately obtains the complete three-dimensional information of the target by emitting modulated light and de...

Claims

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Application Information

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IPC IPC(8): G01S7/481G01S17/89G01S17/08G01S7/486
Inventor 徐渊廖嘉雯杨俊伟黄志宇
Owner 光微信息科技(合肥)有限公司