Current-assisted photon demodulation type pixel unit, back-illuminated image sensor chip, imaging system, forming method and measuring and calculating method
A pixel unit, current technology, applied in the field of image processing, can solve the problems of low measurement accuracy, low demodulation bandwidth, low responsivity, etc.
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Embodiment 1
[0038] see figure 1 with figure 2 A current-assisted photon demodulation pixel unit includes: a substrate 10 and a photodetector 20 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201 and a second voltage signal output module 202 .
[0039] The photodiode PD is disposed in the substrate 10 for accumulating charges in response to reflected light incident on the photodiode PD. The first voltage signal output module 201 is used to convert the charge accumulated in the photodiode PD into a voltage signal, which includes a first switch, the control terminal of the first switch receives the control signal, and the input terminal of the first switch is connected to the photodiode PD , the output terminal of the first switch outputs the first voltage signal when the control terminal of the first switch receives the control signal. The second voltage signal output module 202 is used to convert the charge accumulated in the photodiode PD into a...
Embodiment 2
[0053] see Figure 2 to Figure 5 , the current-assisted photon demodulation type pixel unit includes: a substrate 10 , a photodetector 20 , a light shielding layer 30 and a microlens 40 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201, a second voltage signal output module 202, a first reset transistor RST1, a first capacitor C1, a first source follower transistor SF1, and a second reset transistor RST2 , the second capacitor C2 and the second source follower transistor SF2.
[0054] read on figure 2 and image 3 , the substrate 10 includes: a first region 101 , a second region 102 and a deep trench isolation structure 103 . Wherein, the back side of the substrate 10 is set in the first region 101 , and the front side of the substrate 10 is set in the second region 102 .
[0055] In this embodiment, the current-assisted photon demodulation type pixel unit adopts a back-illuminated CMOS process, and the light-receiving surface of t...
Embodiment 3
[0086] see Figure 1 to Figure 6 , the back-illuminated image sensor chip includes: a pixel array 601 , a pixel driving unit 602 , a readout unit 603 and a control unit 604 .
[0087] Pixel array 601, which is used to output voltage signals; pixel driving unit 602, which is used to output control signals to control the operation of pixel units in pixel array 601, which is connected to pixel array 601; readout unit 603, which is used to read and output The voltage signal output by the pixel units in the pixel array 601 is connected to the pixel array 601 ; the control unit 604 is connected to and controls the pixel array 601 , the pixel driving unit 602 and the readout unit 603 .
[0088] The current-assisted photon demodulation pixel unit includes: a substrate 10 , a photodetector 20 , a light shielding layer 30 and a microlens 40 . The photodetector 20 includes: a photodiode PD, a first voltage signal output module 201, a second voltage signal output module 202, a first rese...
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