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A kind of low melting point in-sn-bi alloy solder and preparation method

An in-sn-bi, alloy solder technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve problems such as base material failure, PET deformation, packaging application restrictions, etc., to achieve low cost, cost reduction, The effect of toughness

Active Publication Date: 2021-08-06
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recently, for various temperature-sensitive applications, polymeric substrates such as polyethylene terephthalate (PET) and polycarbonate (PC) substrates exhibit considerable Thermal damage caused by PET deformation and failure of the substrate, resulting in restrictions on the application of In-Sn eutectic solder to flat panel displays and semiconductor packaging applications

Method used

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  • A kind of low melting point in-sn-bi alloy solder and preparation method
  • A kind of low melting point in-sn-bi alloy solder and preparation method
  • A kind of low melting point in-sn-bi alloy solder and preparation method

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Embodiment 1

[0019] A kind of low-melting point In-Sn-Bi alloy solder, this alloy solder represents by weight, comprises following composition:

[0020] In 48 parts, Sn 44 parts, Bi 4 parts.

[0021] The melting point of the solder alloy in this embodiment is 100.5 degrees Celsius.

[0022] The invention also discloses a method for preparing a low-melting-point In-Sn-Bi alloy solder, which comprises the following process steps:

[0023] S1. Mixing: choose the powders of In, Sn, and Bi, and mix evenly according to the formula ratio of 48 parts of In, 44 parts of Sn, and 4 parts of Bi;

[0024] S2. Put the powder into an alumina crucible, then heat up to 400 degrees Celsius, and then keep melting at 400 degrees Celsius for 15 minutes;

[0025] S3. Gas atomization: atomize the molten liquid to form small droplets, the atomization pressure is 75 bar, the atomization gas is helium, after atomization, In-Sn-Bi solder powder is obtained;

[0026] S4. Preparation of solder paste: The gas-atomiz...

Embodiment 2

[0029] In this embodiment, the material ratio of the alloy solder is 48.5 parts of In, 47 parts of Sn, and 4.5 parts of Bi. The alloy material has a melting point of 100.2 degrees Celsius. The rest are the same as those in Embodiment 1 and will not be described in detail.

Embodiment 3

[0031] In this embodiment, the material ratio of the alloy solder is 49.5 parts of In, 45.5 parts of Sn, and 5 parts of Bi. The alloy material has a melting point of 99.1 degrees Celsius. The rest are the same as those in Embodiment 1 and will not be described in detail.

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Abstract

The invention relates to the technical field of alloy materials, in particular to a low melting point In-Sn-Bi alloy solder and a preparation method thereof. A low-melting-point In-Sn-Bi alloy solder, the alloy solder is expressed in parts by weight, and includes the following components: 48-51.5 parts of In, 44-47.5 parts of Sn, and 4-6 parts of Bi. The melting point of the In-Sn-Bi alloy solder of the present invention is 96.8-100.5 degrees Celsius, which is nearly 20 degrees Celsius lower than the melting point of the In-Sn eutectic solder alloy. The reduction of In content reduces the cost, and the addition of Bi elements improves the alloy Wetting and spreading ability, and the Bi element in the solder reacts with the In element to form BiIn IMC. The existence of BiIn IMC makes other IMC (In 3 Sn and In 0.2 sn 0.8 ) growth at the interface of In-rich and Sn-rich phases is suppressed, which makes the microstructure of In‑Sn‑Bi solder finer.

Description

technical field [0001] The invention relates to the technical field of alloy materials, in particular to a low melting point In-Sn-Bi alloy solder and a preparation method thereof. Background technique [0002] With the rapid development of electronic products towards lightness, thinness, shortness, smallness, and high functionality, flexible electronics (or flexible circuits) are very flexible and convenient due to their light weight, portability, high bendability, and potential foldable characteristics. Used in various electronic packaging and interconnection fields. Among them, anisotropic conductive films (ACFs), polyethylene terephthalate (PET), and polycarbonate (PC) substrates have been widely used as interconnect materials in flat panel displays and semiconductor packaging applications. Flexible electronics use solder to mount functional devices onto heat-sensitive flexible organic substrates such as polyimide or transparent conductive polyester films. Flexible sub...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 李玉龙王志良李越王文琴李学文
Owner NANCHANG UNIV