Composite modified sesame protein adhesive, and preparation method thereof

A technology of composite modification and protein glue, which is applied in the field of composite modified sesame protein adhesive and its preparation, can solve the problems of low bonding strength and poor water resistance of vegetable protein adhesives, achieve high bonding strength and increase additional output value , good water resistance

Inactive Publication Date: 2019-05-31
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Vegetable protein adhesives are favored by more and more researchers because of their unique advantages-environmental protection and non-toxicity. At present, due to the highest soybean yield and the mature production technology of soybean protein, it is easier to prepare plant protein adhesives from soybean protein , other types of vegetable protein adhesives are still rare, and vegetable protein adhesives currently have problems such as poor water resistance and low bonding strength.

Method used

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  • Composite modified sesame protein adhesive, and preparation method thereof
  • Composite modified sesame protein adhesive, and preparation method thereof

Examples

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preparation example Construction

[0020] The invention provides a kind of preparation method of composite modified sesame protein adhesive, comprising the following steps:

[0021] (1) carrying out the first stirring treatment with the sesame protein and the urea solution, to obtain the stirred liquid;

[0022] (2) The stirring solution and the metal oxide are subjected to a second stirring treatment to obtain a composite modified sesame protein adhesive; the mass of the metal oxide is 4% to 12% of the sesame protein mass.

[0023] In the present invention, the sesame protein and urea solution are subjected to the first stirring treatment to obtain the stirred liquid. In the present invention, the sesame protein is extracted from sesame cake, which is a by-product of a sesame oil processing enterprise. The present invention has no special requirements on the source of the sesame protein. Commercially available sesame protein or self-prepared can be. The invention uses the sesame protein to prepare the vegeta...

Embodiment 1

[0032] Weigh 10g of sesame protein, add it to 80mL 3mol / L urea solution, stir at 25°C for 20min, add a small amount of tributyl phosphate while stirring, then add zinc oxide, the amount of zinc oxide added is the amount of sesame protein 8% (ie 0.8g) of urea-zinc oxide composite modified sesame protein adhesive was obtained under the condition of 25° C. for 3 hours, and the solid content of the adhesive was 28.2%.

[0033] The prepared urea-zinc oxide composite modified sesame protein adhesive was used to prepare plywood, and the water resistance of plywood was reflected by measuring the wet bonding strength of plywood. Specific steps are as follows:

[0034] Prepare two poplar veneers, and evenly coat the compound modified adhesive on the surface of one poplar veneer, the coating amount is 240g / cm 2 , and then two pieces of poplar veneers are hot-pressed and bonded to obtain a plywood. The hot-pressing temperature is 140° C. and the pressure is 1.2 MPa. Saw the plywood in a...

Embodiment 2

[0037] Other conditions are the same as in Example 1, only the addition of zinc oxide is replaced by 4% (i.e. 0.4g) of the addition of sesame protein to obtain the urea-zinc oxide composite modified sesame protein adhesive, the solid content of the adhesive was 28.2%.

[0038] The plywood was prepared according to the method of Example 1 and the wet bonding strength of the plywood was tested. The results showed that the wet bonding strength of the plywood was 1.01MPa, which was greater than the national requirement for Class II plywood (0.7MPa).

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Abstract

The invention provides a composite modified sesame protein adhesive, and a preparation method thereof, and belongs to the field of adhesive. The preparation method comprises following steps: sesame protein and a urea solution are subjected to primary stirring processing, an obtained stirred solution and a metal oxide are subjected to secondary stirring processing so as to obtain the composite modified sesame protein adhesive; the mass amount of the metal oxide accounts for 4 to 12% of the mass amount of the sesame protein. According to the preparation method, sesame protein is taken as a raw material, novel idea is provided for deep utilization of sesame protein; urea and the metal oxide are adopted for composite modification of sesame protein, so that the obtained composite modified sesame protein adhesive is excellent in water resistance, high in adhesion strength and solid content; in using process, no formaldehyde is released; the composite modified sesame protein adhesive is a novel environment-friendly wood adhesive; a problem in the prior art that formaldehyde is released in adhesive using process is solved; and the feasibility in practical production is high.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a composite modified sesame protein adhesive and a preparation method thereof. Background technique [0002] At present, the most widely used wood adhesives on the market are "trialdehyde" glues (urea-formaldehyde resins, phenolic resins, and melamine-formaldehyde resins). These adhesives are derived from petrochemical by-products and are popular for their low price, wide availability, high solids content, and strong water resistance. With the depletion of oil resources and the enhancement of people's awareness of environmental protection, people pay more and more attention to the negative problems brought by "trialdehyde" adhesive tape. "Trialdehyde" glue not only pollutes the environment during use, but also releases formaldehyde, phenol and other gases, endangering human health. Formaldehyde ranks second on the priority list of toxic chemicals in my country. Formaldehyde h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J189/00C09J11/06C09J11/04
Inventor 汪学德魏晓博马宇翔秦召
Owner HENAN UNIVERSITY OF TECHNOLOGY
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