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An all-inorganic UV LED wafer-level packaging method

A wafer-level packaging and LED packaging technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of modern packaging requirements for difficult-to-UV LEDs, high packaging costs, and low process integration, and meet long-term reliability requirements. , The effect of reducing packaging cost and improving packaging integration

Active Publication Date: 2020-12-01
武汉高星紫外光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing UV LED packaging process is still to implement SMT, wire bonding, glass cover bonding and other processes on the UV LED chip respectively. There are many process steps, low process integration and high packaging cost, so it is difficult to meet the modernization requirements of UV LEDs. Packaging requirements

Method used

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  • An all-inorganic UV LED wafer-level packaging method
  • An all-inorganic UV LED wafer-level packaging method

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Embodiment 1

[0031] see figure 1 , the embodiment 1 provides a method for all-inorganic ultraviolet LED wafer-level packaging, which may include the following steps as an example:

[0032] Step 1, first prepare the glass slurry, mix the glass powder, ceramic powder and binder and fully stir, the components are set as follows: the glass powder is selected from low-melting point borosilicate glass and its dosage is 1% of the total weight of the slurry 70%, the ceramic powder is made of alumina material and its dosage is 20% of the total weight of the slurry, and the particle size of the glass powder and ceramic powder is 5-10 μm, and the binder is a mixture of ethyl cellulose and terpineol , and its dosage is respectively 2% and 8% of the total weight of the slurry; then a quartz glass sheet with a thickness of 0.5mm is selected as the glass cover plate 11, and a plurality of circular glass plates are printed on the glass cover plate 11 by 3D printing technology The slurry ring, and then pl...

Embodiment 2

[0038] see figure 2 , this embodiment 2 provides a method for all-inorganic ultraviolet LED wafer-level packaging, which may include the following steps as an example:

[0039] Step 1, first prepare the glass slurry, mix the glass powder, ceramic powder and binder and fully stir, the components are set as follows: the glass powder is selected from low-melting point borosilicate glass and its dosage is 1% of the total weight of the slurry 65%, the ceramic powder is made of alumina material and its dosage is 20% of the total weight of the slurry, and the particle size of the glass powder and ceramic powder is 5-10 μm, and the binder is a mixture of ethyl cellulose and terpineol , and its dosage is respectively 5% and 10% of the total weight of the slurry; then select a quartz glass sheet with a thickness of 0.5mm as the glass cover plate 21, and print a square glass slurry on the glass cover plate 21 by multiple screen printing The material ring is dried at 200°C for 30 minutes ...

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Abstract

The invention belongs to the technical field of semiconductor manufacturing, and discloses a full-inorganic ultraviolet LED wafer-level package method. The full-inorganic ultraviolet LED wafer-level package method comprises the steps of firstly, forming a plurality of glass paste rings on a glass cover plate by a printing or 3D printing technology, and obtaining a plurality of glass cavity structures by low-temperature sintering; secondly, surface-mounting a plurality of ultraviolet LED chips onto a cooling substrate; thirdly, achieving reliable bonding of the glass cavities in the glass coverplate and the cooling substrate by inorganic paste or a metal welding material; and finally, cutting to obtain a full-inorganic ultraviolet LED package product. The invention also discloses a corresponding ultraviolet LED package structure. By the full-inorganic ultraviolet LED wafer-level package method, the problems of ultraviolet aging and failure of an organic package material are effectivelyprevented, the long-term reliability of an ultraviolet LED device is improved, the ultraviolet LED package integration is improved, and the package cost is reduced.

Description

technical field [0001] The invention belongs to the related field of semiconductor manufacturing technology, and more specifically relates to an all-inorganic ultraviolet LED wafer-level packaging method. Background technique [0002] Compared with traditional ultraviolet light sources such as mercury lamps, ultraviolet LEDs have many advantages such as mercury-free environmental protection, low power consumption, and controllable wavelength. Ultraviolet LEDs can be divided into shallow ultraviolet LEDs (>300nm) and deep ultraviolet LEDs (≤300nm) according to different light emitting wavelengths. At present, light ultraviolet LEDs have been widely used in the fields of ink printing, resin curing, and inspection and identification. With the development of ultraviolet LED technology, deep ultraviolet LEDs will have broad application in fields such as sterilization and disinfection, water purification, medical cosmetology, and biochemical detection. application prospects. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56
Inventor 彭洋柳星星陈明祥
Owner 武汉高星紫外光电科技有限公司
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