Self-repairing method for phased-array antenna microsystem integrated packaging structure

Abstract

A self-repairing method of a phased array antenna microsystem integrated packaging structure disclosed by the invention has high packaging reliability and does not damage pins. According to the technical scheme, arrays are manufactured on the upper face and at the bottom of a packaging substrate where active components are packaged, wafer-level packaging of all the components is achieved through interconnection of welding spot network welding ball arrays and embedded wafer-level ball grid arrays, electric signal transmission between the packaging substrates is achieved through layer-by-layer interconnection to form a microsystem packaging body for packaging a microsystem integrated component; repairable packaging carriers are arranged at the two ends of the microsystem packaging body, capillary filling pipelines communicated with channels of all layers of packaging substrates are manufactured on the repairable packaging carriers, and when the interconnection welding spots of the microsystem integrated assembly are in a defect in the service process, liquid metal supplements the interconnection welding spots through a liquid metal self-filling interface arranged on the repairable packaging carriers, and the liquid metal is molded after injection and is integrated with the welding spots.

Description

technical field [0001] The invention relates to a self-repairing system packaging method that can be filled with liquid metal, in particular to a self-repairing method for a phased array antenna microsystem integrated packaging structure. Background technique [0002] Microsystem integration products can improve their reliability and adaptability to special environments such as radiation resistance, and are one of the technical approaches to focus on oceans, space, and electromagnetics. Microelectronic packages and chips (Chip or die) are combined into a microelectronic device (Device) through packaging technology (Packaging), usually packaged to provide electrical pathways, heat dissipation pathways, mechanical support, environmental protection, etc. for the chip (or die), Therefore, microelectronic packaging is one of the two basic components of microelectronic devices, and many reliability performances of devices are determined by the performance of packaging. Microelect...

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Problems solved by technology

The main defects of solder joints are: void, desoldering (open circuit), bridging (short circuit), internal cracks in solder balls, disturbance of solder joints, cold soldering, incomplete melting of solder balls, displacement (solder balls are not aligned with PCB pads), Solder beads, etc.

Nevertheless, in practical applications, friction, collision, bending, etc. will inevitably bring mechanical damage such as scratches, creases, and cracks to flexible electronic devices, and these damages may cause the electrical performance of the device to deteriorate or even fail, thereby shortening the life of the flexible electronic device. Device life

For example, for a plate capacitor with a carbon nanotube conductive network as an electrode, when a crack is generated on the electrode, the conductivity of the electrode decreases due to the blockage of the carbon nanotube conductive network, resulting in a large decrease in the capacitance of the device; For piezoresistive sensors that use materials or conductive materials / polymer composites as sensitive materials, when a crack occurs in the material, the resistance of the material increases greatly, and it cannot be used as a sensitive material for the sensor; for wearable electronic devices, tiny cracks It will continue to expand during human movement, and even cause device breakage and functional failure

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