Controlled release microcapsule for adhesive and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SOUTH CHINA NORMAL UNIVERSITY
- Publication Date
- 2019-06-28
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of adhesives, and in particular relates to a controllable-release microcapsule for adhesives and a preparation method thereof. Background technique
[0002] Adhesives are widely used in the construction industry, wood industry, shoe industry, paper products and packaging, automotive electronics industry and other fields. They are easy to use and have high economic benefits, and play an important role in industrial production and daily life. However, at present, it is mainly based on direct coating and gluing of a single-component adhesive to achieve bonding, or multiple components are mixed and cross-linked to achieve bonding. This is very unfavorable for processes that require large-area bonding or require flexible bonding. Therefore, people have proposed a controllable method of cross-linking and bonding that can only occur under specific conditions-microcapsule technology. Microcapsule technology refers...