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Laser processing apparatus

A laser processing and laser technology, applied in laser welding equipment, metal processing equipment, optics, etc., can solve the problems of mask component damage, mask component scorch, etc., and achieve the effect of suppressing damage

Inactive Publication Date: 2019-06-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when a high output laser oscillator is used, the mask member absorbs the laser light and becomes burnt, causing damage to the mask member

Method used

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  • Laser processing apparatus
  • Laser processing apparatus
  • Laser processing apparatus

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Experimental program
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Effect test

Embodiment Construction

[0023] First, a to-be-processed object of the laser processing apparatus of this embodiment is demonstrated. image 3 It is a perspective view schematically showing laser processing of the workpiece 1 . The workpiece 1 is, for example, a substrate made of a material such as silicon, SiC (silicon carbide), or other semiconductors, or a material such as sapphire, glass, or quartz. The workpiece 1 may be, for example, a molded resin substrate in which a substrate on which devices are formed is sealed with a resin, or may be a laminated substrate of a semiconductor wafer and a resin.

[0024] The front surface of the workpiece 1 is divided into a plurality of regions by a plurality of intersecting processing lines (lanes) 3 , and devices 5 such as ICs (Integrated Circuits) are formed in each of the divided regions. Finally, the workpiece 1 is divided along the planned processing line 3 to form individual device chips.

[0025] The device 5 has functional layers including a plura...

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PUM

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Abstract

The invention provides a laser processing apparatus capable of preventing occurrence of damage due to blocking of the laser beam with the mask member which blocks part of the laser beam. The laser processing apparatus includes a laser oscillator oscillating a laser beam, a light condensing lens condensing the laser beam oscillated by the laser oscillator, and a mask member disposed between the laser oscillator and the light condensing lens and blocking part of the laser beam oscillated by the laser oscillator, in which the mask member includes a transmitting portion through which light passes,and a reflecting film surrounding the transmitting portion and reflecting the part of the laser beam.

Description

technical field [0001] The present invention relates to a laser processing device. Background technique [0002] In device chips such as IC chips on which semiconductor devices are mounted, a so-called Low-k film having a low dielectric constant has been used in recent years as an interlayer insulating film between wiring layers used in the device. When a Low-k film is used for the interlayer insulating film, the parasitic capacitance formed between wiring layers can be reduced, and the throughput of the device chip can be improved. As the Low-k film, there are known inorganic films such as SiOF and SiOB (borosilicate glass), and organic films such as polyimide films and p-xylene films, which are polymer films. [0003] The device chips are formed by dividing the wafer along a plurality of to-be-processed lines set on the front surface of the disc-shaped wafer made of semiconductors so as to divide each device. Dividing of the wafer is carried out by cutting the wafer alon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/364B23K26/064B23K26/066
CPCB23K26/066H01L21/67092B23K26/38B23K2103/56G02B27/18G03F7/70191H01L21/78B23K26/0648B23K26/0665
Inventor 吉田侑太
Owner DISCO CORP