A composite additive for preparing low brittleness electrolytic copper foil

A composite additive and electrolytic copper foil technology, applied in the electrolysis process, electroforming, etc., can solve the problems of copper foil surface roughness, low elongation, and pole piece cannot withstand rapid charge and discharge, etc., to achieve good brightness and compactness properties, high tensile strength and elongation

Active Publication Date: 2021-03-23
山东金盛源电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When thiourea reaches 12mg / L, the copper layer is bright, but it is difficult to peel off from the cathode plate, because the copper layer is brittle and easily breaks into fine fragments. When a small amount (3-9mg / L) of thiourea is added, The roughness of the copper foil decreases obviously, and the concentration continues to increase, the roughness increases again, and the brittleness also increases significantly
[0005] The electrolytic copper foil in the prior art is not high in tensile performance and elongation, and the pole piece cannot withstand rapid charge and discharge, and is prone to cracks; the surface of the copper foil is relatively rough, and the contact area with the negative active material is not large

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Example 1: The composite additive for preparing low-brittle electrolytic copper foil is made of the following components: sodium isethionate 5 mg / L, 2-mercaptobenzimidazole (M) 6 mg / L, modified thiourea ( TU) 4 mg / L, gelatin 4 mg / L. According to the above-mentioned composite additives, the deposition process of copper foil deposition is as follows: take an electrolyte solution with a copper content of 90g / L, a sulfuric acid content of 120g / L, a chloride ion content of 25ppm, and a temperature of 50°C, and then pour it into the electrolyte solution Add the composite additive so that the flow rate of the electrolyte is 60m3 / h, and the power supply is adjusted to control the current density at 60A / dm2. React for 70 s to prepare 18 μm copper foil. After testing, the normal temperature tensile strength of the thus prepared electrolytic copper foil is 520Mpa, the normal temperature elongation is 18.6%, the 180°C tensile strength is 325Mpa, and the 180°C elongation is 12.5%. ...

Embodiment 2

[0023] Example 2: The composite additive for preparing low-brittle electrolytic copper foil is made of the following components: sodium isethionate 6.5 mg / L, 2-mercaptobenzimidazole (M) 5 mg / L, modified thiourea (TU) 5 mg / L, gelatin 6 mg / L. According to the above-mentioned composite additives, the deposition process of depositing copper foil is as follows: take an electrolyte solution with a copper content of 100g / L, a sulfuric acid content of 100g / L, a chloride ion content of 20ppm, and a temperature of 60°C, and then pour it into the electrolyte solution. Add the composite additives so that the flow rate of the electrolyte is 70m3 / h, and the power supply is adjusted to control the current density at 55A / dm2. React for 60s to prepare 18 μm copper foil. After testing, the normal temperature tensile strength of the thus-prepared electrolytic copper foil is 510Mpa, the normal temperature elongation is 17.8%; the 180°C tensile strength is 340Mpa, and the 180°C elongation is 13.2...

Embodiment 3

[0024] Example 3: The composite additive for preparing low-brittle electrolytic copper foil is made of the following components: sodium isethionate 4 mg / L, 2-mercaptobenzimidazole (M) 9 mg / L, modified thiourea ( TU) 2 mg / L, gelatin 3 mg / L. According to the above-mentioned composite additive, the deposition process of depositing copper foil is as follows: take an electrolyte solution with a copper content of 80g / L, a sulfuric acid content of 140g / L, a chloride ion content of 30ppm, and a temperature of 45°C, and then add it to the electrolyte solution. Add the composite additives so that the flow rate of the electrolyte is 40m3 / h, and the power supply is adjusted to control the current density at 65A / dm2. React for 80s to prepare 18μm copper foil. After testing, the normal temperature tensile strength of the thus prepared electrolytic copper foil is 550Mpa, normal temperature elongation=18.1%; 180°C tensile strength=352Mpa, 180°C elongation=13.0%.

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Abstract

The invention discloses a composite additive for preparing low-brittleness electrolytic copper foil, and belongs to the technical field of production of electrolytic copper foil. The composite additive comprises sodium hydroxyethyl sulfonate (PEG), 2-mercapto benzimidazole(M), modified thiourea (TU) and gelatin. According to the electrolytic copper foil produced through the additive, the normal-temperature tensile strength is larger than or equal to 480 Mpa, the normal temperature elongation is larger than or equal to 17%, 180 DEG C tensile strength is larger than or equal to 300 Mpa, and 180DEG C elongation is larger than or equal to 13%. Various properties of the electrolytic copper foil are particularly suitable for car power batteries and large-capacity mobile phone lithium batteries.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a composite additive for preparing low-brittle electrolytic copper foil. Background technique [0002] As the basic material of the electronics industry, electrolytic copper foil plays a very important role in the development of the electronics industry. Electrolytic copper foil is a deposited layer obtained by electrodeposition technology. Because of its advantages of high purity, fast deposition rate, low cost, low working temperature and simple operation, it is widely used in CCL (copper clad laminate) and PCB (printed board) industry. [0003] Additives play an important role in the preparation of electrolytic copper foil. There are many kinds of additives, and various additives play different roles in the electrodeposition process. For example, chloride ions can increase cathodic polarization and inhibit abnormal growth of metals to improve the elastic st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04
CPCC25D1/04
Inventor 盛大庆张在沛刘立柱李淑增张生华盛杰刘存利张庆霞
Owner 山东金盛源电子材料有限公司
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