Sandwich-structured high-dielectric flexible composite film and preparation method thereof

A composite film and sandwich technology, applied in chemical instruments and methods, lamination devices, rubber layered products, etc., can solve the problems of low electromechanical conversion efficiency, slow polarization reversal response, limited applications, etc., and achieve high breakdown The effect of field strength, high dielectric constant, and widening application space

Active Publication Date: 2019-07-19
SHANGHAI MARITIME UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since polyvinylidene fluoride is a ferroelectric polymer, there is a ferroelectric hysteresis phenomenon, resulting in a large coercive field, slow polarization reversal response, and low electromechanical conversion efficiency, which limits its application in flexible electronic devices.

Method used

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  • Sandwich-structured high-dielectric flexible composite film and preparation method thereof
  • Sandwich-structured high-dielectric flexible composite film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Weigh 2.5 g each of the precursor of polydimethylsiloxane and the organic solvent n-heptane, and then magnetically stir for 10 min to make them evenly mixed.

[0030] (2) Add 0.25 g of curing agent and stir magnetically for 10 min to make it evenly mixed to obtain a mixed solution with a total weight of 5.25 g.

[0031] (3) Add carbon nanotubes to the mixed solution according to the calculated mass ratio, and the obtained slurries A and B are used to prepare coatings with positive and negative dielectric constants respectively, wherein the carbon nanotubes added in the slurry A It is 0.0263g (the mass percentage of the carbon nanotubes added and the mixed solution is 0.5%), which is used to prepare the upper and lower film with a positive dielectric constant, that is, to prepare the first outer layer and the second outer layer with a positive dielectric constant. Two outer layers. In order to ensure the structural uniformity of the upper and lower films, the mass f...

Embodiment 2

[0036] (1) Weigh 2.5 g each of the precursor of polydimethylsiloxane and the organic solvent n-heptane, and then magnetically stir for 10 min to make them evenly mixed.

[0037] (2) Add 0.25 g of curing agent and stir magnetically for 10 min to make it evenly mixed to obtain a mixed solution with a total weight of 5.25 g.

[0038] (3) Add carbon nanotubes according to the calculated mass ratio, and the obtained slurry A and B are used to prepare coatings with positive and negative dielectric constants respectively, wherein slurry A adds 0.053g carbon nanotubes (the added carbon nanotubes The mass ratio of tube and mixed solution is 1%), prepare upper and lower film with positive dielectric constant, promptly be used for preparing the first outer layer and the second outer layer with positive dielectric constant; Slurry B adds 0.1624g carbon nanotubes (the mass ratio of the added carbon nanotubes to the mixed solution is 3%), and an intermediate layer film with a negative diele...

Embodiment 3

[0043] (1) Weigh the precursor of polydimethylsiloxane and the organic solvent n-heptane 2.5g, and then magnetically stir for 10min to make them evenly mixed.

[0044] (2) Add 0.25 g of curing agent and stir magnetically for 10 min to make it evenly mixed to obtain a mixed solution with a total weight of 5.25 g.

[0045] (3) Add carbon nanotubes according to the calculated mass ratio, and the obtained slurry A and B are used to prepare coatings with positive and negative dielectric constants respectively, wherein slurry A adds 0.08g carbon nanotubes (the added carbon nanotubes The mass ratio of tube and mixed solution is 1.5%), prepare upper and lower film with positive dielectric constant, namely be used to prepare the first outer layer and the second outer layer with positive dielectric constant; Slurry B adds 0.1624g carbon nanotubes (the mass ratio of the added carbon nanotubes to the mixed solution is 3%), and an intermediate layer film with a negative dielectric constant...

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Abstract

The invention discloses a sandwich-structured high-dielectric flexible composite film and a preparation method thereof. The composite film is formed by superposing three layers of structures, whereinthe three layers of structures are as follows respectively: a first outer side layer having a positive dielectric constant, a middle layer having a negative dielectric constant and a second outer sidelayer having a positive dielectric constant; the middle layer is arranged between the first outer side layer and the second outer side layer. The composite film uses organosilicone rubber as a flexible substrate and carbon nanotubes (CNTs) as a functional filler. The sandwich-structured high-dielectric flexible composite film is prepared by an in-situ polymerization method, and the composite filmhas a relatively high dielectric constant while good flexibility is guaranteed.

Description

technical field [0001] The invention relates to the technical field of preparation of composite materials, in particular to a sandwich-structured high-dielectric flexible composite film and a preparation method thereof. Background technique [0002] With the development of electronic components in the direction of high power, miniaturization, and high frequency, higher requirements are placed on the dielectric properties of capacitors. Traditional parallel plate capacitors have been difficult to meet the needs of use. At present, the common dielectric materials are ceramic dielectric and polymer dielectric. Ceramic dielectric has a high dielectric constant, but its breakdown field strength is low, and it is difficult to further increase its energy density; compared with ceramic dielectrics, polymer dielectrics have higher breakdown field strength and better flexibility, Processability, especially in the fields of flexible electronic devices and smart wearable devices, has i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B25/04B32B25/20B32B37/06
CPCB32B9/007B32B9/04B32B25/04B32B25/20B32B37/06B32B2250/40
Inventor 孙凯王宗祥范润华李晓峰信家豪汪林英李亚萍秦锦媛
Owner SHANGHAI MARITIME UNIVERSITY
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