Low dielectric glass fiber component and production method thereof
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A technology of glass fiber and manufacturing method, applied in the field of electronic information substrate materials, can solve problems such as polluting the environment
Active Publication Date: 2019-07-19
LINZHOU GUANGYUAN NEW MATERIAL TECH +1
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[0009] The technical problem to be solved by the present invention is to provide a low-dielectric glass fiber component, while ensuring that the glass has a good balance of water resistance, ...
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Embodiment 1
[0040] A low dielectric glass fiber component, by mass fraction, includes the following components:
[0041] SiO 2 :54.0%, Al 2 o 3 : 12.0%, B 2 o 3 : 25.0%, CaO: 1.0%, MgO: 5.0%, ZnO: 2.0%, TiO 2 : 0.4%, ZrO 2 : 0.5%, Bi 2 o 3 : 0.1%.
[0042] The dielectric constant is 4.9, the fiber forming temperature is 1320°C, the liquidus temperature is 1050°C, the △T is 270°C, the water solubility is 0.8%, the acid solubility is 32.9%, and the alkali solubility is 9.8%.
Embodiment 2
[0044] A low dielectric glass fiber component, by mass fraction, includes the following components:
[0045] SiO 2 :55.5%, Al 2 o 3 : 12.5%, B 2 o 3 : 22.5%, CaO: 1.5%, MgO: 4.0%, ZnO: 2.5%, TiO 2 : 0.5%, ZrO 2 : 0.5%, Bi 2 o 3 : 0.5%.
[0046] The dielectric constant is 4.8, the fiber forming temperature is 1310°C, the liquidus temperature is 1050°C, the △T is 260°C, the water solubility is 0.8%, the acid solubility is 30.8%, and the alkali solubility is 10.2%.
Embodiment 3
[0048] A low dielectric glass fiber component, by mass fraction, includes the following components:
[0049] SiO 2 :55.8%, Al 2 o 3 : 12.5%, B 2 o 3 : 21.5%, CaO: 1.7%, MgO: 3.8%, ZnO: 2.6%, TiO 2 : 1.0%, ZrO 2 : 0.5%, Bi 2 o 3 : 0.6%.
[0050] The dielectric constant is 4.7, the fiber forming temperature is 1310°C, the liquidus temperature is 1050°C, the △T is 260°C, the water solubility is 0.8%, the acid solubility is 30.4%, and the alkali solubility is 9.9%.
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Abstract
The present invention relates to the field of electronic information base plate materials, particularly to a low dielectric glass fiber component, which comprises, by mass, 54.0-57.0% of SiO2, 12.0-15.0% of Al2O3, 16.0-25.0% of B2O3, 1.0-2.5% of CaO, 2.0-5.0% of MgO, 2.0-4.0% of ZnO, 0.4-2.0% of TiO2, 0-0.5% of ZrO2, and 0.1-1.5% of Bi2O3. According to the present invention, the total amount of ROis controlled at lower than 10% by controlling the composition of SiO2, Al2O3 and B2O3 oxides within a certain range and mainly using the mixed alkaline earth effect, and the water resistance, the acid resistance and the alkali resistance of glass can be improved through the composite adding of a small amount of ZrO2 and TiO2; and by introducing a small amount of Bi2O3 into the composition, the high-temperature viscosity of the glass melt is reduced, such that the effects of melting temperature reducing, energy saving and emission reducing in glass production can be achieved while the dielectric properties of the glass are not damaged.
Description
technical field [0001] The invention relates to the field of electronic information substrate materials, in particular to a low-dielectric glass fiber component and a manufacturing method thereof. Background technique [0002] At present, in the electronic information industry, glass fiber is widely used in substrate materials such as reinforced copper clad laminates (CCL) and printed circuit boards (PCB). With the iteration of product functions, in addition to the basic requirements of electronic glass fibers such as high tensile strength, good electrical insulation performance, good heat resistance and corrosion resistance, its dielectric performance indicators are also becoming more and more important. The lower the dielectric constant, the faster the signal travels in the board and the lower the energy loss during the transfer. It is therefore required that the glass fibers constituting the substrate composite also have a low dielectric constant and low tangent loss. I...
Claims
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