Material modification device, system and method based on dielectric barrier discharge plasma

Abstract

The disclosure discloses a material modification device based on dielectric barrier discharge plasma, comprising: an upper part of a device main body, a lower part of a device main body, a copper plate, a copper screw and nano-iron powder. The present disclosure also discloses a material modification system based on dielectric barrier discharge plasma. The disclosure also discloses a material modification method based on dielectric barrier discharge plasma. The disclosure can generate a uniform one-dimensional discharge, reduce the randomness and dispersion of the discharge distribution in space, and ensure the uniformity of the large-area material treatment effect; the disclosure can match the discharge gas according to the modification requirements of the thin film material, purposefully Introducing a specific group; this disclosure sets up a film material transmission mechanism, which can use low-temperature plasma to perform large-area, uniform, and continuous treatment of materials, and can be applied to research, teaching, and industrial production promotion of material surface modification.

Description

technical field [0001] The disclosure belongs to the technical field of material modification, and in particular relates to a material modification device, system and method based on dielectric barrier discharge plasma. Background technique [0002] In recent years, low-temperature plasma technology has been widely used in many fields including material surface modification. Compared with other material surface modification technologies, low-temperature plasma technology has the advantages of simple operation, fast processing speed, good modification effect, less environmental pollution, and low energy consumption. It has great application prospects and practicality in material surface modification. value. Studies at home and abroad have shown that dielectric barrier discharge plasma is rich in high-energy active components (electrons, ions, free radicals, excited states and metastable atoms), these high-energy active components interact with the surface of materials, and c...

AI Technical Summary

Problems solved by technology

[0004] Most of the currently existing plasma material processing devices cannot change the discharge gas atmosphere, and cannot match the discharge gas atmosphere for specific modification requirements, which limits the modification effect to a certain extent; on the other hand, most plasma modification devices cannot avoid the discharge gas atmosphere. The randomness and dispersion of the spatial distribution cannot guarantee the uniformity of the material processing effect

In addition, the existing devices have limited processing range and processing uniformity, which cannot guarantee continuous and large-area processing of materials

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