OSP processing technology for circuit board production

A processing technology and circuit board technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problems of difficult product quality control, high scrap rate, high production cost, and facilitate the control of processing quality. , The effect of strong biting ability

Inactive Publication Date: 2019-07-23
广州迅磊科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current osp processing technology for circuit board production has a hi...

Method used

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  • OSP processing technology for circuit board production
  • OSP processing technology for circuit board production
  • OSP processing technology for circuit board production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: as figure 1 As shown, the present invention provides a kind of osp processing technique for circuit board production, comprises the steps:

[0025] 1) Feeding: put the PCB board to be processed by OSP on the conveyor belt, and transport the PCB board to each processing station through the conveyor belt;

[0026] 2) Degreasing: a degreasing agent with an acidic concentration of 4% mixed with acetic acid, sulfuric acid, hydrochloric acid and other acids, mainly to remove oxides, SCUM and fingerprints on the surface, and at the same time have an effect on the formed organic protective film Good removal ability, convenient for heavy operation in production;

[0027] 3) Water washing: Spray the above degreased PCB board with a spray pressure of 0.8Kg / cm 2 , and finally wash the PCB board with overflow water, and the overflow flow rate of overflow water washing is 7L / min;

[0028] 4) Micro-etching: Place 3) the PCB board in hydrogen peroxide. The stability of...

experiment example

[0046] Experimental object: the circuit boards made by the processing technology of the present invention are used as the experimental group 1, the experimental group 2 and the experimental group 3, and the circuit boards made by other processes on the market are selected as the comparison group 1, the comparison group 2 and the comparison group 3.

[0047] The purpose of the experiment: To test the roughness of the test hole wall of each group of circuit boards, the thickness of the dielectric layer, to observe whether the interconnection in the metallized hole is damaged, and whether there is delamination of the glass cloth substrate.

[0048] Experimental method: Use 600#3M adhesive tape to stick to the green oil surface of the PCB with a length of about 2 inches. Wipe the adhesive surface 3 times with your hands to ensure that it is flat. The adhesive tape can only be used once each time. Pull it up to check whether the tape is attached with solder resist paint, whether the...

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PUM

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Abstract

The invention discloses an OSP processing technology for circuit board production, which comprises following steps of feeding, oil removing, micro-etching, acid washing, OSP processing, air drying, secondary water washing and drying. Before feeding, firstly quality detection is carried out on the PCB, the cleanness of the copper surface is guaranteed before the OSP film is coated, and then a qualified product before the processing is guaranteed. During micro-etching, copper in the solution is controlled to be 3.5 g/L, the biting and etching capability is strong, and then the film is formed under the good OSP condition. The film is protected in the processes of inspection, transportation and packaging after the film is formed. The strict process control aiming at the OSP pre-processing, OSPprocessing, and the OSP post-processing, the control of the OSP processing quality of the PCB board is convenient.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to an osp processing technology for circuit board production. Background technique [0002] 0SP is a process for the surface treatment of printed circuit board (PCB) copper foil that meets the requirements of the RoHS directive. It is translated as organic solder protection film, also known as copper protection agent. A chemical method grows an organic film, which has anti-oxidation, thermal shock resistance, and moisture resistance, and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in a normal environment; but in the subsequent In high temperature soldering, this kind of protective film must be easily removed by flux quickly, so that the exposed clean copper surface can be immediately bonded with molten solder to form a firm solder joint in a very short time. Due to the OSP process With the characteristics of simple control,...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/26H05K3/02
CPCH05K3/022H05K3/26H05K3/282
Inventor 夏波
Owner 广州迅磊科技有限公司
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