A robot automatic cleaning system and method

Abstract

The invention provides an automatic carrying and cleaning system and method of a robot. According to the system, silicon wafers lifted to the top of a stacking area and adjacent silicon wafers below are separated through a separating assembly in a feeding mechanism to form a buffering area, so that when a grabbing mechanical arm for transferring the silicon wafers grabs the silicon wafers, the adjacent silicon wafers below cannot be extruded or crushed, and then the silicon wafers can be transferred in a vacuum adsorption manner. According to the method, the silicon wafers lifted to the top ofthe stacking area and the adjacent silicon wafers below are separated through a separating step and an air injection buffering step to form the buffering area, so that when the grabbing mechanical arm for transferring the silicon wafers grabs the silicon wafers, the adjacent silicon wafers below cannot be extruded or crushed, and then the silicon wafers can be transferred in the vacuum adsorptionmanner. The technical problem that the silicon wafers cannot be automatically transferred or cleaned is solved, and the cleaning efficiency and cleaning quality of the silicon wafers are improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a robot automatic handling and cleaning system and method. Background technique [0002] As a good conductive material, silicon wafer can be widely used in technical fields such as semiconductors and solar cells. In the later stage of the silicon wafer processing process, steps such as chamfering, grinding, corrosion, polishing and cleaning are generally required. Cleaning refers to liquid cleaning of the processed silicon wafer to remove impurities on the surface of the silicon wafer, so as to avoid scratches on the surface of the silicon wafer, cracking, etc., is therefore a very important process step. [0003] However, the silicon wafer cleaning machine in the prior art is more complicated to operate, and the silicon wafer needs to be manually placed in the cleaning tank for cleaning, and the silicon wafer is fragile, and it is very easy to break due to hand...

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, the present invention provides a robot automatic handling and cleaning system, which separates the silicon wafer lifted to the top of the stacking area from the adjacent silicon wafer below to form a buffer zone by using the separation assembly in the feeding mechanism, so that When the grasping robot for transferring silicon wafers absorbs and grabs silicon wafers, the adjacent silicon wafers below will not be squeezed and broken, so that silicon wafers can be transferred by vacuum adsorption, solving the problem that silicon wafers cannot be automatically transferred and cleaned Technical issues to improve the cleaning efficiency and cleaning quality of silicon wafers

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