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Hole making method for ultrasonic vibration assisted grinding of SiCp/Al composite

A technology of ultrasonic vibration and composite materials, which is applied to the parts of grinding machine tools, grinding/polishing equipment, manufacturing tools, etc. It can solve the problems of difficult discharge of grinding heat, temperature rise of grinding area, thermal damage of processed materials, etc. , to improve machining accuracy and quality, reduce axial grinding force, and reduce tool wear

Inactive Publication Date: 2019-08-06
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high brittleness, severe tool wear and low processing efficiency of SiCp / Al composite materials during processing, processing defects are prone to occur and affect the processed parts.
[0003] At present, the method of twist drilling is mainly used to process SiCp / Al composite materials, and the following problems exist in the processing process: the grinding heat is not easy to discharge during the hole making process, which makes the temperature of the grinding area gradually increase and the tool life shortens At the same time, it is easy to cause thermal damage to the processed material and form processing defects

Method used

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  • Hole making method for ultrasonic vibration assisted grinding of SiCp/Al composite
  • Hole making method for ultrasonic vibration assisted grinding of SiCp/Al composite
  • Hole making method for ultrasonic vibration assisted grinding of SiCp/Al composite

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Experimental program
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Effect test

Embodiment 1

[0036] The embodiment of the present invention discloses a hole making method for ultrasonic vibration-assisted grinding of SiCp / Al composite material. The hole making method is as follows:

[0037] Step (1), the SiCp / Al composite material is drilled through a grinding tool to make holes. The grinding tool 1 includes: a cutter head 12 and a cutter handle 11; the cutter head 12 and the cutter handle 11 are fixedly connected;

[0038] The cutter head 12 is made by mixing abrasive and bonding agent;

[0039] The cutter head 12 needs to be selected before grinding. The cutter head 12 is selected mainly from three aspects: abrasive, bonding agent and particle size;

[0040] Abrasive selection: The reinforcement in the SiCp / Al composite material is SiC particles, and its hardness is very high. In order to ensure the wear resistance of the grinding tool 1 and increase its service life, diamonds with higher hardness than SiC particles should be used as abrasives , Where, such as figure 1 The ...

Embodiment 2

[0048] The aluminum-based composite material is used as the test material, the reinforcement is SiC particles, the volume fraction is 45%, the particle size is 2-8μm, and electroplated diamond grinding tools are used. Axial force is an important factor affecting the quality of composite holes, and it is the direct cause of various defects. This is mainly because the main cutting edge of the ordinary grinding tool 6 is the front face of the grinding tool. At a certain moment, the end face of the grinding tool is in contact with the material for processing such as image 3 As shown, a larger axial force will be generated. When electroplated diamond grinding tools are used for hole making, such as Figure 4 As shown, the cutter head 12 part of the grinding tool 1 is ground with a diamond with a higher hardness than SiC. It has a large contact area with the material, which can effectively reduce the axial force, and three equally spaced chip grooves 13 are attached, which is benefi...

Embodiment 3

[0050] The workpiece material is SiCp / Al composite material, and the grinding tool 1 in Example 1 is used for processing on the DMU80monoBLOCK 5-axis high-speed machining center. Because the cutting speed required for grinding is relatively high, the spindle speed is 4000RPM and the ultrasonic frequency is 26KHZ. The middle value of the amplitude is 6μm, the processing aperture is 8mm, and the hole depth is 4mm. During the processing, each hole needs to be processed for 6 minutes.

[0051] The processing parameters in this embodiment are shown in the table:

[0052] Table 1

[0053]

[0054] It can be seen from Table 1 that the ultrasonic vibration assisted grinding method is adopted in the present invention, and a suitable grinding tool is selected to quickly and accurately realize the hole-making of the SiCp / Al composite material.

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Abstract

The invention discloses a hole making method for ultrasonic vibration assisted grinding of an SiCp / Al composite. The hole making method comprises the steps that through a grinding tool, hole making iscarried out on the SiCp / Al composite in a grinding manner, in combination with the ultrasonic assisted grinding, a tool bit in the grinding tool can continuously impact and scratch the machined surface under the joint effect of ultrasonic vibration, mechanical grinding and ultrasonic cavitation, the machined material is pulverized into fine particles to be removed, and ultrasonic assisted grinding hole making of the SiCp / Al composite can be achieved. Through the grinding method, the service life of the tool is long, machining precision is high, the grinding heat is low, and the workpiece machining precision is high.

Description

Technical field [0001] The invention relates to the technical field of precision machining of composite materials, and more specifically to a hole making method for ultrasonic vibration-assisted grinding of SiCp / Al composite materials. Background technique [0002] Parts made of SiCp / Al composite material have the advantages of low density, high specific stiffness, high specific strength, good fatigue performance, heat resistance and wear resistance, etc., and are widely used in aerospace, aviation and other fields. However, due to the brittleness of the SiCp / Al composite material during processing, severe tool wear and low processing efficiency, processing defects are prone to occur, which will affect the processed parts. [0003] At present, SiCp / Al composite materials are mainly processed by twist-drilling holes. The following problems exist in the processing process: the grinding heat is not easily discharged during the hole making process, which makes the temperature of the gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04B24B41/04
CPCB24B1/04B24B41/04
Inventor 刘志兵刘洋王西彬焦黎梁志强颜培周天丰解丽静沈文华滕龙龙刘书尧潘金秋陈晖
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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