High-temperature-resistant epoxy structure adhesive for bridge segment splicing
A technology of epoxy structural adhesives and high temperature resistance, which is applied in the direction of epoxy resin adhesives, adhesives, non-polymer adhesive additives, etc. It can solve the problems of performance degradation, exceeding structural adhesives, affecting durability, etc., and achieve high temperature resistance. The effect of performance improvement, widening the use temperature, and good competitive advantage
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[0013] Exemplary embodiments disclosed in the present invention will be described in more detail below, in order to enable a more thorough understanding of the present invention and fully convey the scope of the disclosed invention to those skilled in the art. While exemplary embodiments of the invention disclosed in the detailed description have been shown, it should be understood that the invention is not limited to the embodiments set forth herein.
[0014] The main components of epoxy structural adhesive are bisphenol A resin, modified high temperature resistant epoxy resin, modified polyamide curing agent, high temperature resistant curing agent 130A, reactive diluent, toughening agent, silane coupling agent, silicon micropowder, etc. . By optimizing the process formula and process conditions, the expected performance indicators are achieved.
[0015] The adhesive consists of A component and B component.
[0016] The composition of component A is as follows: 30-50 parts...
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