Zero discharge alkaline copper etching waste liquid recycling technology method

A technology of waste liquid recovery and process method, applied in the direction of process efficiency improvement, copper sulfate, etc., can solve the problems of large environmental pollution, long recycling process, large equipment investment, etc., to solve environmental pollution problems, reduce recycling costs, and treat high efficiency effect

Inactive Publication Date: 2019-08-23
惠州大亚湾亿田环保技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The main purpose of the present invention is to provide a zero-emission recovery process for alkaline copper etching waste liquid, which aims to solve the

Method used

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  • Zero discharge alkaline copper etching waste liquid recycling technology method

Examples

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Example Embodiment

[0050] Example 1

[0051] (1) network breaking precipitation

[0052] Add hydrochloric acid to the copper etching waste liquid flowing out of the etching machine while stirring, and adjust the pH value of the copper etching waste liquid to 3.5-6.5 by hydrochloric acid, so that the copper ammonia complex ions in the copper etching waste liquid are broken and precipitated;

[0053] (2) Solid-liquid separation

[0054] Pump the copper-etching waste liquid that has broken and precipitated into the filter press, and the pump pressure of the filter press is 4.0kg / cm 2 , the clear liquid and copper mud are separated by the solid-liquid separation device, and the clear liquid is NH 4 Cl solution, the copper content of the copper mud is about 35%;

[0055] (3) Clear liquid recovery

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Abstract

The invention discloses a zero discharge alkaline copper etching waste liquid recycling technology method. The zero discharge alkaline copper etching waste liquid recycling technology method includesfollowing steps: adding hydrochloric acid in copper etching waste liquid flowing from an etching machine, wherein the hydrochloric acid performs complexation breaking and precipitation on copper ammonia complex ions in the copper etching waste liquid; feeding the copper etching waste liquid obtained after the complexation breaking and precipitation into a solid-liquid separation device, and separating out clear liquid and copper sludge through the solid-liquid separation device; adding an ammonia adjuvant in the clear liquid, forming an alkaline etchant by adding the ammonia adjuvant in the clear liquid, and adding the alkaline etchant in the etching machine; adding concentrated sulfuric acid in the copper sludge after being pulped for dissolving the pulped copper sludge, preparing a copper sulfate mixed solution, and obtaining industrial grade copper sulfate after performing re-cooling crystallization and dehydration separation on the copper sulfate mixed solution. The zero dischargealkaline copper etching waste liquid recycling technology method really achieves zero discharge, thoroughly solves an environment pollution problem caused by the copper etching waste liquid, is simple, high in treating efficiency, low in energy consumption, and small in demand quantity of devices, and greatly reduces recycling cost.

Description

technical field [0001] The invention relates to the technical field of copper etching waste liquid recovery, in particular to a zero-discharge alkaline copper etching waste liquid recovery process method. Background technique [0002] Alkaline etching solution is generally produced by professional electronic chemical factories. Fresh alkaline etching solution, also known as sub-liquid, is mainly composed of ammonium chloride [NH 4 Cl] and ammonia [NH 3 ·H 2 O]. The alkaline etching solution is added to the etching machine and the copper etching solution [CuCl 2 ] reaction to form a cupramine complex ion [Cu(NH 3 ) 4 ] 2+ , [Cu(NH 3 ) 4 ] 2+ It has strong oxidizing property and can undergo redox reaction with copper foil to dissolve copper foil. During the redox reaction, the Cu in the copper etching solution 2+ The ion concentration will get higher and higher as the Cu 2+ When the ion concentration is close to saturation, the etching speed will become slower, and...

Claims

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Application Information

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IPC IPC(8): C23F1/46C01G3/10C22B7/00C22B15/00
CPCC01G3/10C22B7/006C22B15/0089C23F1/46Y02P10/20
Inventor 李群英
Owner 惠州大亚湾亿田环保技术有限公司
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