A new type of anti-oxidation multi-component alloy solder and its preparation method

A multi-alloy, anti-oxidation technology, used in metal processing equipment, welding equipment, manufacturing tools, etc., can solve problems such as poor oxidation resistance and corrosion resistance, high alloy melting point, and poor processing performance.

Active Publication Date: 2021-06-08
WUXI RIYUE ALLOY MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, reducing the silver content in solder has become the starting point for researchers. However, the reduction of silver content leads to problems such as high melting point of the alloy, poor processability, poor oxidation resistance and corrosion resistance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A novel anti-oxidation multi-element alloy solder, its preparation method is as follows: (each raw material consumption sees Table 1)

[0024] (1) Put the raw materials Cu and Ni into a vacuum melting furnace according to the ratio, and after the furnace is evacuated to 0.1 Pa, the temperature in the furnace is heated to 1200 ° C, and then cooled to room temperature to make a CuNi master alloy;

[0025] (2) Put the CuNi master alloy, Ag, Si, Ce, Y, and Nd obtained in step (1) together into a vacuum melting furnace according to the ratio, and after the vacuum degree in the furnace reaches 0.04Pa, heat the furnace to 1400°C , heat preservation for 40 minutes, after all the raw materials are completely melted in the vacuum furnace to form a molten liquid, the temperature is lowered to 800°C, the molten liquid is poured into the shaping mold, and after the temperature drops to room temperature, the shaping mold is taken out from the vacuum furnace. Obtain the ingot required...

Embodiment 2

[0030] A novel anti-oxidation multi-element alloy solder, its preparation method is as follows: (each raw material consumption sees Table 1)

[0031] (1) Put the raw materials Cu and Ni into a vacuum melting furnace according to the ratio, and after the furnace is evacuated to 0.4 Pa, the temperature in the furnace is heated to 1300 ° C, and then cooled to room temperature to make a CuNi master alloy;

[0032] (2) Put the CuNi master alloy, Ag, Si, Ce, Y, and Nd obtained in step (1) together into a vacuum melting furnace according to the ratio, and after the vacuum degree in the furnace reaches 0.1Pa, heat the furnace to 1500°C , keep warm for 35 minutes, after all the raw materials are completely melted in the vacuum furnace to form a melt, cool down to 850°C, pour the melt into the shaping mold, and take the shaping mold out of the vacuum furnace after the temperature drops to room temperature. Obtain the ingot required for processing the welding material;

[0033] (3) Soli...

Embodiment 3

[0036] A novel anti-oxidation multi-element alloy solder, its preparation method is as follows: (each raw material consumption sees Table 1)

[0037] (1) Put the raw materials Cu and Ni into a vacuum melting furnace according to the ratio, and after the furnace is evacuated to 1Pa, the temperature in the furnace is heated to 1400 ° C, and then cooled to room temperature to make a CuNi master alloy;

[0038] (2) Put the CuNi master alloy, Ag, Si, Ce, Y, and Nd obtained in step (1) together into a vacuum melting furnace according to the ratio, and after the vacuum degree in the furnace reaches 0.4Pa, heat the furnace to 1600°C , keep warm for 30 minutes, after all the raw materials are completely melted in the vacuum furnace to form a molten liquid, the temperature is lowered to 900°C, the molten liquid is poured into the shaping mold, and after the temperature drops to room temperature, the shaping mold is taken out from the vacuum furnace. Obtain the ingot required for process...

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PUM

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Abstract

The invention discloses a novel anti-oxidation multi-component alloy solder and a preparation method thereof. The solder is composed of the following metal elements in weight percent: Ag 40-55%, Cu 43-55%, Ni 1-2%, Si 0.5% ~ 1.5%, Ce 0.2 ~ 0.5%, Y 0.1 ~ 0.5%, Nd 0.2 ~ 0.5%; the metal elements are smelted, cast, solid solution, aging, turning, cold rolling, tempering, annealing, finishing process, Prepare the solder. The sealing material prepared by the invention has the advantages of high cleanliness, good corrosion resistance, good oxidation resistance, low cost, strong tensile performance and the like.

Description

technical field [0001] The invention relates to the technical field of welding and multi-element alloy materials, in particular to an anti-oxidation multi-element alloy solder for electric vacuum device sealing and a preparation method thereof. Background technique [0002] Silver-based alloy solder has the advantages of good processing performance, good mechanical properties, good oxidation resistance, good corrosion resistance, good air tightness of welded joints, etc., and is used as the preferred welding material for electric vacuum device sealing. Ag72Cu28 binary alloy, as one of the representatives of silver-based alloys, is widely used in the field of electric vacuum devices for welding ceramics (Al2O3) and metals (oxygen-free copper, Kovar, nickel alloys, etc.), with good processability and easy processing into Sheet, strip, wire and other shapes, the welding temperature is moderate (about 800 ℃ ~ 850 ℃), does not contain volatile elements, and meets the requirements...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/3006B23K35/302B23K35/40
Inventor 晏弘
Owner WUXI RIYUE ALLOY MATERIALS
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