Copper-aluminum composite substrate and laser beam welding processing method and application thereof

Abstract

The invention discloses a copper-aluminum composite substrate. The copper-aluminum composite substrate includes a copper matrix and an aluminum layer. The aluminum layer is arranged on at least one ofthe surfaces of the copper matrix. A copper-aluminum mixture layer that copper and aluminum atoms penetrate each other or the copper and aluminum atoms combine with each other is formed between the copper matrix and the aluminum layer. The invention also discloses a laser beam welding processing method and an application of the copper-aluminum composite substrate. According to the invention, theproblem of electrochemical corrosion of copper-aluminum connection is solved, a material which can replace a copper material to make a copper-aluminum connection electrical terminal is obtained, and so the copper-aluminum connection has the advantages of longer service life, lower processing cost and less energy consumption.

Description

technical field [0001] The invention relates to the technical field of conductive metal materials, in particular to a conductive copper-aluminum composite base material, a laser beam welding processing method of the material and its application in making terminal blocks and electrical joints. Background technique [0002] Copper or copper alloy materials have good electrical conductivity, thermal conductivity, and plasticity, and are widely used in the field of electrical connections. However, there is a shortage of copper resources, and the content of copper in the earth's crust is only about 0.01%. As the service life increases, the cost of copper will increase year by year. For this reason, people begin to look for the substitute of metallic copper to reduce cost. [0003] The content of metal aluminum in the earth's crust is about 7.73%. After the refining technology is optimized, the price is relatively low, and it also has excellent electrical conductivity, thermal co...

AI Technical Summary

Problems solved by technology

[0008] 1. Due to the great difference in the melting points of copper and aluminum, when heated, aluminum begins to soften at a lower temperature, but copper is still in a hard state, and the friction between copper and aluminum will not completely remove the friction between copper and aluminum. impurities and oxides, but copper will extrude and deform aluminum, making it impossible to achieve complete surface-to-surface contact between copper and aluminum. In actual production, it is impossible to achieve the "compound in the bonding surface + The condition that the total amount of oxide + mixture ≤ 5%"

[0009] 2. Although copper and aluminum can dissolve infinitely in a liquid state, the melting point of copper and aluminum has not been reached when heated to 300°C to 550°C in the above method, and copper and aluminum are still solid or semi-solid. In this case, they are mutually soluble. May be small, but will produce more Cu 2 Al, Cu 3 Al 2 , CuAl, CuAl 2 and other metal compounds, thereby reducing the mechanical and electrical properties of the connection surface

[0010] 3. In a heating environment, copper and aluminum are easily oxidized, and copper and aluminum will oxidize with oxygen in the air to produce high melting point oxides, which are mixed in the copper-aluminum joint surface, making it difficult to achieve a complete fusion of the joint surface

[0011] 4. The above method needs to fix the copper-aluminum material and perform relative friction under relatively high pressure. Therefore, equipment for heating the copper-aluminum material as a whole and equipment for rubbing the copper-aluminum material are required. There are many additional equipment and the cost is relatively high. high

[0012] 5. This method can only process a single piece of copper-aluminum material at a time, and requires separate loading and unloading time, devices, and logistics equipment, resulting in low beats and high production costs. It is not suitable for mass production

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