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Substrate with heterosphere structure, preparation method and application

A technology of heterogeneous layer and substrate, which is applied in the field of material preparation for microwave devices, can solve the problem that the substrate with heterogeneous layer structure cannot be used in high temperature environment, and achieve the effect of tight combination, high performance reliability, and expanded application

Inactive Publication Date: 2019-09-06
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is: the substrate with heterogeneous layer structure prepared by the existing method cannot be used in high temperature environment, and a substrate with heterogeneous layer structure, preparation method and application are provided

Method used

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  • Substrate with heterosphere structure, preparation method and application
  • Substrate with heterosphere structure, preparation method and application
  • Substrate with heterosphere structure, preparation method and application

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Experimental program
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Effect test

Embodiment 1

[0056] In this embodiment, a substrate with a heterogeneous layer structure is prepared, and the specific process is as follows:

[0057] (1) Preparation of LTCC substrate green body:

[0058] According to the conventional method, the HL2000 zero-shrinkage green ceramic sheet is sequentially arranged through punching, hole filling, and printing processes to prepare a single-layer LTCC substrate green body, and the substrate green body is laminated, isostatically pressed, and hot-cut to obtain a substrate green body, etc. Static pressure temperature 80℃, pressure 1000PSI, holding time 10min;

[0059] When punching, punch a 0.2mm hole on the substrate as an alignment mark;

[0060] (2) Pretreatment of silicon nitride ceramic thick film plate:

[0061] The heterogeneous layer in this embodiment is a silicon nitride ceramic thick-film plate with a thickness of 0.381mm;

[0062] Firstly, the upper end surface of the silicon nitride ceramic thick film plate is roughened with molt...

Embodiment 2

[0079] In this embodiment, a substrate with a heterogeneous layer structure is prepared, and the specific process is as follows:

[0080] (1) Preparation of LTCC substrate green body:

[0081] According to the conventional method, the HL2000 zero-shrinkage green ceramic sheet is sequentially arranged through punching, hole filling, and printing processes to prepare a single-layer LTCC substrate green body, and the substrate green body is laminated, isostatically pressed, and hot-cut to obtain a substrate green body, etc. Static pressure temperature 80℃, pressure 1000PSI, holding time 10min;

[0082] (2) Pretreatment of barium titanate ceramic thick film plate:

[0083] The heterogeneous layer in this embodiment is a barium titanate ceramic thick-film plate with a thickness of 0.381 mm.

[0084] First, roughen the upper end surface of the barium titanate ceramic thick film plate with molten sodium hydroxide for 50s to obtain a roughened surface, rinse it with deionized water ...

Embodiment 3

[0099] In this embodiment, a substrate with a heterogeneous layer structure is prepared, and the specific process is as follows:

[0100] (1) Preparation of LTCC substrate green body:

[0101] According to the conventional method, the HL800 zero-shrinkage green ceramic sheet is sequentially arranged through punching, hole filling, and printing processes to prepare a single-layer LTCC substrate green body, and the substrate green body is laminated, isostatically pressed, and hot-cut to obtain a substrate green body, etc. Static pressure temperature 80℃, pressure 1000PSI, holding time 10min;

[0102] (2) Pretreatment of tin oxide ceramic thick film board:

[0103] The heterogeneous layer in this embodiment is a tin oxide ceramic thick-film plate with a thickness of 0.481 mm.

[0104] First, roughen the upper end surface of the tin oxide ceramic thick film plate with molten sodium hydroxide for 60 seconds to obtain a roughened surface, rinse it with deionized water and dry it; ...

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Abstract

The invention discloses a preparation method of a substrate with a heterosphere structure. The preparation method comprises the following steps: arranging raw ceramic chips to obtain substrate monolayer green bodies, and arranging the substrate monolayer green bodies into a substrate green body; carrying out coarsening, punching and position alignment marking treatment on the upper end or lower end of a heterosphere to obtain a pretreated heterosphere; printing a first printing layer on the coarsening surface of the pretreated heterosphere, printing a second printing layer on the other surfaceopposite to the coarsening surface, and enabling through holes to be filled with a sizing agent to obtain printed pore-filling heterospheres; paving or stacking the printed pore-filling heterosphereson the upper end or lower end of the substrate green body to obtain a stacked body; arranging a supporting layer and a first protective layer on the substrate green body end of the stacked body frominside to outside in sequence, setting a second protective layer on the heterosphere end of the stacked body, and carrying out isostatic pressing to obtain a laminated stacked body; and carrying out degumming and sintering on the laminated stacked body to obtain the substrate with the heterosphere structure. The substrate is used under the condition of high temperature, is not influenced by subsequent assembly temperature, and is wide in range of application.

Description

technical field [0001] The invention belongs to the technical field of material preparation for microwave devices, and in particular relates to a substrate with a heterogeneous layer structure, a preparation method and an application. Background technique [0002] LTCC (Low Temperature Co-fired Ceramics) is made of low-temperature sintered ceramic powder into a green ceramic sheet with precise thickness and density. On the green ceramic sheet, the required circuit pattern is produced by laser drilling, microporous grouting, printing and other processes, and the Multiple passive components are embedded in a multilayer ceramic substrate, then stacked together, and sintered to form a high-density circuit with stable high-frequency performance, high integration, strong reliability, and three-dimensional space that does not interfere with each other or a three-dimensional circuit with built-in passive components. circuit substrate. [0003] The LTCC substrate has obvious advanta...

Claims

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Application Information

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IPC IPC(8): H01L23/06H01L23/492
CPCH01L23/06H01L23/492H01L23/4924
Inventor 张孔刘建军魏晓旻王运龙
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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