Magnetron sputtering rotary target material binding method

Abstract

The invention discloses a magnetron sputtering rotary target material binding method. The method comprises the following steps that the inner surface of a rotary target pipe is metallized by means ofan ultrasonic surface treatment mode; the outer surface of a stainless steel pipe is roughed by adopting a sand blasting treatment means, and then welding flux is brushed to the outer surface of the stainless steel pipe by adopting a steel brush; and the stainless steel pipe is erected, the rotary target pipe sleeves the exterior of the stainless steel pipe, it is guaranteed that the temperature of the rotary target pipe is constant at 180-300 DEG C, the temperature of the stainless steel pipe is controlled to be kept at 180-300 DEG C, after the temperatures of the rotary target pipe and the stainless steel pipe are consistent, molten welding flux is poured into a gap between the inner surface of the rotary target pipe and the outer surface of the stainless steel pipe, the rotary target pipe and the stainless steel pipe are cooled to the room temperature simultaneously with the cooling speed being 1-5 DEG C/min after air in the gap is exhausted, and thus, a bound rotary target materialis obtained. The method has the advantages that heating is uniform, and the yield is high.

Description

technical field [0001] The invention relates to the technical field of rotating targets, in particular to a binding method for magnetron sputtering rotating targets. Background technique [0002] Various thin films deposited by magnetron sputtering have been widely used in the fields of electronic, optical, optoelectronic, magnetic and other functional devices. Recently, in order to improve the utilization rate of the target and reduce the cost of coating, the industry adopts the rotating target instead of the traditional planar target. This is because the material utilization rate of the rotating target can reach 80%, while the utilization rate of the planar target is only 30-40%. In addition, the use of rotating targets can also reduce the "nodules" on the surface of the target and improve the uniformity of the coating. [0003] The method of binding and fitting is the most important type of rotating target preparation method in the rotating target manufacturing industry...

AI Technical Summary

Problems solved by technology

Although this method can obtain uniform heating of the back pipe, there are the following problems: (1) The operation of the equipment is complicated, especially the high temperature sealing is relatively complicated

(2) The temperature of the oil bath is relatively low, and the target binding of high-temperature solder cannot be realized

Since the target is usually bound vertically, the "chimney" effect of the liner is obvious, and the heat runs upwards, causing the temperature at the upper end of the heating zone to be higher than that at the lower end. Excessive battery

(2) Uneven around the heating zone

Since the heating rod is placed inside the liner, there is a certain distance between the heating rod and the inner wall of the liner, and the heat is transferred to the liner by means of heat conduction, but in actual operation, it is difficult to control the distance between the heating rod and the inside of the surrounding liner Consistency, resulting in a local area in contact with the steel pipe, the temperature of the steel pipe in this area is extremely high, while other areas are farther away from the heating rod, and the temperature is lower

This difference in temperature can easily cause poor fluidity of the solder, uneven bonding and welding, and then affect the welding rate of the target

(3) The uneven heating of the target can easily lead to cracking of the ceramic brittle target, which affects the yield of bonding

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