Highly-heatproof polyamide composition and preparation method thereof

A polyamide composition, high heat-resistant technology, applied in the field of high heat-resistant polyamide composition and its preparation, can solve the problems of insufficient high-temperature thermal aging performance and mechanical properties

Active Publication Date: 2019-09-13
江苏晋伦塑料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The main purpose of the present invention is to overcome the problems of insufficient high-temperature thermal aging properties and mechanical properties of existing polyamide m

Method used

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  • Highly-heatproof polyamide composition and preparation method thereof
  • Highly-heatproof polyamide composition and preparation method thereof
  • Highly-heatproof polyamide composition and preparation method thereof

Examples

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Embodiment Construction

[0060] The present invention is further illustrated by the following examples. It should be understood that the following examples are for illustrative purposes only, and are not intended to limit the present invention.

[0061] The following materials were used in Examples and Comparative Examples:

[0062] PA66-1 refers to a PA66 resin having about 50 mmol / kg of amino terminal groups and about 80 mmol / kg of carboxyl terminal groups, a relative viscosity of 2.7, a melting point of 260° C., and a glass transition temperature of 60° C., commercially available.

[0063] PA66-2 refers to a PA66 resin having about 85 mmol / kg of amino terminal groups and about 45 mmol / kg of carboxyl terminal groups, a relative viscosity of 2.7, a melting point of 260° C., and a glass transition temperature of 60° C., commercially available.

[0064] PA6 refers to PA6 resin, with a relative viscosity of 2.7, a melting point of 220°C, and a glass transition temperature of 55°C, a commercially availa...

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Abstract

The invention discloses a highly-heatproof polyamide composition and a preparation method thereof. The composition comprises 25.0-98.0 wt% of polyamide, 0.5-15.0 wt% of epoxy resin, 0.01-3.0 wt% of astabilizer and 0.01-60.0 wt% of a reinforcing agent, or further comprises 0.01-5.0 wt% of a functional assistant, and the sum of the mass percentages of all above raw materials is 100 wt%, the polyamide is semicrystalline polyamide having a melting point of 200 DEG C or above, and the epoxy equivalent of the epoxy resin is 100-2500 g/eq. The polyamide substrate with an amino group at the high endand a carboxyl group at the low end is selected to reduce the generation of free radicals, the high temperature aging resistance of the epoxy resin is used to block oxygen from corroding and thermo-oxidatively aging the polyamide resin, and the strong polarity of the epoxy group improves the compatibility of the polyamide with the reinforcing agent, so the problem that existing polyamide molding compositions have insufficient high-temperature thermal aging property and mechanical properties is solved.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high heat-resistant polyamide composition and a preparation method thereof. Background technique [0002] Polyamide composition has excellent mechanical properties, durability, corrosion resistance, heat resistance and other characteristics, and is being used more and more in the field of "replacing steel with plastic". These products are often exposed to high temperatures during their lifetime, requiring long-term resistance to thermo-oxidative aging degradation. Under some extreme conditions, such as the intercooler air chamber of an automobile turbocharged engine, the long-term working temperature of polyamide composite parts exceeds 200 °C, and the parts are required to have a longer warranty period than traditional engineering plastic parts. At a temperature exceeding 200°C, the traditional polyamide composition will be thermally and oxidatively degr...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L77/02C08L63/00C08L51/04C08K7/14C08K13/04C08K5/18C08K5/053C08K3/16C08K5/098
CPCC08L77/06C08L2201/08C08L2205/02C08L2205/03C08L2205/025C08L2205/06C08K2201/003C08K2201/014C08L77/02C08L63/00C08K7/14C08K13/04C08K5/18C08K5/053C08K3/16C08K5/098C08L51/04
Inventor 陈跃民陈原振林柏龄
Owner 江苏晋伦塑料科技有限公司
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