Manufacturing method of high-depth-to-width-ratio and high-load miniature supercapacitor

Abstract

The invention discloses a manufacturing method of a high-depth-to-width-ratio and high-load miniature supercapacitor. The method comprises the following steps: firstly a coiled flexible breathable film is spread between a tensioning roller and an extrusion roller to serve as a flexible substrate, active material slurry is applied to the flexible breathable film, and the bottom is heated to form aporous electrode film; a sol electrolyte is applied to the porous electrode film, the porous electrode film enters a reverse evaporation region, meanwhile, an infrared heat source is used for carryingout non-contact heating to force a solvent in the sol electrolyte to be evaporated downwards, and the gel electrolyte is reversely formed from bottom to top and fills up micropores in an electrode toform a flexible electrode film with good mechanical properties; the flexible electrode film is placed on the focal plane of a laser, and a fine miniature 3D electrode is rapidly processed through program control; and then the sol electrolyte is applied to a gap of the miniature 3D electrode through a feeding scraper, and the solvent is volatilized, so that the manufacturing of the miniature supercapacitor is finished. The high-depth-to-width-ratio and high-load miniature supercapacitor can be prepared by the method.

Description

technical field [0001] The invention belongs to the technical field of micro-supercapacitor and micro-battery preparation, and in particular relates to a method for manufacturing a micro-supercapacitor with a large aspect ratio and high load. Background technique [0002] The development of tiny electronics such as implantable biosensors, portable wearable devices, micro-robots, radio-frequency identification devices, etc. has created a huge demand for tiny energy storage units that can be directly integrated on chips. As a very promising micro-energy storage unit, micro-supercapacitor has the advantages of high power density, long service life, and no maintenance. It can be used as a single energy supply unit or integrated with batteries and energy capture units to form a composite energy storage unit. Compared with the traditional face-to-face supercapacitors, the all-solid-state planar interdigitated micro-supercapacitors are more suitable for chip integration due to thei...

AI Technical Summary

Problems solved by technology

For example, the commonly used template deposition method of active material, because the growth of active material is usually isotropic and very time-consuming, it is very easy to cause short circuit; although screen printing and inkjet printing technology has the advantages of low cost and high efficiency, but due to the active Due to the rheological properties of substance ink, it is difficult to prepare 3D microelectrodes with high precision, large thickness, and aspect ratio exceeding 1; laser direct writing technology has the advantages of high efficiency, low cost, and is suitable for a variety of electrode material systems, but is limited by Limited to the fragile mechanical properties of porous electrode materials, material fractures and splashes are prone to occur during laser processing. Up to now, laser direct writing technology can only realize the formation of microelectrodes with a thickness of no more than 10 μm and an aspect ratio of less than 0.1. Specific capacitance per unit area is usually less than 10mF / cm 2 , which cannot meet the needs of practical applications

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