Tensile stress/strain sensor applied to knuckle joint and preparation method thereof

A technology of strain sensor and tensile stress, which is applied in the direction of instruments, measuring force, electric/magnetic solid deformation measurement, etc., can solve the problems of inability to apply stress/strain measurement, difficulty in detecting small deformation, insufficient tensile performance, etc., and achieve realization Effects of miniaturization and integration, large tensile range, good mechanical properties and resistance to strain properties

Inactive Publication Date: 2019-09-17
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the substrate material, most of the flexible sensors are flexible and bendable, but the stretchability is not enough, so they cannot be applied to the stress/strain measurement of large defo

Method used

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  • Tensile stress/strain sensor applied to knuckle joint and preparation method thereof
  • Tensile stress/strain sensor applied to knuckle joint and preparation method thereof
  • Tensile stress/strain sensor applied to knuckle joint and preparation method thereof

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with specific implementation methods.

[0030] (1) Use a small machine tool to mill out a 40×25×2mm on a piece of plexiglass 3 Dimensions of the groove surface as a mold, washed with absolute ethanol and deionized water;

[0031] (2) Cut 25×10mm on 60-mesh rough dry sandpaper 2 A piece of sandpaper strip of size, washed with absolute ethanol and deionized water in turn, dried and glued to the center of the bottom surface of the mold with double-sided adhesive, with the frosted side of the sandpaper facing up;

[0032] (3) Mix Components A and B of 00-30 Ecoflex silicone rubber with a total mass of 8g at a mass ratio of 1:1, stir for 5 minutes, and then place it in a vacuum environment for degassing treatment for 15 minutes, and inject it into the prepared mold. Then put it into...

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Abstract

The invention belongs to the field of flexible stress sensors, and relates to a tensile stress/strain sensor applied to a large deformation such as a knuckle joint and a preparation method thereof. The sensor device has a sandwich-like three-layer structure; a flexible substrate made of Ecoflex silicone rubber is arranged at the bottom; a CNTS conductive layer with a dry abrasive paper patterned microstructure is arranged at the middle layer, and the two ends of the CNTS conductive layer are led out by copper foils as electrodes; and a layer of silicone rubber is laid to the top as a protective layer. The Ecoflex silicone rubber has an elasticity modulus similar to that of the skin, which provides a possible for the wearable property of the device; the nanometer material CNTS with excellent conductivity is used as a microstructure sensing material; and the tensile stress/strain sensor is prepared by combining the Ecoflex silicone rubber and the nanometer material CNTS.

Description

technical field [0001] The invention belongs to the field of flexible stress sensors, and relates to a stretchable stress / strain sensor applied to large deformations such as finger joints and a preparation method. Background technique [0002] Stress / strain sensor is one of the most widely used sensors. It refers to a type of sensor whose electrical signal changes under the action of external force. The output of electrical signal can realize the functions of device status monitoring, system control, and environmental perception. Traditional stress / strain sensors use metal foil and other materials as strain gauges pasted on various sensitive elements to form sensors. In recent years, with the development of artificial intelligence robots and the demand for rehabilitation equipment and health monitoring in the medical and health field, traditional stress / strain sensors are not suitable for robotic electronics due to their rigidity, low flexibility, and poor applicability. Sk...

Claims

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Application Information

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IPC IPC(8): G01B7/16G01L1/22
CPCG01B7/18G01L1/22
Inventor 程广贵张振远丁建宁张忠强
Owner JIANGSU UNIV
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