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Polyimide composite foam precursor powder and polyimide composite foam

A technology of polyimide and composite foam, which is applied in the field of polyimide composite foam precursor powder and polyimide composite foam, which can solve the problem of less research on composite foam, poor mechanical properties of composite foam, and limited composite foam. Application and other issues

Inactive Publication Date: 2019-09-20
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The resin matrix mainly used in the microsphere composite foam prepared by the prior art is polypropylene resin, epoxy resin, cyanate resin, etc., and the mechanical properties of the composite foam prepared by it are not good; Less research limits the application of syntactic foams in high-tech fields

Method used

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  • Polyimide composite foam precursor powder and polyimide composite foam
  • Polyimide composite foam precursor powder and polyimide composite foam
  • Polyimide composite foam precursor powder and polyimide composite foam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Add 49.97g (0.096mol) of bisphenol A diether dianhydride and 9.73g (0.09mol) of m-phenylenediamine to a three-necked round-bottomed flask equipped with mechanical stirring, nitrogen protection, water and condensing reflux device, the formula 3.20 g (0.01 mol) of diamine with the structure shown in II-1, 1.18 g (0.008 mol) of terephthalic anhydride, and 350 g of N,N-dimethylacetamide (DMAc) were reacted at room temperature for 12 hours to obtain polyamide acid solution.

[0057] Add 100g of xylene and 60.5g of hollow glass microspheres to the obtained polyamic acid solution, reflux at 150°C with water for 3 hours, wash with ethanol for 4 times after filtering, dry at 150°C for 10 hours, and crush through 60 mesh After sieving, white hollow microsphere polyimide composite intermediate powder is finally obtained.

[0058] Put the intermediate powder into the mold and transfer it to a flat vulcanizer, raise the temperature to 160°C and keep it for 15 minutes, add 2MPa pres...

Embodiment 2

[0062] Add 49.97g (0.096mol) of bisphenol A diether dianhydride and 9.73g (0.09mol) of m-phenylenediamine to a three-necked round-bottomed flask equipped with mechanical stirring, nitrogen protection, water and condensing reflux device, the formula 3.20 g (0.01 mol) of diamine with the structure shown in II-1, 1.18 g (0.008 mol) of terephthalic anhydride, and 350 g of N, N-dimethylacetamide (DMAc) were reacted at room temperature for 12 hours to obtain polyamide acid solution.

[0063] Add 150g of xylene and 122g of hollow glass microspheres to the obtained polyamic acid solution, reflux at 150°C with water for 3 hours, wash with ethanol for 4 times after filtering, dry at 150°C for 10 hours, and break through a 60-mesh sieve Finally, white hollow microsphere polyimide composite intermediate powder is obtained.

[0064] Put the intermediate powder into the mold and transfer it to a flat vulcanizer, raise the temperature to 160°C and keep it for 20 minutes, add 2MPa pressure t...

Embodiment 3

[0068] Add 49.97g (0.096mol) of bisphenol A diether dianhydride and 9.73g (0.09mol) of p-phenylenediamine to a three-necked round-bottomed flask equipped with mechanical stirring, nitrogen protection, water and condensing reflux device, the formula 3.20 g (0.01 mol) of diamine with the structure shown in II-2, 1.18 g (0.008 mol) of terephthalic anhydride, 350 g of N, N-dimethylacetamide (DMAc), and react at room temperature for 12 hours to obtain polyamide acid solution.

[0069] Add 100g of xylene and 60.5g of hollow ceramic microspheres to the obtained polyamic acid solution, reflux with water at 150°C for 3 hours, wash with ethanol for 4 times after filtering, dry at 150°C for 10 hours, and crush through 60 mesh After sieving, white hollow microsphere polyimide composite intermediate powder is finally obtained.

[0070] Put the intermediate powder into the mold and transfer it to a flat vulcanizer, raise the temperature to 180°C and keep it for 15 minutes, add 5MPa pressur...

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Abstract

The invention provides a polyimide composite foam precursor powder and a polyimide composite foam. The polyimide composite foam is prepared by the method of: polymerizing aromatic dianhydride, aromatic diamine and an end-capping agent in an organic solvent; mixing the obtained polyamide acid solution with non-polar aromatic hydrocarbon and hollow microspheres, conducting cyclodehydration, precipitating powder, and then performing washing and drying to obtain polyimide composite foam precursor powder; and then carrying out compression molding to obtain the polyimide composite foam. According to the invention, aromatic diamine with a structure of II-1 to II-8 and other polymerization monomers are employed to prepare polyimide matrix resin, an o-hydroxydiphenyl ketone structural unit is introduced into a polyimide molecular chain to form a hydrogen bond in the molecular chain of polyimide, thus enhancing the interfacial bonding ability with the hollow microspheres, and effectively improving the mechanical properties of the composite foam; and the structure endows the composite foam with excellent ray radiation resistance.

Description

technical field [0001] The invention belongs to the technical field of microsphere composite foam, and in particular relates to a polyimide composite foam precursor powder and polyimide composite foam. Background technique [0002] Microsphere composite foam refers to a foam material composed of a resin matrix and hollow microspheres. This type of material has excellent properties such as low density, high specific strength, and low dielectric constant, and has been widely used in many fields. Commonly used resin matrices include epoxy resins, cyanate resins, phenolic resins, polyimide resins, and the like. Among them, polyimide resin is a kind of high-performance resin containing imide ring. Compared with other resins, it has very outstanding heat resistance, mechanical properties, solvent resistance and structural design flexibility. It has excellent dielectric stability in the frequency range, and the composite foam prepared by polyimide resin and hollow microspheres is ...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08K7/28C08K7/24C08J9/00
CPCC08G73/1042C08G73/1071C08J9/0066C08J2379/08C08J2479/08
Inventor 矫龙董志鑫姚海波代学民杜志军邱雪鹏
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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