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Silver-copper alloy target material and preparation method thereof

A technology of silver-copper alloy and target material, which is applied in the field of sputtering target material, can solve the problem of uneven target grain size and achieve the effect of uniform thickness and fast sputtering rate

Active Publication Date: 2019-10-11
FUJIAN ACETRON NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the target prepared by this method has the disadvantage of uneven grain size.

Method used

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  • Silver-copper alloy target material and preparation method thereof
  • Silver-copper alloy target material and preparation method thereof
  • Silver-copper alloy target material and preparation method thereof

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preparation example Construction

[0030] The invention provides a method for preparing a silver-copper alloy target, comprising the following steps:

[0031] Melting copper and silver under a protective atmosphere to obtain a liquid alloy;

[0032] performing spray deposition treatment on the liquid alloy to obtain a silver-copper alloy ingot;

[0033] The silver-copper alloy ingot is subjected to homogenization annealing, ECAP extrusion, low-temperature annealing, upsetting deformation and rolling in sequence to obtain a silver-copper alloy rough ingot;

[0034] The silver-copper alloy rough ingot is subjected to recrystallization annealing treatment to obtain a silver-copper alloy target material.

[0035] In the invention, copper and silver are smelted under a protective atmosphere to obtain a liquid alloy.

[0036] In the present invention, copper and silver are preferably added to the integrated smelting and spraying equipment, and the silver is loaded into the hopper. When the vacuum degree of the inte...

Embodiment 1

[0054] (1) Select copper with a purity of 99.999% and silver with a purity of 99.99%. According to the ratio of 99.0% by mass of copper and 1.0% by mass of silver, the two are added to the integrated smelting and spraying equipment, and the silver is first loaded In the hopper, when the vacuum degree is 0.8Pa, start to turn on the electricity and heat up, and when the temperature rises to 1190°C, then add silver to melt into a liquid alloy;

[0055] (2) In an inert atmosphere, the liquid alloy flows out through the guide tube, is crushed by high-speed argon at the outlet of the nozzle, atomized into dispersed liquid particles, and directly sprayed onto the substrate, solidified to form an ingot. At this time, the inert gas pressure is set to 0.8MPa, and the gas flow rate is 29L / s;

[0056] (3) Carry out high-temperature homogenization annealing on the ingot, the temperature is controlled at 700°C, and keep warm for 2 hours; carry out 5 passes of ECAP extrusion treatment on the...

Embodiment 2

[0062] (1) Select copper with a purity of 99.999% and silver with a purity of 99.99%. According to the ratio of 99.5% by mass of copper and 0.5% by mass of silver, the two are added to the integrated smelting and spraying equipment, and the silver is first loaded In the hopper, when the vacuum degree is 0.6Pa, the temperature is turned on, and when the temperature rises to 1180°C, silver is added to melt into a liquid alloy;

[0063] (2) In an inert atmosphere, the liquid alloy flows out through the guide tube, is crushed by high-speed argon at the outlet of the nozzle, atomized into dispersed liquid particles, and directly sprayed onto the substrate, solidified to form an ingot. At this time, the pressure of the inert gas is set to 0.9MPa, and the gas flow rate is 29L / s;

[0064] (3) Perform high-temperature homogenization annealing on the ingot, the temperature is controlled at 650°C, and keep warm for 2.5 hours; perform 4-pass ECAP extrusion treatment on the block ingot, an...

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Abstract

The invention provides a silver-copper alloy target material and a preparation method thereof and belongs to the technical field of sputtering target materials. The preparation method of the silver-copper alloy target material, provided by the invention, comprises the following steps of conducting smelting on copper and silver under a protective atmosphere to obtain a liquid alloy; conducting spraying deposition treatment on the liquid alloy to obtain a silver-copper alloy cast ingot; conducting homogeneous annealing, ECAP extrusion, low-temperature annealing, upsetting deformation and rollingtreatment on the silver-copper alloy cast ingot in sequence to obtain a silver-copper alloy raw ingot; and conducting recrystallization annealing treatment on the silver-copper alloy raw ingot to obtain the silver-copper alloy target material. The silver-copper alloy target material prepared through the method has the characteristics of being small in grain size, uniform in crystal grain distribution, uniform in ingredient and high in compactness.

Description

technical field [0001] The invention belongs to the technical field of sputtering targets, and in particular relates to a silver-copper alloy target and a preparation method thereof. Background technique [0002] In recent years, with the increasing development of sputtering targets and technology, the importance of sputtering targets has become more apparent in sputtering technology, and the quality of targets will directly affect the quality of coatings. During the sputtering process, the atoms on the surface of the target are sputtered out in the form of ions, and fall on the surface of the substrate to form a thin film. The surface hardness, wear resistance, corrosion resistance and heat resistance of the material can be improved by coating the material to meet the different use requirements of the material. The key to the vacuum magnetron sputtering coating lies in the target material used. [0003] High purity copper and copper alloys are used as interconnect material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C22C5/08
CPCC22C5/08C23C14/3407C23C14/3414
Inventor 张科陈钦忠邱树将李小锦
Owner FUJIAN ACETRON NEW MATERIALS CO LTD
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