Vertically oriented carbon nanotube array and graphene composite film material and preparation method thereof

Abstract

The invention discloses a vertically oriented carbon nanotube array and graphene composite film material and a preparation method thereof. The vertically oriented carbon nanotube array and graphene composite film material provided by the invention includes graphene and vertically oriented carbon nanotube arrays uniformly distributed therein. The preparation method includes: making graphene oxide into a solution to fill vertically oriented carbon nanotube arrays subjected to graphic and densification processing, and reducing graphene oxide at high temperature, thus obtaining the vertically oriented carbon nanotube array and graphene composite structure film. Specifically, the oriented carbon nanotube arrays can provide extra longitudinal heat conduction path to the composite film, while graphene can effectively fill the gaps among the vertically oriented carbon nanotube arrays subjected to graphic and densification processing to provide a transverse heat conduction path. The characteristics of the vertically oriented carbon nanotube arrays and graphene material are utilized for complementation, the transverse and longitudinal heat conduction performance of an effective thermal interface material can be effectively improved, and the composite film material is applicable to multiple electronic device heat dissipation fields.

Description

technical field [0001] The invention relates to a heat-conducting composite film material and a preparation method thereof, in particular to a thermal interface heat dissipation composite film material and a preparation method thereof, which are applied in the technical fields of heat dissipation of LEDs, microelectronics, and intelligent electronic devices. Background technique [0002] With the advancement of science and technology, the packaging density of components on electronic circuit boards is increasing day by day, and at the same time the power density of components is increasing, which makes the heat flux density of electronic chips increase. If the heat of the components cannot be conducted quickly, the temperature of the chip will rise and the product will fail. Therefore, finding a thermal interface heat dissipation material with fast and high thermal conductivity is an important topic in the research of electronic packaging. [0003] As a new type of two-dimen...

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Problems solved by technology

However, the interlayer van der Waals force of the graphene-based film leads to its large interlayer thermal resistance, making its longitudinal thermal conductivity perpendicular to the plane direction lower than the transverse thermal conductivity by more than 2 orders of magnitude, showing obvious anisotropy Heterotropic heat conduction limits its application in thermal interface materials to a certain extent

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