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Pulse electroplating agent capable of plating high-aspect-ratio through holes and blind holes, and preparation method thereof

A high aspect ratio, pulse electroplating technology, applied in the field of pulse electroplating, can solve the problems of uncontrollable coating quality and low production efficiency at blind hole positions, and achieve the effects of improving coating positioning, improving stability, and inhibiting decomposition

Inactive Publication Date: 2019-10-25
广州皓悦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The quality of the plating layer at the position of the blind hole is uncontrollable during the electroplating process of the through-blind integrated PCB board;
[0004] 2. When electroplating through and blind integrated PCB boards, the production efficiency is low

Method used

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  • Pulse electroplating agent capable of plating high-aspect-ratio through holes and blind holes, and preparation method thereof
  • Pulse electroplating agent capable of plating high-aspect-ratio through holes and blind holes, and preparation method thereof
  • Pulse electroplating agent capable of plating high-aspect-ratio through holes and blind holes, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A pulse electroplating agent capable of plating high aspect ratio through holes and blind holes, comprising the following components:

[0036] 100g / L PEG20000, 10g / L SP, 1g / L formaldehyde, 3g / L DAE, 4g / L JPH, 0.5g / L sulfuric acid, 6g / L ethylenethiourea, 4g / L Sodium dodecanesulfonate, 6g / L bis-benzenesulfonic acid imide, and the rest of water.

[0037] The above-mentioned preparation method of a pulse electroplating agent capable of plating high aspect ratio through holes and blind holes comprises the following steps:

[0038] S1. Add 18-30°C deionized water and PEG20000 into the container, and stir until completely dissolved;

[0039] S2, continue to add SP to the container, stir until completely dissolved;

[0040] S3, continue to add formaldehyde, sulfuric acid in container, stir until completely dissolving;

[0041] S4, continue to add DAE in the container, stir until completely dissolved;

[0042] S5, continue to add JPH to the container and stir until completel...

Embodiment 2

[0048] A pulse electroplating agent capable of plating high aspect ratio through holes and blind holes, comprising the following components:

[0049] 120g / L PEG20000, 15g / L SP, 3g / L formaldehyde, 5g / L DAE, 6g / L JPH, 1g / L sulfuric acid, 8g / L ethylenethiourea, 6g / L Sodium dodecanesulfonate, 7g / L of bisbenzenesulfonic acid imide, and the balance of water.

[0050] The preparation method is the same as in Example 1.

Embodiment 3

[0052] A pulse electroplating agent capable of plating high aspect ratio through holes and blind holes, comprising the following components:

[0053] 110g / L PEG20000, 13g / L SP, 2g / L formaldehyde, 4g / L DAE, 5g / L JPH, 0.8g / L sulfuric acid, 7g / L ethylenethiourea, 5g / L sodium dodecanesulfonate, 6.5g / L bis-benzenesulfonic acid imide, and the rest of water.

[0054] The preparation method is the same as in Example 1.

[0055] Implement application conditions

[0056] The pulse electroplating agent is mixed with copper sulfate, sulfuric acid, chloride ion, DI water, etc. according to a certain ratio to prepare an electrolytic solution for electroplating operation.

[0057] Electrolyte solution preparation

[0058] DI water: 50% volume ratio, copper sulfate: 80g / L, sulfuric acid: 220g / L, chloride ion: 60-90ppm, the pulse electroplating agent of embodiment 3: 13ml / L, surplus DI water stirs and dissolves, and solution Temperature: 24-28°C.

[0059] operating conditions

[0060] Pu...

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Abstract

The invention provides a pulse electroplating agent capable of plating high-aspect-ratio through holes and blind holes, and a preparation method thereof. The pulse electroplating agent comprises polyethylene glycol, sodium polydisulpropane sulfonate, formaldehyde, a fatty amine and ethylene oxide addition product, crosslinked polyamide, sulfuric acid, ethylene sulfur vein, sodium dodecyl sulfonate, bisbenzenesulfonic acid imide and the balance water. The blocking ability of the low-current zone agent is improved by adding PEG20000, specifically, the anode ion-dissociation efficiency is improved by applying PEG20000, and the anode migration efficiency is improved. Plating layer crystals are refined by adding the bisbenzenesulfonic acid imide, the blind hole filling effect is improved, and the quality of a blind hole plating layer is improved.

Description

technical field [0001] The invention relates to the technical field of pulse electroplating, in particular to a pulse electroplating agent capable of plating high aspect ratio through holes and blind holes and a preparation method thereof. Background technique [0002] The original light agent for pulse electroplating is used in pulse electroplating, which can meet the production demand when producing single through-hole PCB boards. When producing some composite through-hole and blind-integrated PCB boards, the effect of copper plating on the blind hole position cannot meet the quality requirements. . The original ordinary brightener is only suitable for ordinary through-hole electroplating process, and the product structure produced is ordinary (thickness-to-diameter ratio≤10:1). It is difficult to produce some PCB boards with a combination of open and blind (thickness-to-diameter ratio ≥ 12:1). mainly reflects in: [0003] 1. The quality of the plating layer at the posi...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/04C25D5/18
CPCC25D3/38C25D5/18C25D7/04
Inventor 丁先峰李良华黄兴鹏
Owner 广州皓悦新材料科技有限公司
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