Electronic assembly welding spot for temperature circulation

An electronic component and temperature cycle technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of increasing the cost of electronic components, long filling process, and increasing manufacturing time, so as to reduce the occurrence probability of solder joint fracture and relieve Stress, the effect that is conducive to miniaturization

Active Publication Date: 2019-10-25
CHINA-SINGAPORE INT JOINT RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has the following defects: First, due to the filling of thermosetting polymers, it is difficult to partially replace a component in the circuit board assembly when a defect occurs, and the entire circuit board assembly needs to be discarded
Second, the method increases the cost of the electronic assembly since the filled polymer is rat

Method used

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  • Electronic assembly welding spot for temperature circulation
  • Electronic assembly welding spot for temperature circulation
  • Electronic assembly welding spot for temperature circulation

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0046] Example one

[0047] Such as figure 2 As shown, the electronic component is regarded as a three-layer component, with solder joints sandwiched between substrates #1 and #2. The current practice is to fill the interlayer with solder joints of the same size and shape with the same wheelbase. When the component experiences a temperature deviation ΔT, the distribution of the shear stress on the solder joint is similar to the formula Where ε T Is the differential thermal strain between the two substrates, l is the distance from the center line to the edge of the electronic component, and x is the distance from the center line; λ x And κ s They are the plane tension flexibility and shear flexibility of the component, the formula The accuracy has been verified by the finite element analysis method. The electronic component is a two-dimensional structure, although What is described is only the distribution of shear stress in the x direction, but the shear stress distribution ...

Example Embodiment

[0056] Example two

[0057] In this embodiment, based on optimizing the shear flexibility of the solder joints, the solder joints from the center line to the edge of the electronic component have a more even shear force and torque distribution. In this embodiment, the equivalent shear area of ​​the solder joint is designed to be non-uniformly distributed from the center line to the edge of the electronic component-from large to small (such as Figure 7 Shown). Equivalent shear area of ​​solder joint A 3s , The distribution in the x direction is: Among them, A 3o Is the representative shear area at x=1.

[0058] At this time, the shear flexibility of the solder joint will be Where κ o =h 3 p x p y / (G 3 A 3o ), G 3 Is the shear modulus of the solder joint. At the same time, the node area p x p y Does not change with x, so the shear force on the solder joint will be And the end torque will be M joint ≈F joint h 3 / 2. Both do not change with the x direction, such as Figure 7 S...

Example Embodiment

[0061] Example three

[0062] In this embodiment, based on optimizing the shear flexibility of the solder joints, the solder joints from the center line to the edge of the electronic component have a more even distribution of shear force and moment. The wheelbase area of ​​the solder joint designed in this embodiment (that is, p x p y ) Non-uniform distribution from the center line to the edge of the electronic component-from dense to sparse (such as Figure 8 Shown). Its distribution in the x direction is: Where A po Is the wheelbase area at x=1. At the same time, it is necessary to maintain the representative shear area of ​​the solder joint (A 3s ) Does not change with x. In this way, the shear force on the solder joint will be And the end torque will be M joint ≈F joint h 3 / 2. Both do not change with the x direction, such as Figure 8 Shown.

[0063] The above embodiments describe the mathematical optimal distribution of the assembly length of the solder joint wheelbas...

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Abstract

The invention discloses an electronic assembly welding spot for temperature circulation. The welding spot is also called an interconnection point and is used for packaging an electronic assembly, wherein the axle distance or the section area of the cross section of the interconnection point is distributed in a non-uniform manner from the center line of the electronic assembly to the edge of the electronic assembly. The cross section of the interconnection point is in the shape of an irregular polygon, and the axle distance of the interconnection point is distributed in a non-uniform manner from dense to sparse from the center line of the electronic assembly to the edge of the electronic assembly. The cross-sectional area of the interconnection point is distributed in a non-uniform manner from large to small from the center line of the electronic assembly to the edge of the electronic assembly. The interconnection point is in the shape of a sand clock. The electronic assembly welding spot has the characteristic of different spot size or non-uniform distribution of the welding spot, provides the optimal distribution of the welding spot sizes and axle distances and also provides the optimal welding spot shape at the same time, thereby enabling each welding spot and each part of the welding spot to bear the equal stress, relieving the stress borne by the tail end of the corner welding spot, and reducing the occurrence probability of welding spot breakage.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a solder joint of an electronic component used to withstand temperature cycles. Background technique [0002] Semiconductor packaging is an important link in the semiconductor device value chain. The key to semiconductor packaging lies in the electrical, thermal and mechanical interconnections between chips and chips, chips and packages, packages and packages, and packages and boards. Solder joints are the most common method for interconnecting semiconductor packages because of their ease of manufacture and stable performance in reliability testing. [0003] An electronic assembly can be viewed as a three-layer assembly where solder joints are sandwiched between two substrates with different physical, mechanical and geometric properties. Temperature cycling is one of the most challenging reliability testing conditions. Due to the alternating differential therma...

Claims

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Application Information

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IPC IPC(8): H01L23/488
CPCH01L23/488
Inventor 王毅华沈乔飞
Owner CHINA-SINGAPORE INT JOINT RES INST
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