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Surface treatment composition, production method therefor, surface treatment method using surface treatment composition, and production method for semiconductor substrate

A technology of surface treatment and composition, which is applied in the field of surface treatment methods and the manufacture of semiconductor substrates, and can solve problems such as device reliability degradation and bad influence on semiconductor electrical characteristics

Active Publication Date: 2019-10-25
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the surface of the semiconductor substrate is contaminated with these impurities, there is a possibility that the electrical characteristics of the semiconductor will be adversely affected and the reliability of the device will decrease.

Method used

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  • Surface treatment composition, production method therefor, surface treatment method using surface treatment composition, and production method for semiconductor substrate
  • Surface treatment composition, production method therefor, surface treatment method using surface treatment composition, and production method for semiconductor substrate
  • Surface treatment composition, production method therefor, surface treatment method using surface treatment composition, and production method for semiconductor substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0232] [Preparation of Surface Treatment Compositions A-1 to A-4]

[0233] Each surface treatment composition was prepared in the same manner as the preparation of the above-mentioned surface treatment composition a-1, except that the ionic functional group-containing polymer was changed to the type shown below:

[0234] Use in surface treatment composition A-1: ​​sodium salt of acrylic acid-acrylamide tert-butyl sulfonic acid copolymer, weight average molecular weight 10000, ionic functional group (acidic functional group: sulfonic acid (salt) group) density 40%, pKa0 ~1, referred to as copolymer WB in the following Table 1

[0235] Use in surface treatment composition A-2: acrylic acid-acrylamide tert-butyl sulfonic acid copolymer, weight average molecular weight 9000, ionic functional group (acidic functional group: sulfonic acid (salt) group) density 60%, pKa 0~1, Referred to as copolymer WC in Table 1 below

[0236] Use in surface treatment composition A-3: acrylic acid...

Embodiment 5～8

[0242] [Preparation of Surface Treatment Compositions B-1 to B-4]

[0243] Except that polystyrene sulfonic acid (weight average molecular weight 10000, ionic functional group (acidic functional group: sulfonic acid (salt) group) density 100%, pKa=1.0) as the macromolecule containing ionic functional group was made into the following Each surface treatment composition was prepared in the same manner as the preparation of the surface treatment composition b-1 above, except that the addition amount in the composition shown in Table 2 was further added to water (deionized water).

Embodiment 9～12 and 13～15

[0245] [Preparation of Surface Treatment Compositions B-5 to B-8]

[0246] Except that the polyvinyl alcohol as a wetting agent is changed to sulfonic acid (salt) group-containing polyvinyl alcohol (weight-average molecular weight 10000, ionic functional group density 6%, pKa=1.0) as an ionic functional group-containing polymer and set Except the addition amount in the composition shown in following Table 2, each surface treatment composition was prepared similarly to the preparation of the said surface treatment composition B-1.

[0247] Here, as the sulfonic acid (salt) group-containing polyvinyl alcohol, a copolymer represented by the following formula including a structural unit having a sulfonic acid (salt) group and a structural unit derived from polyvinyl alcohol as structural units is used. Here, the ratio of the number of structural units derived from monomers having a sulfonic acid (salt) group to the number of structural units derived from all monomers in the polyme...

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Abstract

[Problem] To provide a means for sufficiently removing residue remaining on the surface of a polished object-to-be-polished. [Solution] A surface treatment composition containing a polymer compound and water and having a pH of less than 7, said polymer compound having: at least one type of ionic functional group selected from the group consisting of a sulfonic acid (salt) group, a phosphoric acid(salt) group, a phosphonic acid (salt) group, and an amino group; a pKa of no more than 3; and an ionic functional group density of more than 10%.

Description

technical field [0001] The present invention relates to a surface treatment composition, a method for producing the same, a surface treatment method using the surface treatment composition, and a method for producing a semiconductor substrate. Background technique [0002] In recent years, with the multilayer wiring on the surface of the semiconductor substrate, the following technology is used in the manufacture of devices: so-called chemical mechanical polishing (CMP) that physically polishes and flattens the semiconductor substrate. CMP uses a polishing composition (slurry) containing abrasive grains such as silica, alumina, and cerium oxide, corrosion inhibitors, and surfactants to planarize the surface of objects to be polished (polished objects) such as semiconductor substrates. In the method, the object to be polished (the object to be polished) is a wiring, a plug, etc. formed of silicon, polysilicon, silicon oxide, silicon nitride, metal, or the like. [0003] A la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304C11D3/37C11D7/22
CPCH01L21/02074H01L21/02065C11D3/378C11D7/34C11D3/3753C09G1/04C11D2111/22C11D3/37H01L21/304H01L21/02052C11D7/22C11D1/008C11D17/0008H01L21/02057H01L21/30625
Inventor 石田康登吉野努大西正悟吉崎幸信
Owner FUJIMI INCORPORATED
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