Fenton multi-domain ultrasonic processing method and device for preparing micro-hemispherical concave mold array

Abstract

The invention discloses a Fenton multi-domain ultrasonic processing method and device for preparing a microhemispherical concave mold array, including a grinding and polishing mold platform, the horn of which is connected with a high-frequency adjustable ultrasonic emitting device, and the horn is equipped with a detachable ultra-sonic The hard-coated tool head has a smooth through hole processed on the guide plate, the alumina sphere is limited on the guide plate, and the guide plate and silicon carbide wafer are placed on the horizontal workbench; the polishing liquid is evenly filled Guided on the fixed plate and the silicon carbide wafer; the superhard coating composite tool head receives the ultrasonic high-speed vibration of a given frequency and amplitude, hits the alumina sphere and emits it, and after the alumina sphere hits the abrasive grains at high speed, it hits the silicon carbide substrate. The silicon dioxide is removed during the impact. During the impact, the Fenton reaction and ultrasonic machining are shown as a layer-by-layer reaction and layer-by-layer removal. During this period, the multi-domain controllable method of ultrasonic machining is used to obtain a microhemispherical concave mold array with high surface quality.

Description

technical field [0001] The invention relates to the field of ultra-precision machining, in particular to a method and device for preparing a microhemispherical die array by Fenton multi-domain ultrasonic machining. Background technique [0002] Hemispherical Resonator Gyro (Hemispherical Resonator Gyro, referred to as HRG) is a kind of angular motion detection device made by using the Coriolis effect produced by the hemispherical resonator when it vibrates at high frequency. Because it is different from the principle of the change of the momentum moment to the spatial position when the mechanical rotor rotates at high speed, HRG can greatly reduce the volume of the gyroscope and has strong impact resistance. It has the characteristics of high precision, small size, high reliability, long life, low power consumption, short start-up time, and can continue to work for 15 minutes after power failure. Combined with MEMS (micro-electromechanical system) technology, the micro hemis...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a Fenton multi-domain ultrasonic processing to prepare a micro-hemispherical concave mold array for the defects and deficiencies existing in the existing resonant vibrator concave mold processing technology that the surface quality and shape accuracy cannot be guaranteed, the mass production cannot be mass-produced, and the processing is complicated. Method and device

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