Improved environment-friendly water-based photoresist stripping liquid

Abstract

The invention discloses an improved environment-friendly water-based photoresist stripping liquid, comprising the main components: organic amine, water-soluble organic solvent, water and water-solubleorganic phosphoric acid, wherein the water-soluble organic phosphoric acid has an amino group in its molecular structure, and the content of the water-soluble organic phosphoric acid is 0.01 to 3% byweight. The improved environment-friendly water-based photoresist stripping liquid uses the water-soluble organic phosphoric acid having amino groups as a copper corrosion inhibitor, and uses the amino group and a phosphate group in the organic phosphoric acid as a coordinating group to react with copper. Compared with a benzotriazole corrosion inhibitor in the prior art, the copper corrosion inhibitor has weak coordination ability and weakens the protection ability of a corrosion inhibition system for copper wiring, and achieves the selective etching of the copper wiring. The pH value of thestripping system can be adjusted by the water-soluble organic phosphoric acid. When the alkanolamine attacks the photoresist, the organic phosphoric acid attached to a copper-molybdenum surface regulates the potential difference of the copper-molybdenum interface and prevents undercutting.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to an improved environmental-friendly water-based photoresist stripping solution. Background technique [0002] In order to reduce the wiring width in high-generation panels to save space, copper wiring with better resistivity is used to replace aluminum wiring, but the adhesion between copper wiring and glass substrate is poor, and the lower layer needs to be selected from molybdenum and molybdenum. Alloy, titanium, and titanium alloy are used as an auxiliary material, among which titanium and titanium alloy are expensive, and molybdenum and molybdenum alloy are more cost-effective. [0003] The production process of the substrate includes the following steps: coating a photoresist on the wiring material layer formed on the substrate, exposing and developing it to form a resist pattern, and using the patterned resist as The above-mentioned conductive metal layer o...

AI Technical Summary

Problems solved by technology

[0004] The substrate stripping process including copper wiring layer and molybdenum / molybdenum alloy layer has the following technical defects: First, copper is affected by its own chemical properties, and it is easily oxidized in the air to form copper oxide, resulting in poor conductivity and large impedance

However, copper protective agents such as benzotriazoles in the prior art have strong corrosion inhibition properties, so that the components in the stripping solution cannot selectively etch copper through the protective layer formed by the corrosion inhibitor to remove the surface oxide layer; Second, there is a potential difference between copper and molybdenum. When treated with alkaline stripper, molybdenum will be corroded preferentially, resulting in undercut phenomenon, resulting in distortion of pattern line width

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