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A flexible sensing module, manufacturing process and application thereof for dynamic monitoring of human body inductance

A technology for sensing modules and dynamic monitoring, applied in the field of sensing modules, can solve problems such as unfavorable installation and use of complex electronic equipment, poor bonding force between conductive materials and their substrates, and unstable product performance, and achieve controllable functions. , Improve the accuracy and stability, the effect of good bonding strength

Active Publication Date: 2021-12-07
赵为芳 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] (1) To overcome the problem that the conductive material of the flexible sensing module used for dynamic monitoring of human body inductance is not well bonded to its substrate, and the product performance is unstable;
[0014] (2) To overcome the problems of low tensile strength and high thermal shrinkage rate of the existing flexible sensing modules used for dynamic monitoring of human body inductance, which are not conducive to installation and use in complex electronic devices

Method used

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  • A flexible sensing module, manufacturing process and application thereof for dynamic monitoring of human body inductance
  • A flexible sensing module, manufacturing process and application thereof for dynamic monitoring of human body inductance
  • A flexible sensing module, manufacturing process and application thereof for dynamic monitoring of human body inductance

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Embodiment 1

[0051] A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 10% nano-platinum powder, 50% Fiber-grade PET chips, 8% nano-graphene, 8% epoxy resin, 2% epoxy resin reactive diluent, 2% high-efficiency dispersant and stabilizer, 10% deionized water, 10% Far-infrared fiber cloth base material.

[0052] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0053] The high-efficiency dispersant is dimethyl ethanolamine acrylate.

[0054] The stabilizer is triphenyl phosphate.

[0055] The epoxy resin is bisphenol A type epoxy resin.

[0056] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0057] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0058] (1) Dispersion step of fi...

Embodiment 2

[0074] A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 20% nano-platinum powder, 40% Fiber-grade PET chips, 8% nano-graphene, 8% epoxy resin, 2% epoxy resin reactive diluent, 2% high-efficiency dispersant and stabilizer, 10% deionized water, 10% Far-infrared fiber cloth base material.

[0075] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0076] The high-efficiency dispersant is isopropanol.

[0077] The stabilizer is triphenyl phosphate.

[0078] The epoxy resin is bisphenol A type epoxy resin.

[0079] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0080] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0081] (1) Dispersion step of fiber-grade PET slice...

Embodiment 3

[0097]A flexible sensing module for dynamic monitoring of human body inductance and its manufacturing process. The flexible sensing module for dynamic monitoring of human body inductance is made of the following raw materials in weight percentage: 15% nano-platinum powder, 45% Fiber-grade PET chips, 10% nano-graphene, 10% epoxy resin, 3% epoxy resin reactive diluent, 3% high-efficiency dispersant and stabilizer, 6% deionized water, 8% Far-infrared fiber cloth base material.

[0098] The high-efficiency dispersant: the weight ratio of the stabilizer is 5:2.

[0099] The high-efficiency dispersant is dimethyl ethanolamine acrylate.

[0100] The stabilizer is triphenyl phosphate.

[0101] The epoxy resin is bisphenol A type epoxy resin.

[0102] The epoxy resin reactive diluent is 1,6-hexanediol diglycidyl ether.

[0103] The manufacturing process of the flexible sensing module used for dynamic monitoring of human body inductance includes:

[0104] (1) Dispersion step of fib...

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Abstract

The invention provides a flexible sensing module for dynamic monitoring of human body inductance, the raw materials of which include: nano-platinum powder, fiber-grade PET slices, nano-graphene, far-infrared fiber cloth base material and the like. The present invention also provides a method for preparing a flexible sensing module for dynamic monitoring of human body inductance, including: PET chip dispersing steps, electrostatic spinning material preparation steps, electrostatic spinning steps, and far-infrared shaping steps. The invention also provides the use of the flexible sensing module in a dynamic monitoring device for human body inductance. The beneficial effects of the present invention are: the conductive material of the flexible sensing module and the base material have good bonding strength, the flexible sensing module has excellent and stable performance, and controllable functions; the thermal shrinkage rate is low and the tensile strength is high; The invention has good efficiency and high detection sensitivity; it can significantly improve the accuracy and stability of a human body inductance dynamic monitoring device using the flexible sensing module.

Description

technical field [0001] The invention relates to the field of sensing modules, in particular to a flexible sensing module for dynamic monitoring of human body inductance, a manufacturing process and an application thereof. Background technique [0002] Flexible sensors refer to sensors made of flexible materials, which have good flexibility, ductility, and can even be bent or folded freely, and have flexible and diverse structures. Accurate and fast measurement with special signals, so flexible sensing technology plays an important role in artificial intelligence, health medical devices and wearable electronics. The hard and brittle nature of ordinary sensors makes it difficult for electronic devices to bend or extend. Once there is a large deformation, the electronic devices will be damaged and the measurement range will be greatly affected. As the application requirements of the information age are getting higher and higher, the requirements for various performance paramet...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D04H1/728D04H1/55D01D5/00D01F1/09A61B5/11
CPCA61B5/1118D01D5/003D01D5/0069D01D5/0084D01D5/0092D01F1/09D04H1/55D04H1/728
Inventor 赵为芳
Owner 赵为芳
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