Flexible copper clad laminate and preparation method thereof

A copper foil and substrate technology, which is applied in the manufacture of printed circuits, the manufacture of printed circuit precursors, the improvement of metal adhesion of insulating substrates, etc., can solve problems such as environmental pollution, and achieve low dielectric constant and low dielectric loss. Effect

Active Publication Date: 2019-11-26
SUZHOU GOLDEN TECH MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More importantly, this kind of adhesive needs to be dissolved and used in organic solvents, which is easy to cause pollution to the environment and other problems.

Method used

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  • Flexible copper clad laminate and preparation method thereof
  • Flexible copper clad laminate and preparation method thereof
  • Flexible copper clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1 Flexible insulating base film

[0026]

[0027] The above-mentioned components are melted in a twin-screw extruder, mixed once, extruded, cooled, dried and pelletized, then the modified particles are melted again in a twin-screw extruder, and mixed twice, and finally Extruded, cast cast sheet and biaxially stretched into film, wound into roll.

[0028] The performance test of the prepared film was compared with the commercially available PI film, and the test results are shown in Table 1.

[0029] Table 1

[0030]

Embodiment 2

[0031] Embodiment 2 Film 1

[0032]

[0033] The above-mentioned components are melted in a twin-screw extruder, kneaded once, extruded, cooled, dried and pelletized for later use.

Embodiment 3

[0034] Embodiment 3 Adhesive film 2

[0035] The difference with embodiment 2 is that each component is composed, as follows:

[0036]

[0037] The functional masterbatches prepared in Examples 2 and 3 were melt-coated and cooled to form a film, and then the adhesive film was tested for performance testing. The test results are shown in Table 2.

[0038] Table 2

[0039]

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PUM

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Abstract

The invention belongs to the technical field of flexible printed circuit boards, and in particular relates to a flexible copper clad laminate and a preparation method thereof. The flexible copper cladlaminate comprises at least one layer of flexible insulation base film, at least one layer of metal copper clad and an adhesive film, which is used for adhering the adjacent insulation base film andmetal copper clad; the adhesive film comprises the following components: polyphenylene benzothiazole, a coupling agent, natural rubber, conducting particles and an ultraviolet light absorber; and thecoupling agent is gamma-(2,3-poxyl propyl oxygen) propyl trimethoxysilane. In the technical scheme provided by the invention, the adhesive film is composed of a thermoplastic liquid crystal polymer material, and has the good performances of being low in moisture absorption, low in dielectric constant and dielectric loss, high-temperature resistant and the like; furthermore, no organic solvent is added in the process; and, compared with the thermosetting performance of the current adhesive film, the thermoplasticity has the characteristics of being repairable and reducible.

Description

technical field [0001] The invention belongs to the technical field of flexible circuit boards, and in particular relates to a flexible copper foil base material and a preparation method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board), also known as "FPC flexible board", is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. It can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC flexible boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. [0003] Flexible copper clad substrate (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/02C09J181/00C09J11/06C09J11/04C09J9/02C09J7/30C09J7/10C08J5/18C08K3/08C08K3/36C08K5/3475C08K13/02
CPCC08J5/18C08J2381/00C08K3/36C08K5/3475C08K13/02C08K2003/0806C08K2201/011C09J9/02C09J11/04C09J11/06C09J181/00C09J7/10C09J7/30H05K3/022H05K3/386C08L7/00C08K3/08C08K5/3435C08K5/1345
Inventor 唐超李华
Owner SUZHOU GOLDEN TECH MATERIAL
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