Novel tetracarboxylic dianhydride, polyimide derived from said tetracarboxylic dianhydride, and molded article produced from said polyimide

A technology of tetracarboxylic dianhydride and polyimide is applied in the field of novel tetracarboxylic dianhydride and polyimide derived from the tetracarboxylic dianhydride and the formed body composed of the polyimide, which can solve the problem of dissolving Insufficient properties, undiscovered polyimide, etc., to achieve the effect of excellent solubility and excellent processability

Active Publication Date: 2018-06-08
HONSHU CHEM INDAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This polyimide has a low linear thermal expansion coefficient equivalent to that of inorganic materials in addition to transparency and heat resistance, but its solubility in various organic solvents is not sufficient, and there is still room for improvement in this regard
[0006] Furthermore, a polyimide having excellent processability combined with thermoplasticity has not yet been found.

Method used

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  • Novel tetracarboxylic dianhydride, polyimide derived from said tetracarboxylic dianhydride, and molded article produced from said polyimide
  • Novel tetracarboxylic dianhydride, polyimide derived from said tetracarboxylic dianhydride, and molded article produced from said polyimide
  • Novel tetracarboxylic dianhydride, polyimide derived from said tetracarboxylic dianhydride, and molded article produced from said polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] The synthesis of tetraformic acid dianhydride TACHQ shown in A. formula (1)

[0110] TACHQ represented by formula (1) is synthesized as follows. 12.7003 g (60.3137 mmol) of trimellitic anhydride chloride was placed in an eggplant-shaped flask, dissolved in 33 mL of dehydrated tetrahydrofuran (THF) at room temperature, and sealed with a septum to prepare Solution A. Further, 6.5 mL of dehydrated THF and 9.7 mL (120 mmol) of pyridine were added to 3.8551 g (20.0661 mmol) of 2-cyclohexylhydroquinone (CHQ) in another flask, and a septum was sealed to prepare solution B.

[0111] While cooling and stirring in an ice bath, solution B was slowly added dropwise to solution A via a syringe over about 5 minutes, followed by stirring at room temperature for 24 hours. After the reaction, the white precipitate was filtered and washed with THF and ion-exchanged water. The removal of pyridine hydrochloride was confirmed by adding an aqueous solution of silver nitrate to the washing ...

Embodiment 2

[0120] The synthesis of the polyimide of the repeating unit shown in A. formula (8)

[0121] (Polymerization of polyamic acid) TACHQ / TFMB

[0122] 3 mmol of 2,2'-bis(trifluoromethyl)benzidine (TFMB) was dissolved in dehydrated N,N-dimethylacetamide (DMAc). 3 mmol of the TACHQ powder described in Example 1 was slowly added there, it stirred at room temperature for 72 hours, and DMAc was added suitably, and the polyamic acid (16.7 weight% of solid content concentration) which is a polyimide precursor was obtained. The intrinsic viscosity of the obtained polyamic acid was 1.72 dL / g.

[0123] (Chemical imidization reaction)

[0124] After diluting the obtained polyamic acid solution to a solid content concentration of about 10.0% by weight with dehydrated DMAc, a mixture of 2.8 mL (30 mmol) of acetic anhydride and 1.2 mL (15 mmol) of pyridine was slowly added dropwise at room temperature while stirring. The solution was mixed and further stirred for 24 hours after the dropwise ...

Embodiment 3

[0130] A. Synthesis of the polyimide of the repeating unit represented by the following formula (9)

[0131] (Polymerization of polyamic acid) TACHQ(80)6FDA(20) / TFMB

[0132]3 mmol of 2,2'-bis(trifluoromethyl)benzidine (TFMB) was dissolved in dehydrated N,N-dimethylacetamide (DMAc). Slowly add 2.4 mmol of TACHQ powder described in Example 1 and 0.6 mmol of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) powder, stir at room temperature for 72 hours, and add DMAc was used to obtain polyamic acid (solid content concentration: 22.7% by weight) which is a polyimide precursor. The intrinsic viscosity of the obtained polyamic acid was 0.91 dL / g.

[0133] (Chemical imidization reaction)

[0134] After diluting the obtained polyamic acid solution with dehydrated DMAc to a solid content concentration of about 10.0% by weight, a mixture of 2.8 mL (30 mmol) of acetic anhydride and 1.2 mL (15 mmol) of pyridine was slowly added dropwise at room temperature while stirring. T...

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Abstract

The present invention addresses the problem of providing: a polyimide which is derived from a novel tetracarboxylic dianhydride, has both excellent solubility in various types of organic solvents andthermoplasticity and therefore has excellent processability, and also has both a low linear thermal expansion coefficient and high light permeability (transparency); and a molded article produced fromthe polyimide. The problem can be solved by a polyimide derived from a tetracarboxylic dianhydride represented by formula (1).

Description

technical field [0001] The present invention relates to a polyimide derived from a novel tetracarboxylic dianhydride and a molded body made of the polyimide, which is excellent in processability and has both a low coefficient of linear thermal expansion and high light transmittance ( transparency). Since this polyimide exhibits thermoplasticity in addition to excellent solution processability, not only film formation by a solution casting method but also melt molding can be performed. A molded article made of this polyimide further exhibits a low linear thermal expansion coefficient and is excellent in transparency as compared with conventional solvent-soluble polyimides or thermoplastic polyimides. From such characteristics, it is used as a liquid crystal display (LCD), organic electroluminescence (EL) display, electronic paper, light emitting diode (LED) device, solar cell, etc. that require dimensional stability and transparency against heat. Useful for transparent substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C07D307/89
CPCC07D307/89C08G73/10C08G73/1007C08G73/1039
Inventor 石井淳一长谷川匡俊
Owner HONSHU CHEM INDAL
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