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Electronic tag packaging method applied to RFID dinner plate

A technology of electronic tags and encapsulation methods, which is applied in the direction of record carriers, instruments, adhesive types, etc. used by machines, can solve problems that affect the reliability of RFID plate recognition and increase the damage rate, and achieve avoiding label breakage, damage, and reliability. High performance, the effect of strengthening the ability of high temperature resistance

Active Publication Date: 2019-11-29
SHANDONG SYNTHESIS ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through this packaging method, if the RFID dinner plate goes through the production process of hundreds of degrees Celsius and dozens of atmospheric pressure, especially in the application scenarios such as dish washing and high-temperature disinfection, the label will be continuously subjected to collision and high temperature, which will increase its damage rate. , affecting the reliability of RFID plate recognition

Method used

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  • Electronic tag packaging method applied to RFID dinner plate
  • Electronic tag packaging method applied to RFID dinner plate
  • Electronic tag packaging method applied to RFID dinner plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment discloses a method for encapsulating an electronic label applied to an RFID dinner plate. The packaged electronic label is as follows: figure 2 As shown, the encapsulation method includes the following steps:

[0023] 1), prepare chip 11;

[0024] 2) Squeeze the chip 11, the solder piece 12, and the ceramic substrate 13 together with a flip-package machine;

[0025] 3) For SMT reflow soldering, turn on the soldering equipment, set the reflow soldering conditions according to the process conditions, put the fixed antenna coil 14 and the ceramic substrate solder piece into the reflow soldering equipment for processing and welding.

[0026] 4) Encapsulate the above-mentioned exposed electronic tags, put the electronic tags into the mold 1, use JL-202 to pot AB glue 16, the glue quality ratio is A:B=5:1, and the operating temperature is -10°C-40 ℃, the operating time after mixing is 40 minutes, and the glue starts to solidify after 40 minutes. At this tim...

Embodiment 2

[0031] This embodiment discloses a method for encapsulating an electronic label applied to an RFID dinner plate. The packaged electronic label is as follows: figure 2 As shown, the encapsulation method includes the following steps:

[0032] 1), prepare chip 11;

[0033] 2) Squeeze the chip 11, the solder piece 12, and the ceramic substrate 13 together with a flip-package machine;

[0034]3) For SMT reflow soldering, turn on the soldering equipment, set the reflow soldering conditions according to the process conditions, put the fixed antenna coil 14 and the ceramic substrate solder piece into the reflow soldering equipment for processing and welding.

[0035] 4) Encapsulate the exposed electronic tags processed above, put the electronic tags into the mold 1, use SY-314 potting crystal glue, the glue mass ratio is A:B=3:1, and the operating temperature is 0°C-30°C. After mixing, it can be operated for 25 minutes. After 25 minutes, the glue starts to solidify. At this time, t...

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Abstract

The invention discloses an electronic tag packaging method applied to an RFID dinner plate. According to the method, the electronic tag is packaged twice by adopting two different glues; thermal expansion coefficients of the two glues and the thermal expansion coefficient of the antenna coil realize thermal matching of the whole structure; the bending strength of the outer packaging layer is greater than that of the inner packaging layer; the outer packaging layer reduces deformation and breakage caused by high pressure in the process of implanting the electronic tag into dishes, the inner packaging layer avoids tag breakage and damage caused by micro-deformation of the outer packaging layer, the difference of the bending strength of the two packaging layers strengthens the high temperature resistance of the product, and the high pressure resistance of the product is improved. The electronic tag manufactured by adopting the packaging method has the characteristics of high temperature resistance and high pressure resistance, high reliability, tolerable temperature reaching 150 DEG C, impact temperature reaching 260 DEG C, high reliability in an application scene of the RFID dinner plate, and tolerance to high-temperature impact caused by repeated disinfection.

Description

technical field [0001] The invention relates to an electronic label encapsulation method, in particular to an electronic label encapsulation method applied to RFID dinner plates. Background technique [0002] RFID plate is a kind of tableware that can be automatically identified by implanting an electronic tag at the bottom of the plate (melamine material). It is a non-contact automatic identification technology. It automatically identifies the plate and obtains relevant data through radio frequency signals. The identification work does not require manual intervention, and it can identify multiple plates at the same time, which is fast and convenient to operate. RFID meal trays are suitable for automatic pricing terminal equipment in self-selection canteens and restaurants, and are an important part of the fast settlement system for Zhipan self-service (selection) restaurants. The smart disk system adopts the internationally accepted ISO / IEC15693 standard RFID radio frequen...

Claims

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Application Information

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IPC IPC(8): G06K19/077C09J163/00
CPCG06K19/077C09J163/00
Inventor 马新马文英王寿超袁婷婷
Owner SHANDONG SYNTHESIS ELECTRONICS TECH