Method for epitaxial growth of gallium nitride (GaN) thin film on Si substrate
An epitaxial growth and substrate technology, applied in coating, gaseous chemical plating, metal material coating process, etc., can solve the problems of difficult realization and complex growth process, improve the quality of epitaxy, simplify the growth process, and be easy to realize Effect
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[0028] refer to Figure 1-4 As shown, the method for epitaxially growing a GaN thin film on a Si substrate of the present invention adopts an MOCVD system for epitaxial growth. Its epitaxial structure is Si substrate 1, pre-coated aluminum layer 2, low-temperature AlN buffer layer 3, high-temperature AlN buffer layer 4, Al x Ga 1-xN layer 5 and GaN thin film layer 6. Among them: the low-temperature AlN buffer layer 3 is a low-temperature AlN three-dimensional nucleation layer, the high-temperature AlN buffer layer 4 is a high-temperature AlN two-dimensional nucleation layer, the AlxGa1-xN layer 5 is an AlxGa1-xN stress release layer, and the GaN film layer 6 is the final growth layer . As mentioned above, AlN is aluminum nitride, AlxGa1-xN is aluminum gallium nitride, and GaN is gallium nitride. During the growth process, TMGa (trimethylgallium) and TMAl (trimethylaluminum) are used as Ga sources respectively (Ga (gallium) atoms cleaved from trimethylgallium at high temper...
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