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Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture

A technology of mixture and copper particles, applied in the fields of copper particle mixture and its manufacture, copper particle mixture dispersion, ink containing copper particle mixture, preservation of copper particle mixture and sintering of copper particle mixture, to achieve easy formation and excellent reaction Sexual and oxidation inhibitory effects

Inactive Publication Date: 2019-12-27
KANSAI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The copper nanoparticles described in Patent Document 1 also suppress the oxidation of copper, lower the melting point, have excellent dispersibility, can be sintered at a low temperature, and can remove the protective layer when sintered at a low temperature below 150°C, and can be suitably used for conductive copper nano inks Copper nanoparticles are excellent in terms of materials, but there is still room for research on further lowering the sintering temperature

Method used

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  • Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture
  • Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture
  • Copper particle mixture and method for manufacturing same, copper particle mixture dispersion, ink containing copper particle mixture, method for storing copper particle mixture, and method for sintering copper particle mixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0168] (Modulation of Copper Nanoparticles B)

[0169] Measure ethylene glycol (30mL) into a 110mL threaded tube, add 1-amino-2-propanol (11.6mL) and copper(II) acetate anhydrate (2.73g), and dissolve it by ultrasonic treatment to prepare the copper complex. bit compound solution. Then, in the threaded tube add A football-shaped stir bar, using a magnetic rotor, was stirred at about 1000 rpm. Then, 7.3 mL of hydrazine monohydrate was added as a reducing agent to prepare a solution. The solution was stirred for 24 hours, whereby a slightly reddish dark brown copper nanoparticle-dispersed solution was obtained.

[0170] In the above reaction, the raw material solution is stirred at a high stirring speed of 1000 rpm, so it is easy to generate copper nanoparticles of a size monodispersed by the progress of the uniform reduction reaction, and it is easy to suppress the aggregation of the generated particles.

[0171] The separation of the copper nanoparticles from the solution...

Embodiment 2

[0181] A copper particle mixture was prepared in the same manner as in Example 1 except that copper fine particles A and copper nanoparticles B were measured at a mass ratio of 1:1, and an ink containing the copper particle mixture as a copper particle mixture dispersion liquid was prepared.

Embodiment 3

[0183] A copper particle mixture was prepared in the same manner as in Example 1 except that copper fine particles A and copper nanoparticles B were measured at a mass ratio of 1:3, and an ink containing the copper particle mixture as a copper particle mixture dispersion liquid was prepared.

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Abstract

The present invention provides a copper particle mixture and a method for manufacturing the same, a copper particle mixture dispersion in which the copper particle mixture is dispersed, and an ink containing the copper particle mixture, the ink containing the copper particle mixture dispersion, the copper particle mixture whereby oxidation of the copper is suppressed, and the copper particle mixture has high dispersibility and can be sintered at low temperature in a short time in a reducing atmosphere or a non-reducing atmosphere. The present invention is a copper particle mixture including copper fine particles A and copper nanoparticles B, the copper particle mixture being characterized in that the copper fine particles A have an average particle diameter of 0.1 [mu]m to 5 [mu]m and arecoated by at least one species of dicarboxylic acid selected from the group consisting of malonic acid and oxalic acid, the copper nanoparticles B comprise a center part comprising a copper single crystal and a protective layer on the periphery of the center part, the average particle diameter of the copper nanoparticles B is 1 nm to less than 100 nm, and the protective layer of the copper nanoparticles B includes at least one species selected from the group consisting of a C3-6 primary alcohol, a C3-6 secondary alcohol, and a derivative thereof.

Description

technical field [0001] The present invention relates to a copper particle mixture and a manufacturing method thereof, a dispersion liquid of the copper particle mixture, an ink containing the copper particle mixture, a preservation method of the copper particle mixture and a sintering method of the copper particle mixture. Background technique [0002] Metal nanoparticles having a diameter of approximately 2 nm to 100 nm exhibit properties different from those of bulk metals in terms of optical, magnetic, thermal, and electrical properties, and thus are expected to be used in various technical fields. For example, studies are under way to fabricate circuits composed of metal fine wiring on substrates using fine wiring printing inks containing metal nanoparticles, taking advantage of the property that the surface area increases as the particle size decreases, causing a drop in melting point. [0003] Such an ink for fine wiring printing uses a dispersion liquid containing met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F9/24B22F1/052B22F1/054B22F1/0545B22F1/102B22F1/103
CPCB22F9/24C09D11/52C09D11/037C22C1/0425C22C9/00B22F1/0545B22F1/052B22F1/103B22F1/102B22F1/054B22F2301/10
Inventor 川崎英也
Owner KANSAI UNIVERSITY