Preparation method of bakelite substrate grinding wheel drop method
A substrate and grinding wheel technology, which is applied in manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of long molding cycle, grinding wheel crushing, loss, etc. Effect
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Embodiment 1
[0048] like Figure 1-2 As shown, the bakelite matrix grinding wheel drop method pressing molding mold consists of die ring 1, abrasive layer upper pressure ring 2, abrasive layer lower bottom ring 3, matrix layer upper pressure head 4, matrix layer lower bottom plate 5, and gasket 6 (to control the drop) 1. The positioning mandrel 7 (central positioning) is composed of a cylindrical positioning mandrel.
[0049] The bakelite base grinding wheel is a small size bakelite base grinding wheel, the specific specification parameters are 12V2 / 20, 125×14×32×12×1 (outer diameter×total thickness×middle hole×abrasive layer width×straight edge thickness, mm).
[0050] The thickness of the gasket is 10mm; the thickness of the inner side of the bottom ring under the abrasive layer and the thickness of the bottom plate under the matrix layer are both 14mm; the diameter of the gasket is 98mm; the inner diameter of the bottom ring under the abrasive layer is 101mm; the outer diameter of the b...
Embodiment 2
[0057] The mold of Example 1 was used to prepare a small-sized bakelite-based grinding wheel, wherein the included angle between the lower surface of the pressure ring on the abrasive layer and the horizontal plane was 20°; the included angle between the inclined structure and the horizontal plane was 20°. The bakelite base grinding wheel is a small size bakelite base grinding wheel, the specific specification parameters are 12V2 / 20, 125×14×32×12×1 (outer diameter×total thickness×middle hole×abrasive layer width×straight edge thickness, mm).
[0058] The formulation of the abrasive layer in this embodiment is the following raw materials in parts by weight: 35 parts of phenolic resin powder, 45 parts of copper powder, 3 parts of zinc oxide, 15 parts of silicon carbide, 2 parts of molybdenum disulfide, and 2 parts of calcium oxide. The base layer adopts Sumitomo brand glass fiber reinforced bakelite powder.
[0059] The method for preparing the above-mentioned small size bakelit...
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