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Preparation method of bakelite substrate grinding wheel drop method

A substrate and grinding wheel technology, which is applied in manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of long molding cycle, grinding wheel crushing, loss, etc. Effect

Active Publication Date: 2021-01-15
江苏赛扬精工科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, most of the existing small-sized bakelite base grinding wheels are formed by semi-hot pressing the abrasive layer first, then cooling the mold and releasing the mold, then coating the resin liquid on the contact surface between the abrasive layer and the bakelite base, and finally hot pressing with the bakelite base material. However, this method has many molding steps, and the abrasive layer needs to be cooled to apply the resin liquid. Although it can ensure obvious delamination, the molding cycle is longer, and in the process of use, the abrasive layer and the matrix layer are more dependent on the resin liquid. Curing achieves bonding strength. In actual use, if the grinding wheel is not clamped tightly, the axial feed force is too large, or the temperature of the abrasive layer increases after grinding for a long time, the interface curing strength will be affected, which will cause the grinding wheel to break during high-speed operation. , the broken grinding wheel blocks fly out at high speed under the action of centrifugal force, which is easy to hurt people or other objects, causing personal injury and economic loss
[0003] Due to the cumbersome molding methods of the prior art, the appearance of the product is poor, it is impossible to avoid cross-linking between the interface between the base layer and the abrasive layer, and the effective bonding strength between the abrasive layer and the base layer cannot be guaranteed.
Based on the above situation, it cannot meet the actual production needs, so it is necessary to propose improvements

Method used

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  • Preparation method of bakelite substrate grinding wheel drop method
  • Preparation method of bakelite substrate grinding wheel drop method
  • Preparation method of bakelite substrate grinding wheel drop method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] like Figure 1-2 As shown, the bakelite matrix grinding wheel drop method pressing molding mold consists of die ring 1, abrasive layer upper pressure ring 2, abrasive layer lower bottom ring 3, matrix layer upper pressure head 4, matrix layer lower bottom plate 5, and gasket 6 (to control the drop) 1. The positioning mandrel 7 (central positioning) is composed of a cylindrical positioning mandrel.

[0049] The bakelite base grinding wheel is a small size bakelite base grinding wheel, the specific specification parameters are 12V2 / 20, 125×14×32×12×1 (outer diameter×total thickness×middle hole×abrasive layer width×straight edge thickness, mm).

[0050] The thickness of the gasket is 10mm; the thickness of the inner side of the bottom ring under the abrasive layer and the thickness of the bottom plate under the matrix layer are both 14mm; the diameter of the gasket is 98mm; the inner diameter of the bottom ring under the abrasive layer is 101mm; the outer diameter of the b...

Embodiment 2

[0057] The mold of Example 1 was used to prepare a small-sized bakelite-based grinding wheel, wherein the included angle between the lower surface of the pressure ring on the abrasive layer and the horizontal plane was 20°; the included angle between the inclined structure and the horizontal plane was 20°. The bakelite base grinding wheel is a small size bakelite base grinding wheel, the specific specification parameters are 12V2 / 20, 125×14×32×12×1 (outer diameter×total thickness×middle hole×abrasive layer width×straight edge thickness, mm).

[0058] The formulation of the abrasive layer in this embodiment is the following raw materials in parts by weight: 35 parts of phenolic resin powder, 45 parts of copper powder, 3 parts of zinc oxide, 15 parts of silicon carbide, 2 parts of molybdenum disulfide, and 2 parts of calcium oxide. The base layer adopts Sumitomo brand glass fiber reinforced bakelite powder.

[0059] The method for preparing the above-mentioned small size bakelit...

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Abstract

The invention discloses a preparation method of a bakelite base grinding wheel drop method, which is prepared by pressing and forming a mold with a bakelite base grinding wheel drop method. The problem. The mold of the invention can be hot-pressed at one time, has obvious layers, can effectively ensure the bonding strength of the substrate and the abrasive layer, shortens the molding cycle, and can ensure the overall strength and product smoothness.

Description

technical field [0001] The invention relates to a drop method pressing molding mold for a bakelite base grinding wheel, which is used for the drop method preparation of a bakelite base grinding wheel. Background technique [0002] At present, most of the existing small-sized bakelite base grinding wheels are formed by semi-hot pressing the abrasive layer first, then cooling the mold and releasing the mold, then coating the resin liquid on the contact surface between the abrasive layer and the bakelite base, and finally hot pressing with the bakelite base material. However, this method has many molding steps, and the abrasive layer needs to be cooled to apply the resin liquid. Although it can ensure obvious delamination, the molding cycle is longer, and in the process of use, the abrasive layer and the matrix layer are more dependent on the resin liquid. Curing achieves bonding strength. In actual use, if the grinding wheel is not clamped tightly, the axial feed force is too ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00
CPCB24D18/0009
Inventor 张睿涂俊群王凯平
Owner 江苏赛扬精工科技有限责任公司