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Brazing and welding method of aluminum target and copper-containing back plate

A welding method and copper backplane technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of decreased welding strength, unsuitable welding, complicated welding process, etc., and achieve the effect of improving welding strength

Active Publication Date: 2020-01-10
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Sn-Zn solder easily reacts with copper or copper alloys to produce intermetallic compounds, thereby "corroding" the copper-containing backplane, resulting in a decrease in welding strength, and the copper-containing backplane can only be used once, which cannot be used like Sn-Ag- Cu or In solder can achieve multiple reuse of copper-containing backplanes, so Sn-Zn solders are generally only used for welding between Al targets and Al backplanes, and should not be directly used between aluminum targets and copper-containing backplanes welding
[0005] CN110253103A discloses a copper-aluminum welding method, step 1: electroplating tin or nickel on the aluminum row, so that a layer of evenly distributed and adhered tin-plated layer or nickel-plated layer is formed on the surface of the aluminum row; step 2: copper row and aluminum The tin-plated or nickel-plated side of the row is fixed, and the welding torch is moved back and forth to heat the welding part evenly. When the temperature of the weldment reaches 300-400 ° C, add the welding tin wire to the welding part, so that the tin wire melts evenly and flows into the weld to ensure that the solder in the welding part Spread it flat, remove the welding torch and allow it to cool naturally to complete the welding; the welding process described in this scheme is complicated and the welding strength is low
[0006] Therefore, the current method of welding aluminum targets and copper-containing back plates still has the problem of low welding strength. Therefore, it is necessary to develop an aluminum target and copper-containing back plate with high welding strength and a copper-containing back plate that can be recycled. Welding methods still matter

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The size of the aluminum target used in this embodiment is φ300×18 mm, the size of the copper back plate is φ360×25 mm in outer dimension, and the size of the inner groove (welding groove) is φ300.5×5 mm.

[0046] The composition of the Sn-Zn solder is 90% by mass of Sn and 10% by mass of Zn; the composition of the Sn-Ag-Cu solder is 96.5% by mass of Sn %, the mass percentage of Ag is 3%, and the mass percentage of Cu is 0.5%.

[0047] Brazing welding method of aluminum target and copper back plate:

[0048] (1) Heating the aluminum target to 250° C., then placing Sn-Zn solder on the welding surface of the aluminum target, and infiltrating with a steel brush to form a solder layer on the welding surface of the aluminum target. The thickness of the solder layer is 5 microns;

[0049] (2) Heating the copper backplane to 250°C, then placing Sn-Ag-Cu solder on the soldering surface of the copper backplane, and using a steel brush to infiltrate it to form a solder layer on...

Embodiment 2

[0053] The difference between this embodiment and Example 1 is that the copper backplane is replaced with a copper alloy backplane of the same size; the material of the copper alloy backplane is C18000 copper-chromium alloy backplane; other conditions are completely different from those in Example 1. same.

[0054] The welding method described in this embodiment does not cause obvious corrosion to the welding surface of the copper alloy backplane, and the copper alloy backplane can be recycled.

Embodiment 3

[0056] The size of the aluminum target used in this embodiment is φ300×18 mm, the size of the copper back plate is φ360×25 mm in outer dimension, and the size of the inner groove (welding groove) is φ300.5×5 mm.

[0057] The composition of the Sn-Zn solder is 89% by mass of Sn and 11% by mass of Zn; the composition of the Sn-Pb-Ag solder is 65% by mass of Sn %, the mass percentage of Ag is 3.5%, and the mass percentage of Pb is 31.5%.

[0058] Brazing welding method of aluminum target and copper back plate:

[0059] (1) Heating the aluminum target to 200° C., and then placing Sn-Zn solder on the welding surface of the aluminum target, performing infiltration treatment with ultrasonic waves, and forming a solder layer on the welding surface of the aluminum target. The thickness of the solder layer is 8 microns;

[0060] (2) Heating the copper backplane to 200°C, then placing Sn-Pb-Ag solder on the welding surface of the copper backplane, and infiltrating with a steel brush to...

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Abstract

The invention relates to a brazing method for an aluminum target and a copper-containing back plate. The brazing method includes using different solders to perform an infiltration treatment on the aluminum target and the copper-containing back plate, and then combining the two. After the welding process is completed, the welding strength of the aluminum target material and the copper-containing backing plate obtained by the method of the present invention is significantly improved, and the welding strength is 70 to 100 MPa, and the welding bonding rate is also significantly improved. Recycle.

Description

technical field [0001] The invention belongs to the field of welding technology, and relates to a brazing welding method of an aluminum target material and a copper-containing back plate. Background technique [0002] Solder Bonding refers to the use of a filler metal (called solder or solder) with a melting point lower than that of the base material (material to be welded) at a temperature lower than the melting point of the base material and higher than the melting point of the solder, using liquid solder Wetting on the surface of the base metal, spreading and filling in the gap between the base metal, mutual dissolution and diffusion with the base metal, and then cooling, so that the solder solidifies and realizes the welding method between the parts; when the solder is combined, there is no need to exert pressure on the weldment , avoiding the deformation of the weldment caused by gravity, it is a simple and fast welding method. [0003] The focus of solder joint resear...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/20B23K1/19
CPCB23K1/19B23K1/203B23K1/206
Inventor 姚力军潘杰边逸军王学泽袁海军
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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