Heat radiating fin antenna array structure

Abstract

The invention relates to a heat radiating fin antenna array structure which comprises a fin-type metal heat radiating fin, a heat radiating fin metal base and a substrate. The upper surface of the substrate is connected with the heat radiating fin metal base, and the lower surface of the substrate is connected with a heat source chip. The heat radiating fin metal base is provided with a rectangular through cavity array as an antenna radiation caliber. The substrate comprises a plurality of metal layers, a dielectric layer is arranged between the metal layers, and the uppermost metal layer is provided with a rectangular hole array corresponding to the rectangular through cavity array of the heat radiating fin metal base. The dielectric layer includes a metal through hole array used for forming a substrate integrated waveguide structure. The metal through hole array effectively reduces the channel thermal resistance between the fin-type metal heat radiating fin and the heat source chip,and forms the substrate integrated waveguide structure as the feed network of the heat radiating fin antenna. Compared with the structures in the prior art, the conformal structure of the antenna andthe heat radiating fin structure is realized and the integration level of the system is improved.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a heat sink antenna array structure. Background technique [0002] With the continuous development of electronic communication technology, the application fields of miniaturized and highly integrated wireless communication systems are becoming more and more extensive. In the process of system design, in order to make full use of space resources and reduce energy loss caused by excessively long feeders, various active and passive devices including chips, front-end circuits and antennas are required to be integrated in a limited-sized package middle. At this time, although the total input power of the system is reduced, due to the reduction of the overall size, the thermal power per unit volume increases instead, which can easily cause the performance of the device to decrease, resulting in the system not working normally or even seriously damaged. . Therefore, in the actual de...

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Problems solved by technology

This method can improve the radiation efficiency of the microstrip patch antenna to a certain extent, but since the size of the heat sink base needs to be consistent with the size of the patch, when the operating frequency increases, the size of the patch decreases continuously with the shortening of the wavelength. The design space of the heat sink is greatly limited, resulting in the inability to achieve effective heat dissipation

The above problems are especially acute for mmWave antenna designs

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