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Alpha-phase GeTe wide-spectrum infrared detector and preparation method thereof

An infrared detector and wide-spectrum technology, applied in the field of optoelectronics, can solve the problems of high price, mismatched crystal lattice, and high production cost of infrared thermal imaging cameras, and achieve miniaturization and integration, low cost, and high detection rate. high effect

Inactive Publication Date: 2020-01-31
KUNMING INST OF PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the photosensitive material of the detector does not match the lattice of the back-end readout circuit, the existing infrared detector and the back-end integrated circuit are usually produced separately and integrated by flip-chip interconnection of indium columns. This production and integration method , the production cost is too high, leading to high prices of infrared thermal imaging cameras

Method used

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  • Alpha-phase GeTe wide-spectrum infrared detector and preparation method thereof
  • Alpha-phase GeTe wide-spectrum infrared detector and preparation method thereof
  • Alpha-phase GeTe wide-spectrum infrared detector and preparation method thereof

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Effect test

Embodiment 1

[0024] Embodiment 1: α-phase GeTe wide-spectrum infrared detector, from bottom to top are substrate 1 , α-phase GeTe photosensitive layer 2 and metal electrode layer 3 .

[0025] Wherein, the substrate 1 is quartz glass; the α-phase GeTe photosensitive layer 2 has a thickness of 20nm; the metal electrode layer 3 is an Al electrode with a thickness of 50nm.

[0026] The specific preparation steps of the detector are as follows:

[0027] S1, substrate cleaning: first soak the substrate in a solution mixed with ionized water, hydrogen peroxide and ammonia water at a ratio of 2:1:1, and clean at 80°C for 60 minutes. Subsequently, rinse with deionized water, and then dry with compressed air to completely remove impurities adsorbed on the surface of the substrate.

[0028] S2, sputtering of α-phase GeTe thin film layer: put the substrate in the magnetron sputtering machine, first vacuum to 10 -5 Pa, and then filled with Ar gas to keep the cavity pressure in the range of 3Pa, and t...

Embodiment 2

[0031] Embodiment 2: α-phase GeTe wide-spectrum infrared detector, from bottom to top are substrate 1 , α-phase GeTe photosensitive layer 2 and metal electrode layer 3 .

[0032] Wherein, the substrate 1 is ordinary glass; the α-phase GeTe film layer 2 has a thickness of 30 nm; the metal electrode layer 3 is an Al electrode with a thickness of 100 nm.

[0033] The specific preparation steps of the detector are as follows:

[0034] S1, substrate cleaning: first soak the substrate in a solution mixed with ionized water, hydrogen peroxide and ammonia water at a ratio of 2.5:1:1, and clean at 80°C for 50 minutes. Subsequently, rinse with deionized water, and then dry with compressed air to completely remove impurities adsorbed on the surface of the substrate.

[0035] S2, sputtering of α-phase GeTe thin film layer: put the substrate in the magnetron sputtering machine, first vacuum to 10 -5 Pa, and then filled with Ar gas to keep the cavity pressure in the range of 5Pa, and sput...

Embodiment 3

[0038] Embodiment 3: α-phase GeTe wide-spectrum infrared detector, from bottom to top are substrate 1 , α-phase GeTe photosensitive layer 2 and metal electrode layer 3 .

[0039] Among them, substrate 1 is SiO 2 ; The α-phase GeTe photosensitive layer 2 has a thickness of 60nm, and the metal electrode layer 3 is an Al electrode with a thickness of 150nm.

[0040] The specific preparation steps of the detector are as follows:

[0041] S1, substrate cleaning: first soak the substrate in a solution mixed with ionized water, hydrogen peroxide and ammonia water at a ratio of 3:1:1, and clean at 100°C for 30 minutes. Subsequently, rinse with deionized water, and then dry with compressed air to completely remove impurities adsorbed on the surface of the substrate.

[0042] S2, sputtering of α-phase GeTe thin film layer: put the substrate in the magnetron sputtering machine, first vacuum to 10 -5 Pa, and then filled with Ar gas to keep the cavity pressure in the range of 4Pa, and s...

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Abstract

The invention discloses an alpha-phase GeTe wide-spectrum infrared detector and a preparation method thereof and belongs to the technical field of photoelectrons, and particularly the technical fieldof thin-film wide-spectrum infrared detectors. The alpha-phase GeTe wide-spectrum infrared photoelectric detector comprises a substrate, an alpha-phase GeTe photosensitive layer and a metal electrodelayer which are distributed from bottom to top. The preparation process of the alpha-phase GeTe wide-spectrum infrared photoelectric detector comprises the steps of substrate cleaning, alpha-phase GeTe film sputtering, GeTe annealing and electrode evaporation. The alpha-phase GeTe wide-spectrum infrared detector has the advantages of simple process, low cost, high responsivity, high detection rateand the like, can work at room temperature, and has an important application prospect in the field of infrared detection. GeTe is used as a phase change material and becomes a key material for next-generation storage and calculation.

Description

technical field [0001] The invention belongs to the technical field of optoelectronics, in particular to a thin-film wide-spectrum infrared detector. Background technique [0002] Infrared detectors are widely used in military, electric power, industry and other fields. At present, the photosensitive materials commonly used in the preparation of infrared detectors mainly include mercury cadmium telluride, indium telluride, amorphous silicon, and vanadium oxide. However, because the photosensitive material of the detector does not match the lattice of the back-end readout circuit, the existing infrared detector and the back-end integrated circuit are usually produced separately and integrated by flip-chip interconnection of indium columns. This production and integration method , The production cost is too high, resulting in high prices of infrared thermal imaging cameras. Contents of the invention [0003] The object of the present invention is to provide a low-cost, hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/032H01L31/0392H01L31/09H01L31/18
CPCH01L31/032H01L31/0392H01L31/09H01L31/18Y02P70/50
Inventor 唐利斌赵逸群杨盛谊彭廷海舒恂
Owner KUNMING INST OF PHYSICS