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A shape memory polymer with high temperature resistance and high performance, its preparation method and application

A memory polymer, high-performance technology, applied in the field of smart materials, can solve the problems of low cross-linking density, low material ambient temperature, shape memory properties, mechanical properties and chemical stability effects, etc. Link density, improve the effect of lower application temperature

Active Publication Date: 2022-02-11
CHINA UNIV OF PETROLEUM (EAST CHINA)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, most of the polymers prepared by the mercapto-epoxy click reaction reported in the literature have a relatively high proportion of aliphatic long chains in the molecular structure, and the crosslinking density is not high, so that the ambient temperature that the material can adapt to is low.
By adding other types of modifiers, although the crosslinking density can be increased to a certain extent, the glass transition temperature T of the material can be increased. g However, due to the addition of modifiers to increase the functional groups of other properties, the shape memory properties, mechanical properties, and chemical stability of the material will be affected.

Method used

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  • A shape memory polymer with high temperature resistance and high performance, its preparation method and application
  • A shape memory polymer with high temperature resistance and high performance, its preparation method and application
  • A shape memory polymer with high temperature resistance and high performance, its preparation method and application

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Effect test

Embodiment 1

[0036] The mass of epoxy resin E51, N,N,N',N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane was 9g and 1g respectively, and the mass of thiocyanuric acid was 4.8g, Mix with 0.075 g of the catalyst 2-methylimidazole, place it under vacuum condition of -0.08 MPa and stir for 30 min. Pour the uniformly stirred mixture into a polytetrafluoroethylene mold, and place it under vacuum conditions, react at 80°C for 3h, at 120°C for 2h, and at 150°C for 1h, and after 24 hours of subsequent natural cooling treatment, high temperature resistant Epoxy resin shape memory polymer material.

Embodiment 2

[0038] Epoxy resin E51, N,N,N',N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane were 8g, 2g, thiocyanate 5.1g, and catalyst 2- Mix 0.075 g of methylimidazole and stir for 30 min under vacuum condition of -0.08 MPa. Pour the uniformly stirred mixture into a polytetrafluoroethylene mold, and place it under vacuum conditions, react at 80°C for 3h, at 120°C for 2h, and at 150°C for 1h, and after 24 hours of subsequent natural cooling treatment, high temperature resistant Epoxy resin shape memory polymer material.

Embodiment 3

[0040] 7g of epoxy resin E51, 3g of N,N,N',N'-tetraepoxypropyl-4,4'-diaminodiphenylmethane, 5.3g of trithiocyanuric acid and catalyst 2-methylimidazole 0.075g was mixed, placed under vacuum condition of -0.08MPa and stirred for 30min. Pour the uniformly stirred mixture into a polytetrafluoroethylene mold, and place it under vacuum conditions, react at 80°C for 3h, at 120°C for 2h, and at 150°C for 1h, and after 24 hours of subsequent natural cooling treatment, high temperature resistant Epoxy resin shape memory polymer material.

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Abstract

The invention discloses a shape-memory polymer with high temperature resistance and high performance, a preparation method and application thereof. Stir the epoxy resin, curing agent, modifier and catalyst evenly, react under vacuum conditions at 80°C to 150°C, and then undergo natural cooling to prepare the epoxy resin shape memory polymer. The present invention increases the glass transition temperature of the epoxy resin shape memory polymer through the introduction of the modifier, which can improve the temperature resistance and mechanical strength of the material and maintain chemical stability.

Description

technical field [0001] The invention belongs to the technical field of intelligent materials, and in particular relates to a shape-memory epoxy resin polymer with high temperature resistance and high performance, a preparation method and application thereof. Background technique [0002] The concept of click chemistry was proposed by Sharpless et al. in 2001, and it has received widespread attention because of its high efficiency, simplicity, and controllability. At present, click chemistry mainly includes three types of reactions: Cu(I)-catalyzed alkynyl-azido cycloaddition reaction (CuAAC), Diels-Alder reaction of conjugated diene and dienophile, and reaction of thiol with various functional groups. reaction. Among them, the reaction between mercapto and epoxy functional groups has gradually become one of the hotspots in the field of preparing polymer materials due to the characteristics of no by-products and mild reaction conditions. Also as a shape memory material in a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/66C08G59/24C08G59/32C08G59/38C08G59/68
CPCC08G59/66C08G59/38C08G59/3227C08G59/245C08G59/686C08G2280/00
Inventor 王彦玲汤龙皓梁雷刘斌巩锦程
Owner CHINA UNIV OF PETROLEUM (EAST CHINA)
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