Slurry for suspension plasma spraying and method for forming sprayed coating

一种等离子、悬浮液的技术，应用在金属材料涂层工艺、涂层、熔融喷镀等方向，能够解决方法产率劣化等问题，达到高抗腐蚀性的效果

Active Publication Date: 2020-02-21
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If, in the etching of a highly integrated semiconductor device, particulate matter is peeled off from the surface of the sprayed coating and falls on the wafer, this phenomenon causes deterioration in the yield of a method for manufacturing a semiconductor device

Method used

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  • Slurry for suspension plasma spraying and method for forming sprayed coating
  • Slurry for suspension plasma spraying and method for forming sprayed coating
  • Slurry for suspension plasma spraying and method for forming sprayed coating

Examples

Experimental program
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Embodiment 1 to 4 and comparative Embodiment 1 and 2

[0055] Slurries for thermal spraying shown in Table 1 including dispersion media and rare earth oxide particles were prepared. The content of the rare earth oxide particles was adjusted as shown in Table 1. The dispersants shown in Table 1 were added to the slurry in the amounts shown in Table 1, except for Example 2.

[0056] For the rare earth oxide particles, the particle sizes D10, D50, and D90, the BET specific surface area, the grain size on the crystal plane (431), and the total volume of pores having a diameter of up to 10 μm were measured by the following respective methods. In addition, for the slurry including the rare earth oxide particles, the viscosity and the sedimentation rate were measured by the following respective methods. The results are shown in Table 1.

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PUM

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Abstract

The invention relates to a slurry for suspension plasma spraying and a method for forming sprayed coating. The invention provides a slurry for use in suspension plasma spraying including a dispersionmedium and rare earth oxide particles, the rare earth oxide particles having a particle size D50 of 1.5 to 5 [mu]m and a BET specific surface area of less than 1 m2 / g, and a content of the rare earthoxide particles in the slurry being 10 to 45 wt %.

Description

technical field [0001] The present invention relates to slurries for use in suspension plasma spraying. The slurry can be used to form a spray coating suitable for parts or components placed within plasma etching equipment used in semiconductor manufacturing processes. The invention also relates to methods for forming spray coatings. Background technique [0002] In a plasma etching apparatus used in a semiconductor manufacturing method, a wafer as an object to be processed is processed in an atmosphere of halogen-based gas plasma, such as fluorine-based gas plasma and chlorine-based gas plasma. As the fluorine-based gas, SF is used 6 、CF 4 、CHF 3 , HF or NF 3 , and as chlorine gas, using Cl 2 、BCl 3 , HCl, CCl 4 or SiCl 4 . [0003] In order to manufacture parts or components exposed to highly corrosive gas plasma atmospheres in plasma etching equipment, a corrosion-resistant spray coating is usually formed on the surface of a substrate by atmospheric plasma spray...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/134C23C4/11
CPCC23C4/134C23C4/11C01F17/218C01F17/206
Inventor 岩崎凌高井康
Owner SHIN ETSU CHEM CO LTD
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