Benzoxazine modified epoxy resin insulating material and epoxy casting insulating member and preparation method thereof

A benzoxazine and epoxy resin technology, applied in plastic/resin/wax insulators, insulators, organic insulators, etc., can solve the problem that mechanical properties and insulation properties cannot meet the requirements of miniaturization of insulators, and the miniaturization of supporting insulators It can reduce the maintenance and overhaul costs of power stations, improve reliability and service life, and have excellent heat resistance performance.

Active Publication Date: 2020-02-28
PINGGAO GRP +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the limitations of epoxy resin itself, the current relatively advanced insulating materials such as the N2S series formula adopted by Japan's Toshiba generally have a bending strength of no more than 140MPa and an AC breakdown strength of no more than 33kV / mm, which makes supporting insulators miniaturized The degree is limited; the mechanical properties and insulation properties of the existing epoxy resin castables cannot meet the requirements of miniaturization of insulators

Method used

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  • Benzoxazine modified epoxy resin insulating material and epoxy casting insulating member and preparation method thereof
  • Benzoxazine modified epoxy resin insulating material and epoxy casting insulating member and preparation method thereof
  • Benzoxazine modified epoxy resin insulating material and epoxy casting insulating member and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] The benzoxazine-modified epoxy resin insulating material of this embodiment is made of a mixture of bisphenol A benzoxazine resin and epoxy resin, and the mixture of bisphenol A benzoxazine resin and epoxy resin The mass ratio is 1:4.7; the epoxy resin compound is made up of bisphenol A type epoxy resin, curing agent methyltetrahydrophthalic anhydride and A-F-3 type alumina filler, bisphenol A type epoxy resin, curing The mass ratio of methyl tetrahydrophthalic anhydride to A-F-3 alumina filler is 1:0.50:3.2. The bisphenol A type epoxy resin is CY5995.

[0045] The bisphenol A type benzoxazine resin is prepared by mixing component 1, component 2 and component 3 according to the mass ratio of 1:2.5:6.5; wherein, component 1 is benzoxazine KB4170; Component two is benzoxazine KB6100; component three is benzoxazine KB7165. Mix component 1, component 2 and component 3 in proportion in advance to prepare bisphenol A type benzoxazine resin for later use.

[0046] The epoxy...

Embodiment 2

[0055] The benzoxazine-modified epoxy resin insulating material of this embodiment is made of a mixture of bisphenol A benzoxazine resin and epoxy resin, and the mixture of bisphenol A benzoxazine resin and epoxy resin The mass ratio is 1:4.96; the epoxy resin compound is made up of bisphenol A type epoxy resin, curing agent methyltetrahydrophthalic anhydride and A-F-4 type alumina filler, bisphenol A type epoxy resin, curing The mass ratio of methyl tetrahydrophthalic anhydride to A-F-4 alumina filler is 1:0.56:3.4. Described bisphenol A type epoxy resin is EPIKOTE TM Resin 805.

[0056] The bisphenol A type benzoxazine resin is prepared by mixing component 1, component 2 and component 3 according to the mass ratio of 1:2.5:6.5; wherein, component 1 is benzoxazine KB4170; Component two is a mixture of benzoxazine KB6100 and KB6600 at a mass ratio of 1:1; component three is benzoxazine KB7170. Mix component 1, component 2 and component 3 in proportion in advance to prepare...

Embodiment 3

[0066] The benzoxazine-modified epoxy resin insulating material of this embodiment is made of a mixture of bisphenol A benzoxazine resin and epoxy resin, and the mixture of bisphenol A benzoxazine resin and epoxy resin The mass ratio is 1:4.85; the epoxy resin mixture is made up of bisphenol A type epoxy resin, curing agent methyltetrahydrophthalic anhydride and A-F-5 type alumina filler, bisphenol A type epoxy resin, curing The mass ratio of methyl tetrahydrophthalic anhydride to A-F-5 alumina filler is 1:0.52:3.3. The bisphenol A type epoxy resin is CT200M.

[0067] The bisphenol A type benzoxazine resin is prepared by mixing component 1, component 2 and component 3 according to the mass ratio of 1:2.5:6.5; wherein, component 1 is benzoxazine KB4170; Component two is benzoxazine KB6600; component three is a mixture of benzoxazine KB7200, KB7280 and KB7290 with a mass ratio of 1:1:1. Mix component 1, component 2 and component 3 in proportion in advance to prepare bisphenol ...

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Abstract

The invention relates to a benzoxazine modified epoxy resin insulating material and an epoxy casting insulating member and a preparation method thereof, wherein the insulating material is prepared from a bisphenol A type benzoxazine resin and an epoxy resin mixture according to a mass ratio of 1:(4.7-4.96), and the epoxy resin mixture comprises a bisphenol A type epoxy resin, an aliphatic anhydride curing agent and an aluminum oxide filler according to a mass ratio of 1:(0.50-0.56):(3.2-3.4). According to the invention, the insulating material has high mechanical strength and high breakdown strength, the thermoelectric aging time of the insulator exceeds 1000 h, the insulating material is suitable for occasions with high mechanical load and insulating property requirements at the same time, the reliability of the support type epoxy casting insulator for the high-voltage switch is greatly improved, and the requirement of miniaturization of the size of the insulator is met.

Description

technical field [0001] The invention belongs to the technical field of polymer insulating materials, and in particular relates to a benzoxazine-modified epoxy resin insulating material, an epoxy casting insulating part and a preparation method thereof. Background technique [0002] Epoxy cast insulators for high-voltage switchgear, such as insulating cylinders and post insulators, are used inside high-voltage switchgear to play the role of support and insulation. Higher requirements. Under the current development trend of miniaturization of high-voltage switches, the volume of insulators is required to be continuously reduced. Therefore, it is the current support to use insulating materials with high mechanical strength and high insulation performance to manufacture epoxy cast insulators and improve the reliability of high-voltage switchgear. An important direction for the development of similar insulators. [0003] For example, in the prior art, the Chinese patent whose a...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/34C08K3/22H01B3/40H01B3/30
CPCC08L63/00H01B3/40H01B3/307C08L2205/025C08L2205/035C08K2003/2227C08L61/34C08K3/22
Inventor 田浩林生军袁端鹏王亚祥吴明清杨保利侯亚峰乔会杰张红恩庞亚娟
Owner PINGGAO GRP
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