Sheet-structure integrated catalytic combustion type combustible gas sensor and preparation method thereof
A catalytic combustion type, gas sensor technology, applied in the field of sensors, can solve the problems of complex manufacturing process of detection elements and compensation elements, large sensor size, complex packaging form, etc., to increase heat transfer efficiency, improve performance indicators, and improve combustible gas catalysis The effect of burn rate
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specific Embodiment approach 1
[0055] Specific implementation mode one: the following combination Figure 1-Figure 5 This embodiment is described. The integrated catalytic combustion combustible gas sensor with chip structure described in this embodiment includes two layers of ceramic substrates, the lower ceramic substrate is provided with a signal transmission layer 1, and the upper ceramic substrate is The lower surface is provided with a resistance sensing layer 2, and the upper surface of the upper ceramic substrate is provided with a catalytic combustion layer 3;
[0056] The signal transmission layer 1 includes four lead pads, two signal transmission pads, four upper surface pads and two resistance adjustment regions; the four lead pads and two signal transmission pads are arranged on the lower ceramic sheet On the lower surface of the substrate, the four lead pads are respectively the first lead pad 1-1, the second lead pad 1-2, the third lead pad 1-3 and the fourth lead pad 1-4; A first signal tra...
specific Embodiment approach 2
[0078] Specific implementation mode two: the following combination Figure 1-Figure 5 Describe this embodiment, the preparation method of the chip structure integrated catalytic combustion combustible gas sensor described in this embodiment, the preparation method is realized based on the chip structure integrated catalytic combustion combustible gas sensor, the specific process of the preparation method is:
[0079] S1. Making a first through hole 1-13, a second through hole 1-14, a third through hole 1-15 and a fourth through hole 1-16 on the lower ceramic substrate by punching technology;
[0080] Printing a Pt-filled metal material in the first through hole 1-13, the second through hole 1-14, the third through hole 1-15 and the fourth through hole 1-16 by screen printing;
[0081] Use the screen printing method to print four lead pads, two signal transmission pads and two resistance adjustment areas on the lower surface of the lower ceramic substrate with Pt metal material...
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