Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

284results about How to "Easy to achieve mass production" patented technology

Design and manufacture technology of sensor chip for detecting magnetic field and acceleration

The invention discloses a design and manufacture technology of a sensing unit of a sensor and one or more types of sensor chips consisting of the sensing unit, in particular to one or more types of sensor chips capable of detecting the magnetic field parallel and vertical to the surface of the chip and the acceleration of an object. The invention has the advantages that the process is simple and easy, the sensitivity is high, and batched production is easily realized; the sensing unit of the sensor comprises a wafer substrate, a seed layer, a soft magnetic material layer, a conducting layer and a N-layer structure; the conducting layer is wrapped by the soft magnetic material layer; the N-layer structure is formed by combination of the soft magnetic material layer and the conducting layer; and simultaneously a bent structure is formed by N long lines in the plane (the sensing unit is a single-strip-shaped structure when N is equal to 1). The sensing unit of the sensor realizes single-axis, double-axis and three-axis magnetic field detection by different packaging forms. Simultaneously, due to the combination of the sensing unit of the sensor and a cantilever structure with magnetic mass blocks, the single-axis, double-axis and three-axis acceleration detection can be realized.
Owner:陈磊

MEMS (Micro-Electro-Mechanical Systems) processing technique-based cylindrical capacitive sensor

The invention discloses an MEMS processing technique-based cylindrical capacitive sensor. The MEMS processing technique-based cylindrical capacitive sensor comprises a rotary spindle electrode and a cylindrical fixed electrode coaxially mounted on the outside of the rotary spindle electrode; in the rotary spindle electrode, a first insulating layer, a copper spindle electrode and a second insulating layer outwardly and sequentially wrap the outer cylindrical surface of a spindle; and in the cylindrical fixed electrode, a third insulating layer, an equipotential protective ring, a fourth insulating layer and four arc-shaped electrodes equidistantly embedded in the inner circle of the fourth insulating layer are inwardly and sequentially wrapped in the cylindrical hole of an electrode base. The MEMS processing technique can be adopted to process the electrodes to be ultrathin, the complex processing and assembly process of the main conventional method in producing the cylindrical capacitive sensor can be overcome, the size of the sensor is reduced, moreover, the edge effect of the sensor can be inhibited as well, and the cylindrical capacitive sensor is suitable for monitoring the rotation error of the spindle. Due to the technique, the miniaturized cylindrical capacitive sensor can be easily produced, and the sensor can also be easily produced in batches.
Owner:ZHEJIANG UNIV

Double-foot driving piezoelectric linear motor and electric excitation mode

The invention discloses a double-foot driving piezoelectric linear motor and an electric excitation mode. The motor is composed of two stator sets, a rotor / linear guide rail, a pre-pressing guide rail, a pre-pressing spring and a base. The two stator sets are distributed symmetrically along axes, and the ends of the two stator sets are fixedly connected with the pre-pressing guide rail. Under the action of elastic restoring force generated by elastic deformation of the pre-pressing spring, the two stator sets keep in contact with the rotor / linear guide rail, so that an outage self-locking function is provided for the piezoelectric linear motor. Each of the two stator sets is composed of piezoelectric actuation units, flexible connectors and a driving foot, wherein two ends of the piezoelectric actuation units are connected with the driving feet and the base through the flexible connectors. The piezoelectric actuation units serve as modular structures, so that the whole motor structure is simple, the motor assembly efficiency is improved, and batch production is facilitated. According to the double-foot driving piezoelectric linear motor and the electric excitation mode, the rotor / linear guide rail can be driven by the two stator sets alternately to perform rectilinear motion by imposing specific excitation voltage signals on laminated piezoelectric ceramic sets in the piezoelectric actuation units.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Micro annular resonant cavity-based self-locking dual-optical-frequency comb generation system and method

The invention discloses a micro annular resonant cavity-based self-locking dual-optical-frequency comb generation system and method, belongs to the field of an optical frequency comb generation system, and specifically relates to the micro annular resonant cavity-based dual-optical-frequency comb generation system and method. The system comprises an annular resonant cavity and a dual-optical-frequency comb separation system connected with the annular resonant cavity through polarization maintaining optical fibers; the annular resonant cavity comprises an optical amplifier, an optical isolator, a first polarization controller, a micro annular resonant cavity and an optical filter which are connected through the polarization maintaining optical fibers in the cavity; the dual-optical-frequency comb separation system comprises a polarization light beam splitter and a second polarization controller which are connected through the polarization maintaining optical fibers; and the micro annular resonant cavity is a nonlinear micro annular resonant cavity with four ports. By virtue of the asymmetry of the waveguide structure, the TE mode and the TM mode of the waveguide have different indexes of refraction; two modes can be excited at the same time to generate two sets of broadband optical frequency combs with different polarization directions and multiple frequencies; and by virtue of separation and polarization rotation of the cross-polarization dual-frequency comb, the homoclitic super-high multi-frequency broadband optical frequency comb can be obtained.
Owner:XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI

Piezoelectric drive type electric spindle chip mingling detection device used for numerical control machine tool

The invention relates to the technical field of machine tool parts, in particular to a piezoelectric drive type electric spindle chip mingling detection device used for a numerical control machine tool. The piezoelectric drive type electric spindle chip mingling detection device comprises a conical clamp body used for clamping a tool handle and is characterized in that piezoelectric ceramic blockswhich can stretch out of the clamp body after being electrified are evenly distributed in the end, making contact with the tool handle, of the clamp body; the ends, being capable of stretching out ofthe clamp body, of the piezoelectric ceramic blocks are provided with electric conduction touch terminals; and the piezoelectric ceramic blocks include one movable piezoelectric ceramic block and multiple fixed piezoelectric ceramic blocks, and different electric properties are applied to the electric conduction touch terminals at the end portions of the fixed piezoelectric ceramic block and themovable piezoelectric ceramic blocks. During tool feeding of the numerical control machine tool, whether iron chips are mingled between the faces, making contact with the two end faces and two positions of a conical face of the tool handle clamp installed on the electric spindle of the numerical control machine tool, of the tool handle or not is detected, the detected alarming critical value can be preset, the numerical value is stable, and the detection accuracy, stability and reliability are improved.
Owner:YANTAI UNIV

LED light source with heat dissipation device and processing method thereof

The invention discloses an LED light source with a heat dissipation device and a processing method thereof, relating to an LED light source. The conventional LED light source has low heat dissipation efficiency, large size, heavy weight and more production procedures. The LED light source comprises a base, a plurality of LED chips arranged on the upper surface of the base and an electrode lead-out region which is convenient to connect a driving power supply. The LED light source is characterized in that a convex rib is arranged at the lower part of the base in an extension way, a heat radiation tank is arranged in the middle of the convex rib, an LED chip supporting body is arranged at the upper part of the base, and the heat dissipation device is arranged at the lower part of the base. Differing from an LED light source and heat dissipation device split structure in the prior art, the invention prevents the thermal resistance between the LED light source and the heat dissipation device from generating, greatly improves the heat dissipation efficiency because heat generated during the working process of the LED chips is directly transferred to heat dissipation fins through the base and heat resistance layers, such as an adhesion layer, and the like is not arranged between the LED light source and the heat dissipation device, improves the heat dissipation and the quality of an LED lamp, reduces the size of a lamp body for accommodating LEDs, and can ensure that the product is standardized and serialized, and has less working procedures and high processing efficiency.
Owner:ZHEJIANG MANELUX LIGHTING

Inorganic colorful electrolysis coloring technology for aluminium profile anodic oxide film

The invention discloses an inorganic colorful electrolysis coloring technology for an aluminium profile anodic oxide film, which is characterized by comprising the following working procedures of: removing oil, etching by alkaline, oxidizing an anode, carrying out intermediate treatment and electrolysis coloring, and sealing holes, wherein the intermediate treatment working procedure is set between the working procedures of oxidizing an anode and electrolysis coloring and comprises three steps: a. DC (Direct Current) section: setting a supply voltage into a direct-current output mode, cleaning the micropores of the anodic oxide film, and reducing the thickness of a barrier layer, wherein a voltage value is 8-14V, and time is 20-50 seconds; b. AC (Alternating Current) section: setting the supply voltage into an alternating-current output mode, and generating a second layer of oxide film in the anodic oxide film; c. DC section: switching the supply voltage to the direct-current output mode, generating a third layer of film on the basis of the second layer of oxide film, wherein the voltage value is 10-20V, and operation time is controlled to 60-500s. According to the inorganic colorful electrolysis coloring technology, the existing electrolysis coloring equipment can be utilized to finish the full-color colorful electrolysis coloring aluminium or aluminium alloy in short time, and the inorganic colorful electrolysis coloring technology has the advantages of low production cost and good coloring quality.
Owner:GUANGYA ALUMINUM +1

Manufacturing method of patch type LED (Light-Emitting Diode) module

InactiveCN102779923ASave packaging material and packaging process timeGood consistency of geometric featuresFinal product manufacturePrinted circuit aspectsPatch typeManufacturing line
The invention discloses a manufacturing method of a patch type LED (Light-Emitting Diode) module. The manufacturing method is characterized by comprising the following steps of: preparing materials; providing LED chips with flip chip structures, wherein one face of each LED chip is provided with a metal electrode, and the surface intervals of the metal electrodes are not smaller than 80 mum; arranging: putting the plurality of chips into a braid, wherein the metal electrodes of the LED chips are positioned at the bottom of a braid accommodating space, and the light emitting surfaces of the LED chips are positioned on the opening of the accommodating space; patching: sucking the LED chips out of the braid by using a vacuum suction nozzle, and placing onto a bonding pad of a substrate, wherein the metal electrodes are opposite to the bonding pad, and the light emitting surfaces of the LED chips face upwards; and fixing: correspondingly fixing and communicating the bonding pad and the metal electrodes. A braid loading way is directly adopted for flip chip LED chips, so that encapsulation of a single LED light source is avoided, and the encapsulating materials, encapsulating process time and production line of a single LED light source are saved.
Owner:XIAMEN G WATT LIGHTING TECHNOLOGY INC

Preparation method of porous medium composite phase change energy storage particles

ActiveCN103666380AOvercome the disadvantage of easy agglomeration and agglomerationEasy to operateHeat-exchange elementsPorous mediumForced convection
The invention discloses a preparation method of porous medium composite phase change energy storage particles. The preparation method is characterized in that: a porous mineral medium is taken as a carrier, a liquid phase change material is subjected to mixed adsorption, and is injected into a fluidized bed; cold air with a certain flowing speed in the fluidized bed is used for forced convection cooling of uncooled phase change particles, and particle dispersing is realized via impact effect between the air flow and the phase change particles. Internal phase change material holding capacity of the porous medium composite phase change energy storage particles prepared via the preparation method is relatively high; leakage is difficult to be caused under high temperatures; adsorption stability of the porous medium composite phase change energy storage particles is high; particle dispersibility is high; the surfaces of the porous medium composite phase change energy storage particles are dry; and caking is difficult to be caused. The preparation method is simple; technological processes are few; cost is low; batch production of the porous medium composite phase change energy storage particles can be realized; and the preparation method possesses engineering application value on a certain degree.
Owner:NANJING UNIV OF TECH

Surface mounting welding process for wafer-level chip

The invention discloses a surface mounting welding process for a wafer-level chip, which is characterized by comprising the following steps of: firstly, providing the wafer-level chip with a flip chip structure and placing the wafer-level chip into a temporary storage container, wherein one surface of the chip is provided with a metal electrode and the metal electrode also can comprise a part extending to the lateral surface of the chip; then providing a substrate, wherein the substrate is provided with a matchable pad and solder paste is arranged on the pad in advance in a steel mesh printing manner; sucking the chip from the temporary storage container by adopting a vacuum suction nozzle and placing the chip on the pad of the substrate; temporarily fixing the metal electrode of the chip on the substrate by utilizing the surface tension of the solder paste; and finally, communicating the pad and the metal electrode which are temporarily fixed together in a reflow soldering manner. According to the technical scheme, the post packaging process step and the cost of the wafer-level chip are saved, the competitiveness of a product is promoted, existing SMT (Surface Mounting Technology) equipment can be basically continuously used, additional hardware do not need to be greatly invested, the cost of a packaging line and the process time are avoided, and the mass production of the wafer-level chip is easy to implement.
Owner:XIAMEN RXD ELECTRONICS

Titanium alloy guide wire for surgical interventional therapy

ActiveCN103623494ALarge range of performance adjustmentsSimple structureGuide wiresGroove widthInterventional therapy
The invention discloses a titanium alloy guide wire for interventional therapy. The titanium alloy guide wire comprises a titanium alloy small-diameter thin-wall tube and a noble metal end head which is distributed at the far end of the titanium alloy small-diameter thin-wall tube; the titanium alloy small-diameter thin-wall tube is divided into a guide wire far section, a guide wire middle section and a guide wire near section from far to near; a single spiral groove I is formed in the tube wall of the guide wire far section; a single spiral groove II is formed in the tube wall of the guide wire middle section; the single spiral slot I is an uniform-pitch spiral groove; the single spiral groove II is a variable-pitch spiral groove; the groove widths of the single spiral groove I and the single spiral groove II are same; the pitch of the single spiral groove II is gradually increased from far to near, and the pitch at the far end of the single spiral groove II is equal to that of the single spiral groove I; the groove depth of the single spiral groove I and the single spiral groove II is the same as the wall thickness of the titanium alloy small-diameter thin-wall tube. The titanium alloy guide wire disclosed by the invention is simple in structure, reasonable in design, simple and convenient to machine and manufacture, good in using effect, and capable of effectively solving the problems such as a complex machining process, high cost and poor adaptability of the existing titanium alloy guide wire.
Owner:NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH

Micro-hemispherical resonator gyro structure, assembly method and wafer fixture

The invention relates to a micro-hemispherical resonator gyro structure, an assembly method and a wafer fixture. The invention discloses a micro-hemispherical resonator gyro structure wafer level assembly method, comprising the following steps: performing high temperature softening deformation machining and forming on independently manufactured glass sheets, then forming a micro-hemispherical resonant structures in the middle of each glass sheet, cutting glass sheet locating holes at the two ends of each glass sheet by adopting laser cutting, and by taking the locating holes as a benchmark, aligning multiple micro-hemispherical resonant structures which are the same and fixing the same micro-hemispherical resonant structures on the wafer fixture; and then performing operations by taking the wafer fixture as a unit, and completing subsequent processes, namely micro-hemispherical resonant structure releasing, surface metallization, fixation with a planar electrode, separation from the wafer fixture as well as cleaning, thus the micro-hemispherical resonator gyro structure driven by the planar electrode at the bottom is obtained. The micro-hemispherical resonator gyro structure waferlevel assembly method disclosed by the invention fixes and mounts multiple independently manufactured micro-hemispherical resonant structures on the same wafer fixture, a wafer level mounting operation is realized, an assembly error of the micro-hemispherical resonator gyro structure can be obviously reduced, stability and consistency of the processes as well as assembly efficiency are improved.
Owner:NAT UNIV OF DEFENSE TECH

Method capable of realizing volume production and used for preparing micron order single-dispersibility polysiloxane microspheres

The invention discloses a method capable of realizing volume production and used for preparing micron order single-dispersibility polysiloxane microspheres. The method comprises the following steps of (1) preparing a basic catalyst solution; (2) adding trialkoxysilane monomers into the basic catalyst solution (1) to prepare a seed solution; (3) then adding trialkoxysilane monomers into the seed solution obtained in the step (2) to perform a polycondensation reaction; performing filtering, washing and drying to obtain a finished product. The operation can be performed under the conditions of normal temperature, normal pressure and no atmosphere protection; the synthesis steps are simple; the operation is easy; synthesis equipment does not have special requirements; the volume production can be easily realized. No organic solvents polluting the environment are used in the reaction process; no dispersing agents, swellers, stabilizing agents, emulgators or the like are used; the types of reaction polymerization raw materials are few; the product purity is high; the yield is high; the cost is low; the size of the particle diameter of the microspheres can be effectively regulated through controlling the concentration of an initial seed solution; the distribution of the particle diameter of the obtained microspheres is uniform; the high-degree monodispersity is shown; the surface is regular; the degree of sphericity is high.
Owner:贵州正业龙腾新材料开发有限公司

S-shaped multi-pin clamped piezoelectric motor and operating mode thereof

The invention discloses an S-shaped multi-pin clamped piezoelectric motor and an operating mode thereof and belongs to the technical field of piezoelectric precision actuation. The motor consists of a stator assembly (1), a rotor assembly (2), a motion output assembly (3) and a base (4), wherein a core element of the stator assembly has an S-shaped structure formed by connecting three displacement transformation frames end to end and combining the three displacement transformation frames in a laminated way; in the three displacement transformation frames, a laminated piezoelectric stack serves as an actuated element, and each frame can output displacement in two spatially orthogonal directions; and a middle displacement transformation frame has the function of clamping and driving simultaneously during operation, and the other two displacement transformation frames only serve as clamping units. The motor can operate in two modes, namely a direct drive mode and a stepping mode, whereindeformation of the laminated piezoelectric stack can be directly controlled in the direct drive mode so as to realize accurate positioning; and quick positioning can be realized in the stepping mode.In addition, the motor has a compact and simple structure and a simple process, and is self-locked during power failure.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Method for processing metal film strainometer based on MEMS (Micro-electromechanical Systems)

The invention discloses a method for processing a metal film strainometer based on an MEMS (Micro-electromechanical Systems). According to the method, repeated polyimide spinning and processing are adopted so that a substrate and a covering layer of the strainometer are respectively formed, a sensitive grid part and an anchoring point of the strainometer are respectively formed by adopting metal stripping, wet-method corrosion and the like, and self release of the strainometer is realized by using alcohol soaking. Compared to the prior art, in the method, the sensitive grid layer material of the strainometer is directly sputtered on the substrate of the strainometer by adopting a magnetron sputtering process without using adhesives so that the performance of the strainometer is improved; by adopting the new process, the problem of lower flatness caused by air bubbles generated by manually sticking a polyimide film can be solved, thus saving time and labor; by adopting an MEMS processing process, the sensitivity, the resolution ratio and the measuring range of the strainometer are improved, and the power consumption of the strainometer is reduced; the method realizes tiny strain measurement and point strain and torsion measurement, reduces influences on tested pieces in the measuring process and improves the measurement precision; and the method is easy to realize mass production and reduces the cost of individual device.
Owner:NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products