Micro-hemispherical resonator gyro structure, assembly method and wafer fixture

A hemispherical resonant gyroscope and hemispherical resonance technology, which are applied in microstructure devices, processing microstructure devices, and microelectronic microstructure devices, etc., can solve the problems of low assembly accuracy, low assembly efficiency, poor assembly consistency, etc., and achieve assembly difficulty. Low, reduce assembly error, eliminate the effect of partial error

Inactive Publication Date: 2020-02-04
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to overcome the problems of low assembly accuracy, poor assembly consistency, and low assembly efficiency of the existing micro-hemispherical resonant gyroscope assembly technology, the present invention provides a wafer

Method used

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  • Micro-hemispherical resonator gyro structure, assembly method and wafer fixture
  • Micro-hemispherical resonator gyro structure, assembly method and wafer fixture
  • Micro-hemispherical resonator gyro structure, assembly method and wafer fixture

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0046] Example one

[0047] The wafer-level assembly method of the micro-hemispheric resonant gyroscope structure shown in FIG. 3 is suitable for the high-precision assembly of the micro-hemispheric resonant gyroscope structure driven by the bottom planar electrode, and specifically includes the following steps:

[0048] Step 1. As shown in FIG. 3(a), at least two through glass positioning holes 9 are opened on the two ends of the glass sheets 8 containing the micro-hemispheric resonant structure 1 to realize the micro-hemispheric resonant structure 1 in a circle. Positioning on the sheet clamp 10; In this embodiment, the opening of the positioning holes 9 for the glass sheet is completed by laser cutting, and the number is two, which are arranged symmetrically along the central axis of the glass sheet 8.

[0049] Step 2, as shown in Fig. 3(b), align the multiple glass sheets 8 obtained after processing in step 1 with the glass sheet positioning hole 9 as a reference to the wafer hol...

Example Embodiment

[0064] Example two

[0065] Such as figure 1 A micro-hemispheric resonant gyroscope structure shown in and 3 includes a micro-hemispheric resonant structure 1, which is fixedly connected to a planar electrode 2 through a central anchor point, and ensures that the micro-hemispheric resonant structure 1 and the wafer holder 10 While sufficient contact area is achieved, compatibility with subsequent processes is achieved. The planar electrode 2 is used for the extraction of vibration signals of the micro-hemispheric resonant gyroscope structure and is a necessary component of the micro-hemispheric resonant gyroscope structure;

[0066] There is a gap between the two ends of the micro-hemispheric resonant structure 1 and the planar electrode 2, and the planar electrode 2 is provided with grooves corresponding to the two ends of the micro-hemispheric resonant structure 1 to form a gap, which is used to realize the micro-hemispheric resonant gyro structure Electrostatic drive and capacit...

Example Embodiment

[0075] Example three

[0076] Such as figure 2 A wafer holder with a micro-hemispheric resonant structure shown in -3, comprising a holder body, the holder body is provided with a plurality of avoiding slots 3 that cooperate with the micro-hemispherical resonant structure 1, the avoiding slots 3 There are outlet grooves 4 on both sides to realize the inflow of gas and / or liquid and the outflow of waste gas and / or waste liquid that need to be used in the assembly process, so as to ensure the normal progress of the processing process;

[0077] A fixed cylinder 5 is provided at the geometric center of each avoidance groove 3, that is, a fixed cylinder 5 is correspondingly installed in one avoidance groove 3 for fixing the micro-hemispherical resonance structure 1, and the fixed cylinder 5 The height is consistent with the depth of the avoidance groove 3, which is convenient for placing the glass sheet 8 and the flat plate 7 to press the glass sheet 8;

[0078] Two clamp positioning ho...

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Abstract

The invention relates to a micro-hemispherical resonator gyro structure, an assembly method and a wafer fixture. The invention discloses a micro-hemispherical resonator gyro structure wafer level assembly method, comprising the following steps: performing high temperature softening deformation machining and forming on independently manufactured glass sheets, then forming a micro-hemispherical resonant structures in the middle of each glass sheet, cutting glass sheet locating holes at the two ends of each glass sheet by adopting laser cutting, and by taking the locating holes as a benchmark, aligning multiple micro-hemispherical resonant structures which are the same and fixing the same micro-hemispherical resonant structures on the wafer fixture; and then performing operations by taking the wafer fixture as a unit, and completing subsequent processes, namely micro-hemispherical resonant structure releasing, surface metallization, fixation with a planar electrode, separation from the wafer fixture as well as cleaning, thus the micro-hemispherical resonator gyro structure driven by the planar electrode at the bottom is obtained. The micro-hemispherical resonator gyro structure waferlevel assembly method disclosed by the invention fixes and mounts multiple independently manufactured micro-hemispherical resonant structures on the same wafer fixture, a wafer level mounting operation is realized, an assembly error of the micro-hemispherical resonator gyro structure can be obviously reduced, stability and consistency of the processes as well as assembly efficiency are improved.

Description

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Claims

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Application Information

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Owner NAT UNIV OF DEFENSE TECH
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