The invention discloses a photoetching
machine mask alignment method based on a Transform model, relates to the technical field of photoetching machines, and is used for solving the problem of inaccurate
mask alignment precision of a current photoetching
machine. The method comprises the following steps: firstly, collecting image data of a
mask and
wafer combination, and carrying out
noise removal and normalization
processing on an image; and then, calculating a dynamic coefficient of each sub-region through region division,
physical property analysis and a multi-factor fusion
algorithm, serializing the extracted
feature data and the dynamic coefficients, inputting the serialized
feature data and dynamic coefficients into a Transform model, carrying out self-attention mechanism
processing, and outputting an alignment deviation predicted value of the mask and the
wafer. And finally, dynamically adjusting the position and the angle of the mask plate by adopting a self-adaptive stepping
motor control strategy according to the deviation predicted value, and accurately compensating translation and rotation errors. According to the method, the position of the mask of the photoetching
machine can be accurately adjusted in real time, and the photoetching precision and the production efficiency are improved.