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A kind of preparation method of high thermal conductivity graphene/chopped carbon fiber composite material

A technology of chopped carbon fiber and high thermal conductivity graphite, which is applied in the field of composite materials, can solve the problems of low thermal conductivity, achieve high thermal conductivity, reduce impurity content, and prevent deformation

Active Publication Date: 2021-09-28
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, have significant anisotropic thermal conductivity for existing graphene material, promptly only have high thermal conductivity (greater than 1000W / mK) along the graphene plane and vertical In the thickness direction of its horizontal plane, the thermal conductivity is too low (less than 10W / mK), and a method for preparing a graphene / based carbon composite material with high thermal conductivity along the horizontal direction and thickness direction is provided.

Method used

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  • A kind of preparation method of high thermal conductivity graphene/chopped carbon fiber composite material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 2%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0028] The obtained composite material was placed in a graphite mold, a pressure of 0.5 MPa was applied, and the thermal amination treatment was carried out at 350° C. for 30 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 10...

Embodiment 2

[0030] The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 1%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0031] The obtained composite material was placed in a graphite mold, a pressure of 1 MPa was applied, and the thermal amination treatment was carried out at 350° C. for 40 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 1000...

Embodiment 3

[0033]The polyamic acid was diluted in DMAC to obtain a polyamic acid solution with a concentration of 5%, and then 0.5 g of reduced graphene oxide (rGO) and 0.5 g of chopped carbon fibers were weighed and dispersed in the polyamic acid solution. It was placed in an ultrasonic disperser, ultrasonicated for 2 hours to obtain a uniform dispersion. The dispersion was left to stand for 24 hours to allow the rGO and carbon fibers to settle freely, the upper liquid was removed, and the solvent DMAC was replaced by ethanol impregnation, and then the composite material was dried by supercritical to obtain a graphene / carbon fiber / polyamic acid composite material.

[0034] The obtained composite material was placed in a graphite mold, a pressure of 3 MPa was applied, and a heat amination treatment was performed at 400° C. for 15 minutes to obtain a graphene / carbon fiber / polyimide composite material. Then, under the condition of inert gas in a tube furnace, heat treatment at 1000° C. for...

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Abstract

The invention discloses a preparation method of a high thermal conductivity graphene / chopped carbon fiber composite material, which utilizes the high thermal conductivity of graphene along the in-plane direction and the high thermal conductivity of carbon fiber along the axial direction to combine a graphene layer and chopped carbon fiber in a liquid phase Deposition molding uses the bonding effect of polyimide to connect carbon fiber and graphene, and finally converts polyimide into graphene through carbonization and graphitization to prepare an all-carbon high thermal conductivity composite material. Traditional graphene materials, due to the two-dimensional structure of graphene, have ultra-high thermal conductivity along the horizontal plane, but have poor thermal conductivity along the thickness direction due to the lack of heat conduction channels. The invention utilizes the axially high heat conduction of chopped carbon fibers to build efficient heat conduction channels between graphene layers, effectively improving the high thermal performance of the material in the thickness direction, overcoming the shortcoming of poor heat conduction in the thickness direction, and preparing high-performance heat conduction Material.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and more specifically relates to a preparation method of a graphene / chopped carbon fiber composite material with high thermal conductivity, specifically a graphene / chopped carbon fiber composite material with high thermal conductivity along the thickness direction and the horizontal direction. Preparation method of carbon matrix composite material. Background technique [0002] With the rapid development of science and technology in the fields of computer, communication and aerospace, the power of electronic products is increasing and the size is getting smaller and smaller, which makes thermal management more and more difficult. Require. For example, the surface temperature of microelectronic chips must be maintained at a relatively low temperature (such as silicon devices <100°C) to ensure their high-performance operation. If there is no sufficient thermal management guarantee, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/83
CPCC04B35/83C04B2235/48C04B2235/9607
Inventor 封伟张飞冯奕钰高龙
Owner TIANJIN UNIV